PROGRAMMABLE SoC Other Function uPs,uCs & Peripheral ICs 1,173

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	JESD-609 Code
XCZU65DR-L2FFVE1156I	Xilinx	PROGRAMMABLE SoC
XQZU3EG-1SFRA484M	Xilinx	PROGRAMMABLE SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.892 V		GRID ARRAY, FINE PITCH	BGA484,22X22,32	.808 V	125 Cel	-55 Cel	Tin/Lead (Sn/Pb)	BOTTOM	3.35 mm	19 mm		40	245	19 mm	CMOS	.85 V	.8 mm	S-PBGA-B484	4	e0
CY8C20055-24SXI	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	16		RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V				1.71 V	85 Cel	-40 Cel		DUAL							CMOS			R-PDSO-G16	3
CY8C4124AZI-S433	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL														PURE TIN												3
CY8C4125FNI-S433T	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL														TIN SILVER COPPER												1	e1
CY8C4127LQI-BL473	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL														Nickel/Palladium/Gold (Ni/Pd/Au)												3	e4
CY8C4148AZI-S443	Infineon Technologies	PROGRAMMABLE SoC															PURE TIN												3
CY8C4247LWA-M484	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1.89 V	AEC-Q100	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	1.71 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	.9 mm	8 mm		30	260	8 mm	CMOS	1.8 V	.5 mm	S-XQCC-N56	3	e4
CY8C4248LQI-BL563	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL														PURE TIN												3
CY8C6144LQI-S4F92	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.7 V	85 Cel	-40 Cel		QUAD	1 mm	8 mm				8 mm	CMOS	1.8 V	.4 mm	S-XQCC-N68	3
CY8C6347LQI-BLD52	Infineon Technologies	PROGRAMMABLE SoC															PURE TIN												3
XCZU21DR-2FFVD1156E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM				30	245		CMOS	.85 V		R-PBGA-B1156	4	e1
XCZU27DR-2FFVE1156E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM				30	245		CMOS	.85 V		R-PBGA-B1156	4	e1
XCZU27DR-2FSVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM				30	240		CMOS	.85 V		R-PBGA-B1517	4	e1
XCZU28DR-1FFVE1156E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM				30	245		CMOS	.85 V		R-PBGA-B1156	4	e1
XCZU28DR-L2FFVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V		GRID ARRAY		.698 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	30	245		CMOS	.72 V		R-PBGA-B1517	4	e1
XCZU3EG-L1UBVA530I	Xilinx	PROGRAMMABLE SoC																				30	245						4
XCZU42DR-1FFVE1156E	Xilinx	PROGRAMMABLE SoC
XCZU42DR-1FSVE1156E	Xilinx	PROGRAMMABLE SoC
XCZU43DR-L2FSVE1156I	Xilinx	PROGRAMMABLE SoC
XCZU47DR-1FFVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM				30	245		CMOS	.85 V		R-PBGA-B1517	4	e1
XCZU48DR-2FSVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM				30	240		CMOS	.85 V		R-PBGA-B1517	4	e1
XCZU49DR-1FSVF1760I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM				30	240		CMOS	.85 V		R-PBGA-B1760	4	e1
XCZU49DR-2FSVF1760I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM				30	240		CMOS	.85 V		R-PBGA-B1760	4	e1
XCZU49DR-L2FFVF1760I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V		GRID ARRAY		.698 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM				30	245		CMOS	.72 V		R-PBGA-B1760	4	e1
XCZU65DR-2FSVE1156I	Xilinx	PROGRAMMABLE SoC
XQZU7EV-1FFRB900M	Xilinx	PROGRAMMABLE SoC		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V		GRID ARRAY	BGA900,30X30,40	.808 V	125 Cel	-55 Cel	Tin/Lead (Sn/Pb)	BOTTOM	3.71 mm	31 mm			225	31 mm	CMOS	.85 V	1 mm	S-PBGA-B900	4	e0
XQZU7EV-L1FFRB900I	Xilinx	PROGRAMMABLE SoC		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V		GRID ARRAY	BGA900,30X30,40	.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM	3.71 mm	31 mm			225	31 mm	CMOS	.85 V	1 mm	S-PBGA-B900	4	e0
CY8C4146LQE-S423	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1.89 V	AEC-Q100	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.71 V	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.6 mm	6 mm				6 mm	CMOS	1.8 V	.5 mm	S-XQCC-N40	3	e4
CY8C4125LQS-S433	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1.89 V	AEC-Q100	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.27SQ,20	1.71 V	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.9 mm	7 mm				7 mm	CMOS	1.8 V	.5 mm	S-XQCC-N40	3	e4
CY8C4146LQE-S433	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1.89 V	AEC-Q100	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.71 V	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.6 mm	6 mm				6 mm	CMOS	1.8 V	.5 mm	S-XQCC-N40	3	e4
CY8C4147LQS-S473	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	105 Cel	-40 Cel	PURE TIN	QUAD	.6 mm	6 mm				6 mm	CMOS	3.3 V	.5 mm	S-XQCC-N40	3
CY8C4247LWS-M484	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1.89 V	AEC-Q100	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	1.71 V	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	.9 mm	8 mm				8 mm	CMOS	1.8 V	.5 mm	S-XQCC-N56	3	e4
CY8C4146AZE-S275	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	125 Cel	-40 Cel		QUAD	1.6 mm	10 mm				10 mm	CMOS	3.3 V	.5 mm	S-PQFP-G64
CY8C4124LQS-S413	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1.89 V	AEC-Q100	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.71 V	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.6 mm	6 mm				6 mm	CMOS	1.8 V	.5 mm	S-XQCC-N40	3	e4
CY8C4246AZS-M445	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.89 V	AEC-Q100	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.71 V	105 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm				10 mm	CMOS	1.8 V	.5 mm	S-PQFP-G64	3
CY8C4147AZS-S445	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	105 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm				10 mm	CMOS	3.3 V	.5 mm	S-PQFP-G64	3
CY8C4147LQS-S293	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	105 Cel	-40 Cel		QUAD	.6 mm	6 mm				6 mm	CMOS	3.3 V	.5 mm	S-XQCC-N40
CY8C624ABZI-S2D14	Infineon Technologies	PROGRAMMABLE SoC															TIN SILVER COPPER												3	e1
CY8C4146LQS-S273	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	105 Cel	-40 Cel		QUAD	.6 mm	6 mm				6 mm	CMOS	3.3 V	.5 mm	S-XQCC-N40
CY8C4127LQA-S443	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	85 Cel	-40 Cel		QUAD	.6 mm	6 mm				6 mm	CMOS	3.3 V	.5 mm	S-XQCC-N40
CY8C4127AZE-S445	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	125 Cel	-40 Cel		QUAD	1.6 mm	10 mm				10 mm	CMOS	3.3 V	.5 mm	S-PQFP-G64
CY8C4146AZE-S265	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	125 Cel	-40 Cel		QUAD	1.6 mm	10 mm				10 mm	CMOS	3.3 V	.5 mm	S-PQFP-G64
CY8C6248LQI-S2D02	Infineon Technologies	PROGRAMMABLE SoC																											3
CY8C4147AZA-S455	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	85 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm		30	260	10 mm	CMOS	3.3 V	.5 mm	S-PQFP-G64	3
CY8C4146LQS-S433	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1.89 V	AEC-Q100	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.71 V	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.6 mm	6 mm				6 mm	CMOS	1.8 V	.5 mm	S-XQCC-N40	3	e4
CY8C4124PVE-S422	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1.89 V	AEC-Q100	SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	1.71 V	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2 mm	5.3 mm				10.2 mm	CMOS	1.8 V	.65 mm	R-PDSO-G28	3	e4
CY8C4125PVS-S432	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1.89 V	AEC-Q100	SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	1.71 V	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2 mm	5.3 mm				10.2 mm	CMOS	1.8 V	.65 mm	R-PDSO-G28	3	e4

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.