SYSTEM ON CHIP Other Function uPs,uCs & Peripheral ICs 852

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
935361276557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1
935340604557	NXP Semiconductors	SYSTEM ON CHIP															TIN SILVER COPPER					30	250							3		e1
935361137557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1
935338887557	NXP Semiconductors	SYSTEM ON CHIP															TIN SILVER COPPER					30	250							3		e1
935361133557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1
935361135557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1
935361134557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1
935361139557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1
935361157557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1
935361154557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1
935361151557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1
935361142557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1
935361155557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1
935361144557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1
935361285557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1
935361143557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1
935340586557	NXP Semiconductors	SYSTEM ON CHIP															TIN SILVER COPPER					30	250							3		e1
935361278557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1
935361153557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1
935361274557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1
935338883557	NXP Semiconductors	SYSTEM ON CHIP															TIN SILVER COPPER					30	250							3		e1
935361145557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1
935361141557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1
935361272557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1
935340605557	NXP Semiconductors	SYSTEM ON CHIP															TIN SILVER COPPER					30	250							3		e1
935361136557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1
LS1043ASE7KQLB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	621	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA621,25X25,32	.87 V	105 Cel	0 Cel		BOTTOM	2.07 mm	21 mm				21 mm	CMOS	.9 V		.8 mm	S-PBGA-B621
LS1084ASN7PTA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1
LS1043ASN8MQLA	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V	105 Cel	0 Cel		BOTTOM	2.07 mm	23 mm				23 mm	CMOS	.9 V		.8 mm	S-PBGA-B780
MCIMX353DJQ5CR2	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V		GRID ARRAY, LOW PROFILE, FINE PITCH		1.22 V	70 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	17 mm		40	260	17 mm		1.8 V		.8 mm	S-PBGA-B400	3		e1
LS1043ASE7PQLB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	621	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA621,25X25,32	.87 V	105 Cel	0 Cel		BOTTOM	2.07 mm	21 mm				21 mm	CMOS	.9 V		.8 mm	S-PBGA-B621
MCIMX31DVKN5D	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	457	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.65 V	1.2/1.5,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA457,26X26,20	1.52 V	70 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	14 mm	UNAVAILABLE FOR IMPORT OR SALE IN US	40	260	14 mm	CMOS		Microprocessors	.5 mm	S-PBGA-B457	3	Not Qualified	e1
LS1088AXE7PQA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel		BOTTOM	2.61 mm	23 mm				23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780
LS1043ASN7MQLA	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	621	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA621,25X25,32	.87 V	105 Cel	0 Cel		BOTTOM	2.07 mm	21 mm				21 mm	CMOS	.9 V		.8 mm	S-PBGA-B621
LS1043ASN7QQLB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	621	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA621,25X25,32	.87 V	105 Cel	0 Cel		BOTTOM	2.07 mm	21 mm				21 mm	CMOS	.9 V		.8 mm	S-PBGA-B621
MIMX8MN5CVTIZAA	NXP Semiconductors	SYSTEM ON CHIP															TIN SILVER					40	260							3		e2
LS1043AXE8QNLB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	23 mm				23 mm	CMOS	.9 V		.8 mm	S-PBGA-B780
LS1043ASE8PNLA	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V	105 Cel	0 Cel		BOTTOM	2.07 mm	23 mm				23 mm	CMOS	.9 V		.8 mm	S-PBGA-B780
LS1043AXN7QNLB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	621	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA621,25X25,32	.87 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	21 mm				21 mm	CMOS	.9 V		.8 mm	S-PBGA-B621
LS1048AXE7Q1A	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1
LS1043AXE8MQLA	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	23 mm				23 mm	CMOS	.9 V		.8 mm	S-PBGA-B780
LS1048AXN7PTA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1
LS1043ASE8KNLB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.87 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm		30	250	23 mm	CMOS	.9 V		.8 mm	S-PBGA-B780	3		e1
MCIMX6G1CVM05AA	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH		1.15 V	105 Cel	-40 Cel	Tin/Silver (Sn/Ag)	BOTTOM	1.32 mm	14 mm		40	260	14 mm	CMOS			.8 mm	S-PBGA-B289	3		e2
MCIMX6Q6AVT08AC	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH		1.225 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm	24MHZ NOMINAL EXTERNAL FREQUENCY AVAILABLE	40	260	21 mm	CMOS	1.4 V		.8 mm	S-PBGA-B624	3		e1
MCIMX280CVM4CR2	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	85 Cel	-40 Cel		BOTTOM	1.37 mm	14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V	40	260	14 mm	CMOS	1.45 V		.8 mm	S-PBGA-B289	3
MCIMX283DVM4C	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	70 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.37 mm	14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V	40	260	14 mm	CMOS	1.45 V		.8 mm	S-PBGA-B289	3		e1
LS1048AXE7PTA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.