Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Information Access Method | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | No. of Bits | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Interrupt Capability | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Ultraviolet Erasable | Terminal Position | DMA Channels | No. of Ports | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | ROM Bits Size | No. of Timers | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Minimum Time | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | Volatile | JESD-609 Code | Maximum Standby Current | On Chip Program ROM Width | No. of I/O Lines | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Qualcomm |
MICROPROCESSOR CIRCUIT |
BALL |
BGA |
UNSPECIFIED |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
BOTTOM |
CMOS |
X-PBGA-B |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Allwinner Technology |
MICROPROCESSOR CIRCUIT |
GULL WING |
176 |
HQFP |
UNSPECIFIED |
PLASTIC/EPOXY |
YES |
FLATPACK, HEAT SINK/SLUG |
QUAD |
CMOS |
X-PQFP-G176 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
UNSPECIFIED |
UNSPECIFIED |
UNSPECIFIED |
5.5 V |
4.5 V |
70 Cel |
0 Cel |
TIN |
UNSPECIFIED |
40 |
260 |
CMOS |
5 V |
3 |
e3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Western Digital |
MICROPROCESSOR CIRCUIT |
NO LEAD |
DIE |
UNSPECIFIED |
UNSPECIFIED |
YES |
UNCASED CHIP |
UPPER |
AVAILABLE IN EUROPE, MIDDLE EAST, AFRICA, ASIA-PACIFIC AND LATIN AMERICA |
NOT SPECIFIED |
NOT SPECIFIED |
CMOS |
X-XUUC-N |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Western Digital |
MICROPROCESSOR CIRCUIT |
NO LEAD |
DIE |
UNSPECIFIED |
UNSPECIFIED |
YES |
UNCASED CHIP |
UPPER |
AVAILABLE IN EUROPE, MIDDLE EAST, AFRICA, ASIA-PACIFIC AND LATIN AMERICA |
NOT SPECIFIED |
NOT SPECIFIED |
CMOS |
X-XUUC-N |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Qualcomm |
MICROPROCESSOR CIRCUIT |
BALL |
BGA |
UNSPECIFIED |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
BOTTOM |
CMOS |
X-PBGA-B |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Advanced Micro Devices |
MICROPROCESSOR CIRCUIT |
UNSPECIFIED |
UNSPECIFIED |
CMOS |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Advanced Micro Devices |
MICROPROCESSOR CIRCUIT |
UNSPECIFIED |
UNSPECIFIED |
CMOS |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
AUTOMOTIVE |
BALL |
760 |
BGA |
UNSPECIFIED |
PLASTIC/EPOXY |
YES |
AEC-Q100 |
GRID ARRAY |
TIN SILVER COPPER |
BOTTOM |
30 |
250 |
CMOS |
X-PBGA-B760 |
3 |
1500 rpm |
e1 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
CRYPTOGRAPHIC AUTHENTICATOR |
NO LEAD |
DIE |
UNSPECIFIED |
UNSPECIFIED |
YES |
3.63 V |
UNCASED CHIP |
2.97 V |
85 Cel |
-40 Cel |
UPPER |
CMOS |
3.3 V |
X-XUUC-N |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
CRYPTOGRAPHIC AUTHENTICATOR |
NO LEAD |
DIE |
UNSPECIFIED |
UNSPECIFIED |
YES |
UNCASED CHIP |
85 Cel |
-40 Cel |
UPPER |
NOT SPECIFIED |
NOT SPECIFIED |
CMOS |
X-XUUC-N |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
MICROPROCESSOR CIRCUIT |
GULL WING |
128 |
QFP |
UNSPECIFIED |
PLASTIC/EPOXY |
YES |
FLATPACK |
NICKEL PALLADIUM GOLD |
QUAD |
30 |
245 |
CMOS |
X-PQFP-G128 |
3 |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
MICROPROCESSOR CIRCUIT |
GULL WING |
128 |
QFP |
UNSPECIFIED |
PLASTIC/EPOXY |
YES |
FLATPACK |
NICKEL PALLADIUM GOLD |
QUAD |
30 |
245 |
CMOS |
X-PQFP-G128 |
3 |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
UNSPECIFIED |
UNSPECIFIED |
UNSPECIFIED |
NO |
5.25 V |
MICROELECTRONIC ASSEMBLY |
4.75 V |
50 Cel |
0 Cel |
UNSPECIFIED |
CMOS |
5 V |
X-XXMA-X |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
MICROPROCESSOR CIRCUIT |
GULL WING |
128 |
QFP |
UNSPECIFIED |
PLASTIC/EPOXY |
YES |
FLATPACK |
NICKEL PALLADIUM GOLD |
QUAD |
30 |
245 |
CMOS |
X-PQFP-G128 |
3 |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
MICROPROCESSOR CIRCUIT |
GULL WING |
128 |
QFP |
UNSPECIFIED |
PLASTIC/EPOXY |
YES |
FLATPACK |
QUAD |
NOT SPECIFIED |
NOT SPECIFIED |
CMOS |
X-PQFP-G128 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
MICROPROCESSOR CIRCUIT |
GULL WING |
128 |
QFP |
UNSPECIFIED |
PLASTIC/EPOXY |
YES |
FLATPACK |
QUAD |
NOT SPECIFIED |
NOT SPECIFIED |
CMOS |
X-PQFP-G128 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
UNSPECIFIED |
UNSPECIFIED |
UNSPECIFIED |
NO |
5.25 V |
MICROELECTRONIC ASSEMBLY |
4.75 V |
50 Cel |
0 Cel |
UNSPECIFIED |
CMOS |
5 V |
X-XXMA-X |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
MICROPROCESSOR CIRCUIT |
GULL WING |
128 |
QFP |
UNSPECIFIED |
PLASTIC/EPOXY |
YES |
FLATPACK |
QUAD |
NOT SPECIFIED |
NOT SPECIFIED |
CMOS |
X-PQFP-G128 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
MICROPROCESSOR CIRCUIT |
BALL |
416 |
BGA |
UNSPECIFIED |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
TIN SILVER COPPER |
BOTTOM |
30 |
250 |
CMOS |
X-PBGA-B416 |
3 |
e1 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
MICROPROCESSOR CIRCUIT |
BALL |
104 |
BGA |
UNSPECIFIED |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
BOTTOM |
NOT SPECIFIED |
NOT SPECIFIED |
CMOS |
X-PBGA-B104 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
MICROPROCESSOR CIRCUIT |
OTHER |
BALL |
104 |
BGA |
UNSPECIFIED |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
70 Cel |
-25 Cel |
TIN SILVER COPPER NICKEL |
BOTTOM |
260 |
CMOS |
X-PBGA-B104 |
3 |
e2 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR CIRCUIT |
OTHER |
UNSPECIFIED |
1 |
UNSPECIFIED |
UNSPECIFIED |
NO |
1.98 V |
1.8/5 |
MICROELECTRONIC ASSEMBLY |
MODULE(UNSPEC) |
1.62 V |
85 Cel |
-25 Cel |
UNSPECIFIED |
ALSO OPERATES AT 3V, 5V SUPPLY |
CMOS |
1.8 V |
Other Microprocessor ICs |
X-XXMA-X |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR CIRCUIT |
OTHER |
UNSPECIFIED |
3 |
UNSPECIFIED |
UNSPECIFIED |
NO |
1.98 V |
1.8/5 |
MICROELECTRONIC ASSEMBLY |
MODULE(UNSPEC) |
1.62 V |
85 Cel |
-25 Cel |
UNSPECIFIED |
ALSO OPERATES AT 3V, 5V SUPPLY |
CMOS |
1.8 V |
Other Microprocessor ICs |
X-XXMA-X |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR CIRCUIT |
OTHER |
NO LEAD |
QCCN |
UNSPECIFIED |
UNSPECIFIED |
5.5 V |
CHIP CARRIER |
4.5 V |
85 Cel |
-25 Cel |
UPPER |
ALSO OPERATES AT 1.62 V |
CMOS |
5 V |
X-XUCC-N |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR CIRCUIT |
OTHER |
UNSPECIFIED |
3 |
UNSPECIFIED |
UNSPECIFIED |
NO |
1.98 V |
1.8/5 |
MICROELECTRONIC ASSEMBLY |
MODULE(UNSPEC) |
1.62 V |
85 Cel |
-25 Cel |
PALLADIUM |
UNSPECIFIED |
ALSO OPERATES AT 3V, 5V SUPPLY |
CMOS |
1.8 V |
Other Microprocessor ICs |
X-XXMA-X |
Not Qualified |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR CIRCUIT |
OTHER |
NO LEAD |
8 |
DIE |
UNSPECIFIED |
UNSPECIFIED |
YES |
5.5 V |
UNCASED CHIP |
2.7 V |
85 Cel |
-25 Cel |
UPPER |
CMOS |
X-XUUC-N8 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR CIRCUIT |
OTHER |
NO LEAD |
8 |
UNSPECIFIED |
UNSPECIFIED |
YES |
5.5 V |
UNCASED CHIP |
1.62 V |
85 Cel |
-25 Cel |
UPPER |
0 |
10 MHz |
CMOS |
1.8 V |
UART |
X-XUUC-N8 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR CIRCUIT |
OTHER |
NO LEAD |
8 |
DIE |
UNSPECIFIED |
UNSPECIFIED |
YES |
5.5 V |
UNCASED CHIP |
2.7 V |
85 Cel |
-25 Cel |
UPPER |
CMOS |
X-XUUC-N8 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR CIRCUIT |
OTHER |
NO LEAD |
DIE |
UNSPECIFIED |
UNSPECIFIED |
YES |
1.98 V |
UNCASED CHIP |
1.62 V |
85 Cel |
-25 Cel |
UPPER |
CMOS |
1.8 V |
X-XUUC-N |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR CIRCUIT |
OTHER |
UNSPECIFIED |
UNSPECIFIED |
UNSPECIFIED |
NO |
1.98 V |
MICROELECTRONIC ASSEMBLY |
1.62 V |
85 Cel |
-25 Cel |
UNSPECIFIED |
CMOS |
1.8 V |
X-XXMA-X |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR CIRCUIT |
OTHER |
UNSPECIFIED |
3 |
UNSPECIFIED |
UNSPECIFIED |
NO |
1.98 V |
1.8/5 |
MICROELECTRONIC ASSEMBLY |
MODULE(UNSPEC) |
1.62 V |
85 Cel |
-25 Cel |
UNSPECIFIED |
ALSO OPERATES AT 3V, 5V SUPPLY |
CMOS |
1.8 V |
Other Microprocessor ICs |
X-XXMA-X |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR CIRCUIT |
OTHER |
NO LEAD |
DIE |
UNSPECIFIED |
UNSPECIFIED |
YES |
1.98 V |
UNCASED CHIP |
1.62 V |
85 Cel |
-25 Cel |
UPPER |
IT ALSO OPERATES WITH 3V AND 5V SUPPLY |
CMOS |
1.8 V |
X-XUUC-N |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR CIRCUIT |
OTHER |
UNSPECIFIED |
3 |
UNSPECIFIED |
UNSPECIFIED |
NO |
1.98 V |
1.8/5 |
MICROELECTRONIC ASSEMBLY |
MODULE(UNSPEC) |
1.62 V |
85 Cel |
-25 Cel |
UNSPECIFIED |
ALSO OPERATES AT 3V, 5V SUPPLY |
CMOS |
1.8 V |
Other Microprocessor ICs |
X-XXMA-X |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR CIRCUIT |
OTHER |
NO LEAD |
8 |
DIE |
UNSPECIFIED |
UNSPECIFIED |
YES |
5.5 V |
UNCASED CHIP |
2.7 V |
85 Cel |
-25 Cel |
UPPER |
CMOS |
X-XUUC-N8 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR CIRCUIT |
OTHER |
NO LEAD |
DIE |
UNSPECIFIED |
UNSPECIFIED |
YES |
1.98 V |
UNCASED CHIP |
1.62 V |
85 Cel |
-25 Cel |
UPPER |
IT ALSO OPERATES WITH 3V AND 5V SUPPLY |
CMOS |
1.8 V |
X-XUUC-N |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR CIRCUIT |
OTHER |
NO LEAD |
DIE |
UNSPECIFIED |
UNSPECIFIED |
YES |
1.98 V |
UNCASED CHIP |
1.62 V |
85 Cel |
-25 Cel |
UPPER |
CMOS |
1.8 V |
X-XUUC-N |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR CIRCUIT |
OTHER |
UNSPECIFIED |
3 |
UNSPECIFIED |
UNSPECIFIED |
NO |
1.98 V |
1.8/5 |
MICROELECTRONIC ASSEMBLY |
MODULE(UNSPEC) |
1.62 V |
85 Cel |
-25 Cel |
PALLADIUM |
UNSPECIFIED |
ALSO OPERATES AT 3V, 5V SUPPLY |
CMOS |
1.8 V |
Other Microprocessor ICs |
X-XXMA-X |
Not Qualified |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR CIRCUIT |
OTHER |
UNSPECIFIED |
UNSPECIFIED |
UNSPECIFIED |
NO |
1.98 V |
1.8/5 |
MICROELECTRONIC ASSEMBLY |
MODULE(UNSPEC) |
1.62 V |
85 Cel |
-25 Cel |
UNSPECIFIED |
CMOS |
1.8 V |
Other Microprocessor ICs |
X-XXMA-X |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR CIRCUIT |
OTHER |
NO LEAD |
8 |
UNSPECIFIED |
UNSPECIFIED |
YES |
5.5 V |
MICROELECTRONIC ASSEMBLY |
4.5 V |
85 Cel |
-25 Cel |
PALLADIUM |
UNSPECIFIED |
ALSO OPERATES AT 1.62 V |
CMOS |
5 V |
X-XXMA-N8 |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR CIRCUIT |
OTHER |
UNSPECIFIED |
3 |
UNSPECIFIED |
UNSPECIFIED |
NO |
1.98 V |
1.8/5 |
MICROELECTRONIC ASSEMBLY |
MODULE(UNSPEC) |
1.62 V |
85 Cel |
-25 Cel |
PALLADIUM |
UNSPECIFIED |
ALSO OPERATES AT 3V, 5V SUPPLY |
CMOS |
1.8 V |
Other Microprocessor ICs |
X-XXMA-X |
Not Qualified |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR CIRCUIT |
OTHER |
UNSPECIFIED |
3 |
UNSPECIFIED |
UNSPECIFIED |
NO |
1.98 V |
1.8/5 |
MICROELECTRONIC ASSEMBLY |
MODULE(UNSPEC) |
1.62 V |
85 Cel |
-25 Cel |
UNSPECIFIED |
ALSO OPERATES AT 3V, 5V SUPPLY |
CMOS |
1.8 V |
Other Microprocessor ICs |
X-XXMA-X |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR CIRCUIT |
OTHER |
NO LEAD |
DIE |
UNSPECIFIED |
UNSPECIFIED |
YES |
1.98 V |
UNCASED CHIP |
1.62 V |
85 Cel |
-25 Cel |
UPPER |
IT ALSO OPERATES WITH 3V AND 5V SUPPLY |
CMOS |
1.8 V |
X-XUUC-N |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR CIRCUIT |
OTHER |
NO LEAD |
UNSPECIFIED |
UNSPECIFIED |
YES |
5.5 V |
UNCASED CHIP |
1.62 V |
85 Cel |
-25 Cel |
UPPER |
0 |
10 MHz |
CMOS |
1.8 V |
UART |
X-XUUC-N |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR CIRCUIT |
OTHER |
UNSPECIFIED |
3 |
UNSPECIFIED |
UNSPECIFIED |
NO |
1.98 V |
1.8/5 |
MICROELECTRONIC ASSEMBLY |
MODULE(UNSPEC) |
1.62 V |
85 Cel |
-25 Cel |
UNSPECIFIED |
ALSO OPERATES AT 3V, 5V SUPPLY |
CMOS |
1.8 V |
Other Microprocessor ICs |
X-XXMA-X |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR CIRCUIT |
OTHER |
NO LEAD |
8 |
UNSPECIFIED |
UNSPECIFIED |
YES |
5.5 V |
UNCASED CHIP |
1.62 V |
85 Cel |
-25 Cel |
UPPER |
0 |
10 MHz |
CMOS |
1.8 V |
UART |
X-XUUC-N8 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR CIRCUIT |
OTHER |
NO LEAD |
8 |
UNSPECIFIED |
UNSPECIFIED |
YES |
5.5 V |
MICROELECTRONIC ASSEMBLY |
4.5 V |
85 Cel |
-25 Cel |
UNSPECIFIED |
ALSO OPERATES AT 1.62 V |
CMOS |
5 V |
X-XXMA-N8 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR CIRCUIT |
OTHER |
NO LEAD |
8 |
UNSPECIFIED |
UNSPECIFIED |
YES |
5.5 V |
UNCASED CHIP |
1.62 V |
85 Cel |
-25 Cel |
UPPER |
0 |
10 MHz |
CMOS |
1.8 V |
UART |
X-XUUC-N8 |
Not Qualified |
Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.
Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.
Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.
Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.