SQUARE Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
IA80C152JB-PLC68I-R-01	Analog Devices	SERIAL IO/COMMUNICATION CONTROLLER, LAN	INDUSTRIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES	5.5 V		CHIP CARRIER	LDCC68,1.0SQ	4.5 V	85 Cel	-40 Cel		QUAD	5.08 mm	25.15 mm		8	16.5 MHz			25.15 mm	CMOS		5 V		UART	1.27 mm	S-PQCC-J68
AD892EJP	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES			CHIP CARRIER			70 Cel	0 Cel	TIN LEAD	QUAD	4.57 mm	16.5862 mm	ALSO REQUIRES 12V SUPPLY					16.5862 mm	CMOS		5 V			1.27 mm	S-PQCC-J44		Not Qualified	e0
AD9807JS-REEL	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	5.25 V		FLATPACK		4.75 V	70 Cel	0 Cel		QUAD	2.35 mm	14 mm						14 mm	CMOS		5 V			.8 mm	S-PQFP-G64		Not Qualified
IA8044-PLC44I-P03	Analog Devices		INDUSTRIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES		5	CHIP CARRIER	LDCC44,.7SQ		85 Cel	-40 Cel		QUAD										50 mA	5 V	Other uPs/uCs/Peripheral ICs		1.27 mm	S-PQCC-J44		Not Qualified
ADSP-21571-SWZENG	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	3.47 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		3.13 V	70 Cel	0 Cel		QUAD	1.6 mm	24 mm				NOT SPECIFIED	NOT SPECIFIED	24 mm	CMOS		3.3 V			.5 mm	S-PQFP-G176
IA82510-PLC28C-01	Analog Devices		COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES		5	CHIP CARRIER	LDCC28,.5SQ		70 Cel	0 Cel	TIN LEAD	QUAD							235			22.4 mA	5 V	Other Microprocessor ICs		1.27 mm	S-PQCC-J28	3	Not Qualified	e0
AD9805JS	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	5.25 V		FLATPACK		4.75 V	70 Cel	0 Cel		QUAD	2.35 mm	14 mm						14 mm	CMOS		5 V			.8 mm	S-PQFP-G64		Not Qualified
ADSP-SC583BBCZ-3A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm	19 mm			500 MHz	30	260	19 mm	CMOS		1.1 V		SPI; UART	.8 mm	S-PBGA-B349	3		e1
IA80152JC-PLC68I	Analog Devices		INDUSTRIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES		5	CHIP CARRIER	LDCC68,1.0SQ		85 Cel	-40 Cel	TIN LEAD	QUAD							235		CMOS	.1 mA	5 V	Other Microprocessor ICs		1.27 mm	S-PQCC-J68	3	Not Qualified	e0
ADSP-SC582BBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm	19 mm			500 MHz	30	260	19 mm	CMOS		1.1 V		SPI; UART	.8 mm	S-PBGA-B349	3		e1
ADSP-21573-BCZENG	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.47 V		GRID ARRAY, LOW PROFILE, FINE PITCH		3.13 V	70 Cel	0 Cel		BOTTOM	1.5 mm	17 mm						17 mm	CMOS		3.3 V			.8 mm	S-PBGA-B400
ADUCM331WDCPZ-RL	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	18 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3.6 V	115 Cel	-40 Cel		QUAD	1 mm	6 mm						6 mm	CMOS					.5 mm	S-XQCC-N32
IA80152JA-PLC68C	Analog Devices		COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES		5	CHIP CARRIER	LDCC68,1.0SQ		70 Cel	0 Cel	TIN LEAD	QUAD							235		CMOS	.1 mA	5 V	Other Microprocessor ICs		1.27 mm	S-PQCC-J68	3	Not Qualified	e0
ADSP-21584KBCZ-5A	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel	0 Cel		BOTTOM	1.5 mm	19 mm			500 MHz		260	19 mm	CMOS		1.1 V		SPI; UART	.8 mm	S-PBGA-B349	3
ADSP-SC582CBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	95 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm	19 mm			500 MHz	30	260	19 mm	CMOS		1.1 V		SPI; UART	.8 mm	S-PBGA-B349	3		e1
71M6545H-IGT/F	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		FLATPACK, LOW PROFILE, FINE PITCH		3 V	85 Cel	-40 Cel		QUAD	1.6 mm	10 mm				NOT SPECIFIED	NOT SPECIFIED	10 mm	CMOS		3.3 V			.5 mm	S-PQFP-G64		Not Qualified
71M6545-IGT/F	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		FLATPACK, LOW PROFILE, FINE PITCH		3 V	85 Cel	-40 Cel		QUAD	1.6 mm	10 mm				NOT SPECIFIED	NOT SPECIFIED	10 mm	CMOS		3.3 V			.5 mm	S-PQFP-G64		Not Qualified
MAX78002GXE+	Analog Devices	MICROPROCESSOR, RISC		BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.21 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,13X13,32	.9 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	12 mm				30	260	12 mm	CMOS		1.1 V			.8 mm	S-PBGA-B144	3		e1
MAX7359ETG+	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	1.8/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.13SQ,16	1.62 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	.85 mm	3.5 mm				30	260	3.5 mm	BICMOS	.06 mA	2.5 V	Parallel IO Port		.4 mm	S-XQCC-N24	1	Not Qualified	e3
DS3641B+TRL	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	25	BGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V		GRID ARRAY		3.3 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM						30	260		CMOS						S-PBGA-B25	3		e1
DS3641B+	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	25	BGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V		GRID ARRAY		3.3 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM						30	260		CMOS						S-PBGA-B25	3		e1
71M6545-IGTR/F	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		FLATPACK, LOW PROFILE, FINE PITCH		3 V	85 Cel	-40 Cel		QUAD	1.6 mm	10 mm				NOT SPECIFIED	NOT SPECIFIED	10 mm	CMOS		3.3 V			.5 mm	S-PQFP-G64		Not Qualified
MAX7359ETG+T	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.62 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	.8 mm	3.5 mm				30	260	3.5 mm	BICMOS		2.5 V			.4 mm	S-XQCC-N24	1		e3
MAX78000EXG+	Analog Devices	SoC		BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.21 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA81,9X9,32	.9 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	8 mm				30	260	8 mm	CMOS		1.1 V			.8 mm	S-PBGA-B81	3		e1
71M6545H-IGTR/F	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		FLATPACK, LOW PROFILE, FINE PITCH		3 V	85 Cel	-40 Cel		QUAD	1.6 mm	10 mm				NOT SPECIFIED	NOT SPECIFIED	10 mm	CMOS		3.3 V			.5 mm	S-PQFP-G64		Not Qualified
MAX7349ATG+T	Analog Devices	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	2.4 V	125 Cel	-40 Cel	MATTE TIN	QUAD	.8 mm	4 mm	MONITORS UP TO 64 KEYS			30	260	4 mm	BICMOS	.1 mA	3.3 V	Parallel IO Port		.5 mm	S-XQCC-N24	1	Not Qualified	e3
MAX7349ATG+	Analog Devices	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	2.4 V	125 Cel	-40 Cel	MATTE TIN	QUAD	.8 mm	4 mm	MONITORS UP TO 64 KEYS			30	260	4 mm	BICMOS	.1 mA	3.3 V	Parallel IO Port		.5 mm	S-XQCC-N24	1	Not Qualified	e3
DS2476Q+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	6	HVSON	SQUARE	PLASTIC/EPOXY	YES	3.63 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.12,37	2.97 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	.8 mm	3 mm				30	260	3 mm	CMOS		3.3 V			.95 mm	S-PDSO-N6	1		e3
DS2476Q+U	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	6	HVSON	SQUARE	PLASTIC/EPOXY	YES	3.63 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.12,37	2.97 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	.8 mm	3 mm				30	260	3 mm	CMOS		3.3 V			.95 mm	S-PDSO-N6	1		e3
DS2477Q+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	6	HVSON	SQUARE	PLASTIC/EPOXY	YES	3.63 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.12,37	2.97 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	.8 mm	3 mm				30	260	3 mm	CMOS		3.3 V			.95 mm	S-PDSO-N6	1		e3
DS2476BQ+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	6	HVSON	SQUARE	PLASTIC/EPOXY	YES	3.63 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.12,37	2.2 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	.8 mm	3 mm				30	260	3 mm	CMOS		3.3 V			.95 mm	S-PDSO-N6	1		e3
DS28C36BQ+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	6	HVSON	SQUARE	PLASTIC/EPOXY	YES	3.63 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.12,38	2.2 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	.8 mm	3 mm				30	260	3 mm	CMOS		3.3 V			.95 mm	S-PDSO-N6	1		e3
DS8007A-EAG+	Analog Devices	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	48	LQFP	SQUARE	PLASTIC/EPOXY	YES	6 V	3.3	FLATPACK, LOW PROFILE	QFP48,.35SQ,20	2.7 V	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	1.6 mm	7 mm	AVAILABLE IN 0.5 PITCH ALSO			30	260	7 mm	CMOS	325 mA	3.3 V	Other Microprocessor ICs		.8 mm	S-PQFP-G48	1	Not Qualified	e3
DS8007A-EAG+T	Analog Devices	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	48	LQFP	SQUARE	PLASTIC/EPOXY	YES	6 V		FLATPACK, LOW PROFILE		2.7 V	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	1.6 mm	7 mm	AVAILABLE IN 0.5 PITCH ALSO			30	260	7 mm	CMOS		3.3 V			.8 mm	S-PQFP-G48	1		e3
DS28C36Q+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	6	HVSON	SQUARE	PLASTIC/EPOXY	YES	3.63 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.12,38	2.97 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	.8 mm	3 mm				30	260	3 mm	CMOS		3.3 V			.95 mm	S-PDSO-N6	1		e3
DS28E38Q+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	6	HVSON	SQUARE	UNSPECIFIED	YES	3.63 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.12,37	2.97 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	.8 mm	3 mm				30	260	3 mm	CMOS		3.3 V			.95 mm	S-XDSO-N6	1		e3
DS28E84Q+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR	COMMERCIAL	NO LEAD	6	HVSON	SQUARE	UNSPECIFIED	YES	3.63 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.12,38	2.97 V	50 Cel	0 Cel	Matte Tin (Sn) - annealed	DUAL	.8 mm	3 mm				30	260	3 mm	CMOS		3.3 V			.95 mm	S-XDSO-N6	1		e3
DS28S60Q+	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	12	HVSON	SQUARE	UNSPECIFIED	YES	3.63 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC12,.12,20	1.62 V	105 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	.8 mm	3 mm				30	260	3 mm	CMOS		3.3 V			.5 mm	S-XDSO-N12	1		e3
DS28E39Q+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	6	HVSON	SQUARE	UNSPECIFIED	YES	3.63 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.12,38	2.97 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	.8 mm	3 mm				30	260	3 mm	CMOS		3.3 V			.95 mm	S-XDSO-N6	1		e3
DS28E83Q+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR	COMMERCIAL	NO LEAD	6	HVSON	SQUARE	PLASTIC/EPOXY	YES	3.63 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.12,38	2.97 V	50 Cel	0 Cel	Matte Tin (Sn) - annealed	DUAL	.8 mm	3 mm				30	260	3 mm	CMOS		3.3 V			.95 mm	S-PDSO-N6	1		e3
LC898113	Onsemi	MICROPROCESSOR CIRCUIT	OTHER	BALL	49	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.7 V	85 Cel	-30 Cel		BOTTOM	.8 mm	4 mm						4 mm	CMOS		3.3 V			.5 mm	S-PBGA-B49
LC898113RA-WH	Onsemi	MICROPROCESSOR CIRCUIT	OTHER	BUTT	49	VFLGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.7 V	85 Cel	-30 Cel		BOTTOM	.8 mm	4 mm	ALSO REQIRIES 1.8 V SUPPLY; SEATED HGT-NOM					4 mm	CMOS		3.3 V			.5 mm	S-PBGA-B49
NCS36510MNTXG	Onsemi	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2 V	85 Cel	-40 Cel	MATTE TIN	QUAD	1 mm	6 mm				30	260	6 mm	CMOS		3 V			.5 mm	S-XQCC-N40	3		e3
MT9S311	Onsemi	MICROPROCESSOR CIRCUIT		BALL	137	BGA	SQUARE	PLASTIC/EPOXY	YES	1.95 V		GRID ARRAY	BGA137(UNSPEC)	1.7 V				BOTTOM					54 MHz				CMOS						S-PBGA-B137
NLSF2500MN1R2G	Onsemi	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.5 V	85 Cel	-40 Cel	TIN	QUAD	1 mm	3 mm					260	3 mm	CMOS		1.8 V			.5 mm	S-XQCC-N16	1	Not Qualified	e3
LC898113-TBM-H	Onsemi	MICROPROCESSOR CIRCUIT	OTHER	BUTT	49	VFLGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.7 V	85 Cel	-30 Cel		BOTTOM	.8 mm	4 mm	ALSO REQIRIES 1.8 V SUPPLY; SEATED HGT-NOM			30	260	4 mm	CMOS		3.3 V			.5 mm	S-PBGA-B49	4
LC77700B	Onsemi			BALL	456	BGA	SQUARE	PLASTIC/EPOXY	YES		2.5,3.3	GRID ARRAY	BGA456,26X26,40					BOTTOM												Other Microprocessor ICs		1 mm	S-PBGA-B456		Not Qualified
AX8052F151-2-TX30	Onsemi	SYSTEM ON CHIP	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2X.28,20	2.2 V	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	1 mm	5 mm					260	7 mm	CMOS		3 V			.5 mm	R-PQCC-N40	1		e4

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.