PROGRAMMABLE SoC Other Function uPs,uCs & Peripheral ICs 1,173

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Ultraviolet Erasable	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	ROM Bits Size	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
XCZU28DR-2FFVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER		BOTTOM				30	245			CMOS	.85 V			R-PBGA-B1517	4		e1
XCZU5EG-L2FBVB900E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY	BGA900,30X30,40	.698 V	110 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	2.88 mm	31 mm	ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	30	245	31 mm		CMOS	.72 V		1 mm	R-PBGA-B900	4		e1
CY8C6116BZI-F54	Infineon Technologies	PROGRAMMABLE SoC		BALL	124	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA124,13X13,25	1.7 V	85 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1 mm	9 mm				9 mm		CMOS	1.8 V		.65 mm	S-PBGA-B124	3		e1
MPFS250T-1FCG1152E	Microchip Technology	PROGRAMMABLE SoC		BALL	1152	BGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY	BGA1152,34X34,40	.97 V	100 Cel	0 Cel			BOTTOM	2.99 mm	35 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY			35 mm		CMOS	1 V		1 mm	S-PBGA-B1152
XCZU5EG-2FBVB900E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY	BGA900,30X30,40	.825 V	100 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	2.88 mm	31 mm		30	245	31 mm		CMOS	.85 V		1 mm	R-PBGA-B900	4		e1
MPFS250T-1FCG1152I	Microchip Technology	PROGRAMMABLE SoC		BALL	1152	BGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY	BGA1152,34X34,40	.97 V	100 Cel	-40 Cel			BOTTOM	2.99 mm	35 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY			35 mm		CMOS	1 V		1 mm	S-PBGA-B1152
CY8C4247LQI-BL453	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL															NICKEL PALLADIUM GOLD						30	260								3		e4
MPFS250TS-FCG1152I	Microchip Technology	PROGRAMMABLE SoC		BALL	1152	BGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY	BGA1152,34X34,40	.97 V	100 Cel	-40 Cel			BOTTOM	2.99 mm	35 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY			35 mm		CMOS	1 V		1 mm	S-PBGA-B1152
CY8C4127LQI-BL453	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL															PURE TIN						30	260								3
MPFS250T-1FCSG536I	Microchip Technology	PROGRAMMABLE SoC		BALL	536	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA536,30X30,20	.97 V	100 Cel	-40 Cel			BOTTOM	1.4 mm	16 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY			16 mm		CMOS	1 V		.5 mm	S-PBGA-B536
MPFS250T-1FCVG784I	Microchip Technology	PROGRAMMABLE SoC		BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, FINE PITCH	BGA784,28X28,32	.97 V	100 Cel	-40 Cel			BOTTOM	2.92 mm	23 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY			23 mm		CMOS	1 V		.8 mm	S-PBGA-B784
CY8C6347BZI-BLD33	Infineon Technologies	PROGRAMMABLE SoC																TIN SILVER COPPER															3		e1
MPFS025T-FCVG484I	Microchip Technology	PROGRAMMABLE SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel	-40 Cel			BOTTOM	2.92 mm	19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY			19 mm		CMOS	1 V		.8 mm	S-PBGA-B484
XCZU28DR-2FFVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM				30	245			CMOS	.85 V			R-PBGA-B1517	4		e1
XCZU5EG-2FBVB900I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY	BGA900,30X30,40	.825 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	2.88 mm	31 mm		30	245	31 mm		CMOS	.85 V		1 mm	R-PBGA-B900	4		e1
CY8C3446LTI-073	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V		2/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	1.71 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	N	QUAD	1 mm	7 mm		20	260	7 mm	65536 Bits	CMOS	3.3 V	Other uPs/uCs/Peripheral ICs	.5 mm	S-XQCC-N48	3	Not Qualified	e4
XCZU5EG-2SFVC784E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY	BGA784,28X28,32	.825 V	100 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	3.32 mm	23 mm		30	250	23 mm		CMOS	.85 V		.8 mm	R-PBGA-B784	4		e1
XCZU48DR-2FSVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM				30	240			CMOS	.85 V			R-PBGA-B1517	4		e1
MPFS095TLS-FCSG325I	Microchip Technology	PROGRAMMABLE SoC		BALL	325		RECTANGULAR	PLASTIC/EPOXY	YES	1.03 V					.97 V	100 Cel	-40 Cel			BOTTOM			ALSO OPERATES AT 1.05V NOMINAL SUPPLY					CMOS	1 V			R-PBGA-B325
CY8C6137BZI-F54	Infineon Technologies	PROGRAMMABLE SoC		BALL	124	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA124,13X13,25	1.7 V	85 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1 mm	9 mm				9 mm		CMOS	1.8 V		.65 mm	S-PBGA-B124	3		e1
CY8C6336BZI-BLD13	Infineon Technologies	PROGRAMMABLE SoC																TIN SILVER COPPER															3		e1
MPFS095TLS-FCVG484I	Microchip Technology	PROGRAMMABLE SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel	-40 Cel			BOTTOM	2.92 mm	19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY			19 mm		CMOS	1 V		.8 mm	S-PBGA-B484
XCZU27DR-1FSVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER		BOTTOM				30	240			CMOS	.85 V			R-PBGA-B1517	4		e1
XCZU27DR-L2FFVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY		.698 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM				30	245			CMOS	.72 V			R-PBGA-B1517	4		e1
XCZU27DR-L2FSVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY		.698 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM				30	240			CMOS	.72 V			R-PBGA-B1156	4		e1
CY8C4147AZE-S475	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	125 Cel	-40 Cel	PURE TIN		QUAD	1.6 mm	10 mm				10 mm		CMOS	3.3 V		.5 mm	S-PQFP-G64	3
MPFS095T-1FCVG784I	Microchip Technology	PROGRAMMABLE SoC		BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, FINE PITCH	BGA784,28X28,32	.97 V	100 Cel	-40 Cel			BOTTOM	2.92 mm	23 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY			23 mm		CMOS	1 V		.8 mm	S-PBGA-B784
XCZU27DR-2FFVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM				30	245			CMOS	.85 V			R-PBGA-B1156	4		e1
XCZU2EG-1SBVA484E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER		BOTTOM								CMOS	.85 V			R-PBGA-B484	4		e1
XCZU5EG-1SFVC784E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY	BGA784,28X28,32	.825 V	100 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	3.32 mm	23 mm		30	250	23 mm		CMOS	.85 V		.8 mm	R-PBGA-B784	4		e1
CY8C21323-24LFXI	Cypress Semiconductor	PROGRAMMABLE SoC	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	5.25 V		2.5/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	4.75 V	85 Cel	-40 Cel	Matte Tin (Sn)		QUAD	1 mm	4 mm	ALSO OPERATES AT 2.7V AND 3.3V SUPPLY	20	260	4 mm		CMOS	5 V	Microcontrollers	.5 mm	S-XQCC-N24	3	Not Qualified	e3
CY8C6144AZI-S4F92	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	HQFP64,.47SQ,20	1.7 V	85 Cel	-40 Cel			QUAD	1.6 mm	10 mm				10 mm		CMOS	1.8 V		.5 mm	S-PQFP-G64	3
MPFS025T-1FCSG325E	Microchip Technology	PROGRAMMABLE SoC		BALL	325		RECTANGULAR	PLASTIC/EPOXY	YES	1.03 V					.97 V	100 Cel	0 Cel			BOTTOM			ALSO OPERATES AT 1.05V NOMINAL SUPPLY					CMOS	1 V			R-PBGA-B325
MPFS025T-1FCVG484E	Microchip Technology	PROGRAMMABLE SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel	0 Cel			BOTTOM	2.92 mm	19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY			19 mm		CMOS	1 V		.8 mm	S-PBGA-B484
MPFS025T-1FCVG484I	Microchip Technology	PROGRAMMABLE SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel	-40 Cel			BOTTOM	2.92 mm	19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY			19 mm		CMOS	1 V		.8 mm	S-PBGA-B484
MPFS025T-FCSG325E	Microchip Technology	PROGRAMMABLE SoC		BALL	325		RECTANGULAR	PLASTIC/EPOXY	YES	1.03 V					.97 V	100 Cel	0 Cel			BOTTOM			ALSO OPERATES AT 1.05V NOMINAL SUPPLY					CMOS	1 V			R-PBGA-B325
MPFS025T-FCSG325I	Microchip Technology	PROGRAMMABLE SoC		BALL	325		RECTANGULAR	PLASTIC/EPOXY	YES	1.03 V					.97 V	100 Cel	-40 Cel			BOTTOM			ALSO OPERATES AT 1.05V NOMINAL SUPPLY					CMOS	1 V			R-PBGA-B325
MPFS095T-1FCSG536E	Microchip Technology	PROGRAMMABLE SoC		BALL	536	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA536,30X30,20	.97 V	100 Cel	0 Cel			BOTTOM	1.4 mm	16 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY			16 mm		CMOS	1 V		.5 mm	S-PBGA-B536
MPFS095T-1FCVG484I	Microchip Technology	PROGRAMMABLE SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel	-40 Cel			BOTTOM	2.92 mm	19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY			19 mm		CMOS	1 V		.8 mm	S-PBGA-B484
MPFS160T-1FCVG484I	Microchip Technology	PROGRAMMABLE SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel	-40 Cel			BOTTOM	2.92 mm	19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY			19 mm		CMOS	1 V		.8 mm	S-PBGA-B484
MPFS160T-1FCVG784E	Microchip Technology	PROGRAMMABLE SoC		BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, FINE PITCH	BGA784,28X28,32	.97 V	100 Cel	0 Cel			BOTTOM	2.92 mm	23 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY			23 mm		CMOS	1 V		.8 mm	S-PBGA-B784
MPFS160TS-FCVG484I	Microchip Technology	PROGRAMMABLE SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel	-40 Cel			BOTTOM	2.92 mm	19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY			19 mm		CMOS	1 V		.8 mm	S-PBGA-B484
XCZU5EG-1FBVB900I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY	BGA900,30X30,40	.825 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	2.88 mm	31 mm		30	245	31 mm		CMOS	.85 V		1 mm	R-PBGA-B900	4		e1
XCZU5EG-3SFVC784E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.927 V			GRID ARRAY	BGA784,28X28,32	.873 V	100 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	3.32 mm	23 mm		30	250	23 mm		CMOS	.9 V		.8 mm	S-PBGA-B784	4		e1
XCZU5EG-L1SFVC784I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY	BGA784,28X28,32	.698 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	3.32 mm	23 mm	ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	30	250	23 mm		CMOS	.72 V		.8 mm	R-PBGA-B784	4		e1
XCZU5EG-L2SFVC784E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY	BGA784,28X28,32	.698 V	110 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	3.32 mm	23 mm	ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	30	250	23 mm		CMOS	.72 V		.8 mm	R-PBGA-B784	4		e1
CY8C4124LQI-S432	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL															PURE TIN															3
CY8C4124LQI-S432T	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL															PURE TIN															3

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.