PROGRAMMABLE SoC Other Function uPs,uCs & Peripheral ICs 1,173

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Ultraviolet Erasable	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	ROM Bits Size	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
CY8C3866AXI-039	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V		2/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.71 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	N	QUAD	1.6 mm	14 mm		40	260	14 mm	65536 Bits	CMOS	3.3 V	Other uPs/uCs/Peripheral ICs	.5 mm	S-PQFP-G100	3	Not Qualified	e4
CY8C3866AXI-039T	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V		2/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.71 V	85 Cel	-40 Cel	PURE TIN	N	QUAD	1.6 mm	14 mm				14 mm	524288 Bits	CMOS	3.3 V	Other uPs/uCs/Peripheral ICs	.5 mm	S-PQFP-G100	3	Not Qualified
CY8C3866AXI-040T	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V		2/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.71 V	85 Cel	-40 Cel	PURE TIN	N	QUAD	1.6 mm	14 mm				14 mm	65536 Bits	CMOS	3.3 V	Other uPs/uCs/Peripheral ICs	.5 mm	S-PQFP-G100	3	Not Qualified
CY8C3866AXI-040	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V		2/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.71 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	N	QUAD	1.6 mm	14 mm		40	260	14 mm	65536 Bits	CMOS	3.3 V	Other uPs/uCs/Peripheral ICs	.5 mm	S-PQFP-G100	3	Not Qualified	e4
CY8C4146LQI-S422	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL															PURE TIN															3
CY8C21434-24LTXI	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	5.25 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	4.75 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1 mm	5 mm	ALSO OPERATES AT 2.7V AND 3.3V SUPPLY	40	260	5 mm		CMOS	5 V		.5 mm	S-XQCC-N32	3	Not Qualified	e4
CY8C21434-24LTXIT	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	5.25 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	4.75 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1 mm	5 mm	ALSO OPERATES AT 2.7V AND 3.3V SUPPLY	40	260	5 mm		CMOS	5 V		.5 mm	S-XQCC-N32	3		e4
CY8C4146LQI-S422T	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL															PURE TIN															3
CY8C4248LQI-BL583	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL															PURE TIN															3
CY8C4248LQI-BL553	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL															PURE TIN						30	260								3
CY8C6347BZI-BLD53	Infineon Technologies	PROGRAMMABLE SoC																TIN SILVER COPPER															3		e1
CY8C21434-24LQXIT	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	5.25 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	4.75 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1 mm	5 mm	ALSO OPERATES AT 2.7V AND 3.3V SUPPLY	40	260	5 mm		CMOS	5 V		.5 mm	S-XQCC-N32	3	Not Qualified	e4
CY8C4247AZS-M485	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.89 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.71 V	105 Cel	-40 Cel			QUAD	1.6 mm	10 mm				10 mm		CMOS	1.8 V		.5 mm	S-PQFP-G64	3
CY8C6247BZI-D54	Infineon Technologies	PROGRAMMABLE SoC		BALL	124	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA124,13X13,25	1.7 V	85 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1 mm	9 mm				9 mm		CMOS	1.8 V		.65 mm	S-PBGA-B124	3		e1
CY8C4247LQI-BL483	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL															NICKEL PALLADIUM GOLD						30	260								3		e4
CY8C6136BZI-F34	Infineon Technologies	PROGRAMMABLE SoC		BALL	124	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA124,13X13,25	1.7 V	85 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1 mm	9 mm				9 mm		CMOS	1.8 V		.65 mm	S-PBGA-B124	3		e1
CY8C4248LQI-BL573	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL															PURE TIN															3
CY8C6247BZI-D34	Infineon Technologies	PROGRAMMABLE SoC		BALL	124	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA124,13X13,25	1.7 V	85 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1 mm	9 mm				9 mm		CMOS	1.8 V		.65 mm	S-PBGA-B124	3		e1
CY8C4146LQI-S432T	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL															PURE TIN															3
XCZU5EG-1SFVC784I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY	BGA784,28X28,32	.825 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	3.32 mm	23 mm		30	250	23 mm		CMOS	.85 V		.8 mm	R-PBGA-B784	4		e1
CY8C21434-24LFXI	Cypress Semiconductor	PROGRAMMABLE SoC	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	5.25 V		2.5/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	4.75 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD		QUAD	.93 mm	5 mm	ALSO OPERATES AT 2.7V AND 3.3V SUPPLY	40	260	5 mm		CMOS	5 V	Microcontrollers	.5 mm	S-XQCC-N32	3	Not Qualified	e4
CY8C6316BZI-BLF03	Infineon Technologies	PROGRAMMABLE SoC																TIN SILVER COPPER															3		e1
CY8C21434-24LFXIT	Cypress Semiconductor	PROGRAMMABLE SoC	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	5.25 V		2.5/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	4.75 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD		QUAD	.93 mm	5 mm	ALSO OPERATES AT 2.7V AND 3.3V SUPPLY	40	260	5 mm		CMOS	5 V	Microcontrollers	.5 mm	S-XQCC-N32	3	Not Qualified	e4
CY8C21434-24LKXI	Cypress Semiconductor	PROGRAMMABLE SoC	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	5.25 V		2.5/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	4.75 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD		QUAD	.6 mm	5 mm	ALSO OPERATES AT 2.7V AND 3.3V SUPPLY	40	260	5 mm		CMOS	5 V	Microcontrollers	.5 mm	S-XQCC-N32	3	Not Qualified	e4
CY8C21434-24LKXIT	Cypress Semiconductor	PROGRAMMABLE SoC	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	5.25 V		2.5/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	4.75 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD		QUAD	.6 mm	5 mm	ALSO OPERATES AT 2.7V AND 3.3V SUPPLY	40	260	5 mm		CMOS	5 V	Microcontrollers	.5 mm	S-XQCC-N32	3	Not Qualified	e4
MPFS250T-FCSG536I	Microchip Technology	PROGRAMMABLE SoC		BALL	536	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA536,30X30,20	.97 V	100 Cel	-40 Cel			BOTTOM	1.4 mm	16 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY			16 mm		CMOS	1 V		.5 mm	S-PBGA-B536
CY8C4248LQI-BL543	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL															PURE TIN															3
XCZU3EG-1SBVA484E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER		BOTTOM								CMOS	.85 V			R-PBGA-B484	4		e1
CY8C4146LQI-S432	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL															PURE TIN															3
XCZU2EG-1SBVA484I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM								CMOS	.85 V			R-PBGA-B484	4		e1
XCZU25DR-1FFVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM				30	245			CMOS	.85 V			R-PBGA-B1156	4		e1
XCZU25DR-L1FFVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY		.698 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	30	245			CMOS	.72 V			R-PBGA-B1156	4		e1
XCZU25DR-2FFVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM				30	245			CMOS	.85 V			R-PBGA-B1156	4		e1
XCZU25DR-2FFVE1156E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER		BOTTOM				30	245			CMOS	.85 V			R-PBGA-B1156	4		e1
XCZU25DR-2FSVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER		BOTTOM				30	240			CMOS	.85 V			R-PBGA-B1517	4		e1
XCZU25DR-L1FFVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY		.698 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	30	245			CMOS	.72 V			R-PBGA-B1517	4		e1
XCZU25DR-L1FSVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY		.698 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	30	240			CMOS	.72 V			R-PBGA-B1517	4		e1
XCZU25DR-L2FSVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY		.698 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM				30	240			CMOS	.72 V			R-PBGA-B1156	4		e1
MPFS250T-FCG1152E	Microchip Technology	PROGRAMMABLE SoC		BALL	1152	BGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY	BGA1152,34X34,40	.97 V	100 Cel	0 Cel			BOTTOM	2.99 mm	35 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY			35 mm		CMOS	1 V		1 mm	S-PBGA-B1152
MPFS250T-FCG1152I	Microchip Technology	PROGRAMMABLE SoC		BALL	1152	BGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY	BGA1152,34X34,40	.97 V	100 Cel	-40 Cel			BOTTOM	2.99 mm	35 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY			35 mm		CMOS	1 V		1 mm	S-PBGA-B1152
XCZU48DR-2FFVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM				30	245			CMOS	.85 V			R-PBGA-B1156	4		e1
CY8C6137BZI-F34	Infineon Technologies	PROGRAMMABLE SoC		BALL	124	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA124,13X13,25	1.7 V	85 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1 mm	9 mm				9 mm		CMOS	1.8 V		.65 mm	S-PBGA-B124	3		e1
CY8C624ABZI-S2D44	Infineon Technologies	PROGRAMMABLE SoC																TIN SILVER COPPER															3		e1
XCZU25DR-1FSVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM				30	240			CMOS	.85 V			R-PBGA-B1517	4		e1
XCZU25DR-L2FFVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY		.698 V	110 Cel	0 Cel	TIN SILVER COPPER		BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	30	245			CMOS	.72 V			R-PBGA-B1517	4		e1
XCZU3EG-1SBVA484I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM								CMOS	.85 V			R-PBGA-B484	4		e1
CY8C4245PVI-DS402	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V			SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	1.8 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD		DUAL	2 mm	5.3 mm				10.2 mm		CMOS	3 V		.65 mm	R-PDSO-G28	3		e4
MPFS250T-1FCSG536E	Microchip Technology	PROGRAMMABLE SoC		BALL	536	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA536,30X30,20	.97 V	100 Cel	0 Cel			BOTTOM	1.4 mm	16 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY			16 mm		CMOS	1 V		.5 mm	S-PBGA-B536

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.