PROGRAMMABLE SoC Other Function uPs,uCs & Peripheral ICs 1,173

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Ultraviolet Erasable	Terminal Position	Maximum Seated Height	Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	ROM Bits Size	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
CY8C624ABZI-S2D04	Infineon Technologies	PROGRAMMABLE SoC																TIN SILVER COPPER														3		e1
CY8C4125LQS-S423	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1.89 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.27SQ,20	1.71 V	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD		QUAD	.9 mm	7 mm			7 mm		CMOS	1.8 V		.5 mm	S-XQCC-N40	3		e4
CY8C4147AZS-S475	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	105 Cel	-40 Cel	PURE TIN		QUAD	1.6 mm	10 mm			10 mm		CMOS	3.3 V		.5 mm	S-PQFP-G64	3
CY8C4147AZS-S255	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	105 Cel	-40 Cel	PURE TIN		QUAD	1.6 mm	10 mm			10 mm		CMOS	3.3 V		.5 mm	S-PQFP-G64	3
CY8C4147LQA-S453	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	85 Cel	-40 Cel			QUAD	.6 mm	6 mm			6 mm		CMOS	3.3 V		.5 mm	S-XQCC-N40
CY8C4147LQA-S283	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	85 Cel	-40 Cel			QUAD	.6 mm	6 mm			6 mm		CMOS	3.3 V		.5 mm	S-XQCC-N40
CY8C4147LQS-S253	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	105 Cel	-40 Cel			QUAD	.6 mm	6 mm			6 mm		CMOS	3.3 V		.5 mm	S-XQCC-N40
CY8C4147LQA-S253	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	85 Cel	-40 Cel			QUAD	.6 mm	6 mm			6 mm		CMOS	3.3 V		.5 mm	S-XQCC-N40
CY8C4146LQE-S263	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	125 Cel	-40 Cel			QUAD	.6 mm	6 mm			6 mm		CMOS	3.3 V		.5 mm	S-XQCC-N40
CY8C4247AZA-M485	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.89 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.71 V	85 Cel	-40 Cel	PURE TIN		QUAD	1.6 mm	10 mm			10 mm		CMOS	1.8 V		.5 mm	S-PQFP-G64	3
CY8C4146AZA-S255	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	85 Cel	-40 Cel	PURE TIN		QUAD	1.6 mm	10 mm			10 mm		CMOS	3.3 V		.5 mm	S-PQFP-G64	3
CY8C4247LWS-M464	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1.89 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	1.71 V	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER		QUAD	.9 mm	8 mm			8 mm		CMOS	1.8 V		.5 mm	S-XQCC-N56	3		e4
CY8C4147LQS-S453	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	105 Cel	-40 Cel			QUAD	.6 mm	6 mm			6 mm		CMOS	3.3 V		.5 mm	S-XQCC-N40
CY8C4125LQE-S433	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1.89 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.27SQ,20	1.71 V	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD		QUAD	.9 mm	7 mm			7 mm		CMOS	1.8 V		.5 mm	S-XQCC-N40	3		e4
CY8C4146LQA-S273	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	85 Cel	-40 Cel			QUAD	.6 mm	6 mm			6 mm		CMOS	3.3 V		.5 mm	S-XQCC-N40
CY8C4146AZE-S455	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	125 Cel	-40 Cel			QUAD	1.6 mm	10 mm			10 mm		CMOS	3.3 V		.5 mm	S-PQFP-G64
CY8C4124LQA-S433	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1.89 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.71 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD		QUAD	.6 mm	6 mm			6 mm		CMOS	1.8 V		.5 mm	S-XQCC-N40	3		e4
CY8C4014SXE-421Z	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		SMALL OUTLINE	SOP16,.25	1.75 V	125 Cel	-40 Cel			DUAL	1.727 mm	3.8985 mm			9.893 mm		CMOS	3.3 V		1.27 mm	R-PDSO-G16
CY8C4124PVS-S422	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1.89 V	AEC-Q100		SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	1.71 V	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD		DUAL	2 mm	5.3 mm			10.2 mm		CMOS	1.8 V		.65 mm	R-PDSO-G28	3		e4
CY8C4146AZE-S255	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	125 Cel	-40 Cel			QUAD	1.6 mm	10 mm			10 mm		CMOS	3.3 V		.5 mm	S-PQFP-G64
CY8C4147AZE-S255	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	125 Cel	-40 Cel			QUAD	1.6 mm	10 mm			10 mm		CMOS	3.3 V		.5 mm	S-PQFP-G64
CY8C4014LQE-422Z	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	1.75 V	125 Cel	-40 Cel			QUAD	.6 mm	4 mm			4 mm		CMOS	3.3 V		.5 mm	S-XQCC-N24	3
CY8C4246AZA-M443	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.89 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	1.71 V	85 Cel	-40 Cel	PURE TIN		QUAD	1.6 mm	7 mm			7 mm		CMOS	1.8 V		.5 mm	S-PQFP-G48	3
CY8C4246AZS-M443	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.89 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	1.71 V	105 Cel	-40 Cel			QUAD	1.6 mm	7 mm			7 mm		CMOS	1.8 V		.5 mm	S-PQFP-G48	3
CY8C4147LQS-S243	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	105 Cel	-40 Cel	PURE TIN		QUAD	.6 mm	6 mm			6 mm		CMOS	3.3 V		.5 mm	S-XQCC-N40	3
CY8C4147AZE-S455	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	125 Cel	-40 Cel			QUAD	1.6 mm	10 mm			10 mm		CMOS	3.3 V		.5 mm	S-PQFP-G64
CY8C4124LQS-S433	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1.89 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.71 V	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD		QUAD	.6 mm	6 mm			6 mm		CMOS	1.8 V		.5 mm	S-XQCC-N40	3		e4
CY8C4247AZA-M483	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.89 V	AEC-Q100		FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	1.71 V	85 Cel	-40 Cel	PURE TIN		QUAD	1.6 mm	7 mm	30	260	7 mm		CMOS	1.8 V		.5 mm	S-PQFP-G48	3
CY8C3446AXI-105T	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V		2/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.71 V	85 Cel	-40 Cel	PURE TIN	N	QUAD	1.6 mm	14 mm			14 mm	524288 Bits	CMOS	3.3 V	Other uPs/uCs/Peripheral ICs	.5 mm	S-PQFP-G100	3	Not Qualified
CY8C6316BZI-BLF54	Infineon Technologies	PROGRAMMABLE SoC																TIN SILVER COPPER														3		e1
CY8C4247FNI-BL483	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL															TIN SILVER COPPER					30	260								1		e1
CY8C4146LQE-S455	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	1.8 V	125 Cel	-40 Cel			QUAD	.9 mm	9 mm			9 mm		CMOS	3.3 V		.5 mm	S-XQCC-N64
CY8C4245PVA-482Z	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	1.8 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER		DUAL	2 mm	5.3 mm			10.2 mm		CMOS	3.3 V		.65 mm	R-PDSO-G28	3		e4
CY8C4125AZI-S413T	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL															PURE TIN					30	260								3
CY8C4147LQA-S265	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	1.8 V	85 Cel	-40 Cel			QUAD	.9 mm	9 mm			9 mm		CMOS	3.3 V		.5 mm	S-XQCC-N64
CY8C3446LTI-085	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V		2/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.71 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	N	QUAD	1 mm	8 mm	30	260	8 mm	65536 Bits	CMOS	3.3 V	Other uPs/uCs/Peripheral ICs	.4 mm	S-XQCC-N68	3	Not Qualified	e4
CY8C4247FNQ-BL483	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	105 Cel	-40 Cel			QUAD	.6 mm	7 mm	30	260	7 mm		CMOS	3.3 V		.4 mm	S-XQCC-N56	1
CY8C4148AZI-S453	Infineon Technologies	PROGRAMMABLE SoC																PURE TIN														3
CY8C4128LQI-BL563	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL															PURE TIN														3
CY8C6246BZI-D04	Infineon Technologies	PROGRAMMABLE SoC		BALL	124	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA124,13X13,25	1.7 V	85 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1 mm	9 mm			9 mm		CMOS	1.8 V		.65 mm	S-PBGA-B124	3		e1
CY8C21534-12PVXET	Infineon Technologies	PROGRAMMABLE SoC	AUTOMOTIVE	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V	AEC-Q100	5	SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	4.75 V	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD		DUAL	2 mm	5.3 mm	20	260	10.2 mm		CMOS	5 V	Microcontrollers	.65 mm	R-PDSO-G28	3	Not Qualified	e4
CY8C4146LQE-S275	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	1.8 V	125 Cel	-40 Cel			QUAD	.9 mm	9 mm			9 mm		CMOS	3.3 V		.5 mm	S-XQCC-N64
CY8C4248LQQ-BL583	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL															NICKEL PALLADIUM GOLD														3		e4
CY8C4146LQA-S245	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	1.8 V	85 Cel	-40 Cel			QUAD	.9 mm	9 mm			9 mm		CMOS	3.3 V		.5 mm	S-XQCC-N64
CY8C6145AZI-S3F72	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V			FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.7 V	85 Cel	-40 Cel	PURE TIN		DUAL	1.6 mm	14 mm			14 mm		CMOS	1.8 V		.5 mm	S-PQFP-G100	3
CY8C4124LQI-S413	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL															PURE TIN														3
CY8C4147LQE-S285	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	1.8 V	125 Cel	-40 Cel			QUAD	.9 mm	9 mm			9 mm		CMOS	3.3 V		.5 mm	S-XQCC-N64
CY8C4127LQS-S445	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	1.8 V	105 Cel	-40 Cel			QUAD	.9 mm	9 mm			9 mm		CMOS	3.3 V		.5 mm	S-XQCC-N64

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.