SYSTEM ON CHIP Other Function uPs,uCs & Peripheral ICs 852

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code
AM6421BSDGHAALV	Texas Instruments	SYSTEM ON CHIP		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.652 mm	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY			17.2 mm	CMOS	.75 V	.8 mm	S-PBGA-B441
ATSAM4C8CB-AUT	Microchip Technology	SYSTEM ON CHIP		GULL WING	100	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1.32 V		FLATPACK, THIN PROFILE, FINE PITCH	TQFP100,.63SQ	1.08 V	85 Cel	-40 Cel		QUAD	1.2 mm	14 mm				14 mm	CMOS	1.2 V	.5 mm	S-PQFP-G100
ATSAM4C8CB-AUTR	Microchip Technology	SYSTEM ON CHIP		GULL WING	100	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1.32 V		FLATPACK, THIN PROFILE, FINE PITCH	TQFP100,.63SQ	1.08 V	85 Cel	-40 Cel		QUAD	1.2 mm	14 mm				14 mm	CMOS	1.2 V	.5 mm	S-PQFP-G100
MCIMX283DVM4BR2	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	70 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.37 mm	14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V	40	260	14 mm	CMOS	1.45 V	.8 mm	S-PBGA-B289	3			e1
AM4376BZDND30	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	.912 V	90 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	17 mm		30	260	17 mm	CMOS	.95 V	.65 mm	S-PBGA-B491	3			e1
AM4378BZDND80	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.326 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.21 V	90 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	17 mm		30	260	17 mm	CMOS	1.26 V	.65 mm	S-PBGA-B491	3			e1
MCIMX233DAG4C	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.55 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63SQ,16	1 V	70 Cel	-10 Cel	TIN	QUAD	1.6 mm	14 mm		40	260	14 mm	CMOS	1.35 V	.4 mm	S-PQFP-G128	3			e3
MCIMX357CJQ5C	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.33 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	17 mm	IT ALSO OPERATES AT 1.22 TO 1.47 V	40	260	17 mm	CMOS	1.8 V	.8 mm	S-PBGA-B400	3	Not Qualified		e1
MCIMX6U8DVM10AB	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm		40	260	21 mm	CMOS		.8 mm	S-PBGA-B624	3			e1
XC7Z100-1FFG1156C	Xilinx	SYSTEM ON CHIP		BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA1156,34X34,40	.95 V	85 Cel	0 Cel		BOTTOM	3.1 mm	35 mm				35 mm	CMOS	1 V	1 mm	S-PBGA-B1156
AM6441BSDGHAALV	Texas Instruments	SYSTEM ON CHIP		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.652 mm	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY			17.2 mm	CMOS	.75 V	.8 mm	S-PBGA-B441
AM6441BSFGHAALV	Texas Instruments	SYSTEM ON CHIP		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.652 mm	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY			17.2 mm	CMOS	.75 V	.8 mm	S-PBGA-B441
EFR32MG12P433F1024GL125-C	Silicon Labs	SYSTEM ON CHIP
EFR32MG12P433F1024GM48-C	Silicon Labs	SYSTEM ON CHIP
MCIMX27LMOP4A	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	473	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.52 V		GRID ARRAY, LOW PROFILE, FINE PITCH		1.38 V	85 Cel	-40 Cel		BOTTOM	1.54 mm	19 mm	ALSO OPERATES WITH 1.3VNOM @266MHZ	40	260	19 mm	CMOS	1.45 V	.8 mm	S-PBGA-B473	3	Not Qualified
MCIMX6D6AVT10AC	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH		1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm	24MHZ NOMINAL EXTERNAL FREQUENCY AVAILABLE	40	260	21 mm	CMOS		.8 mm	S-PBGA-B624	3			e1
MCIMX6U5EVM10AB	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm		40	260	21 mm	CMOS		.8 mm	S-PBGA-B624	3			e1
MCIMX6Y7DVK05AA	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	272	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA272,17X17,20	1.275 V	95 Cel	0 Cel		BOTTOM	1.23 mm	9 mm		40	260	9 mm	CMOS		.5 mm	S-PBGA-B272	3
EFR32FG12P431F1024GM68-CR	Silicon Labs	SYSTEM ON CHIP		NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.62 V	85 Cel	-40 Cel		QUAD	.9 mm	8 mm		30	260	8 mm	CMOS	1.8 V	.4 mm	S-XQCC-N68	3
MCIMX233DJM4C	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	169	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA169,13X13,32	1 V	70 Cel	-10 Cel	TIN SILVER COPPER	BOTTOM	1.43 mm	11 mm		40	260	11 mm	CMOS	1.35 V	.8 mm	S-PBGA-B169	3			e1
MCIMX286DVM4BR	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	70 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.37 mm	14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V	40	260	14 mm	CMOS	1.45 V	.8 mm	S-PBGA-B289	3			e1
XC7Z030-L2FBG484I	Xilinx	SYSTEM ON CHIP		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA484,22X22,40	.95 V	100 Cel	-40 Cel		BOTTOM	2.54 mm	23 mm				23 mm	CMOS	1 V	1 mm	S-PBGA-B484
66AK2G12ABYA60	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	625	LFBGA	SQUARE	PLASTIC/EPOXY	YES	.945 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA625,25X25,32	.855 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.56 mm	21 mm		30	260	21 mm	CMOS	.9 V	.8 mm	S-PBGA-B625	3			e1
AM4378BZDN80	Texas Instruments	SYSTEM ON CHIP	OTHER	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.326 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.21 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	17 mm		30	260	17 mm	CMOS	1.26 V	.65 mm	S-PBGA-B491	3			e1
MCIMX27VOP4AR2	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	404	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.52 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA404,24X24,25	1.38 V	85 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	17 mm	ALSO OPERATES 1.3V AT 266MHZ	40	260	17 mm	CMOS	1.45 V	.65 mm	S-PBGA-B404	3			e1
MCIMX280CVM4B	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.37 mm	14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V	40	260	14 mm	CMOS	1.45 V	.8 mm	S-PBGA-B289	3	Not Qualified		e1
MCIMX286CVM4C	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	85 Cel	-40 Cel		BOTTOM	1.37 mm	14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V	40	260	14 mm	CMOS	1.45 V	.8 mm	S-PBGA-B289	3
MCIMX353CVM5B	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.33 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	17 mm	IT ALSO OPERATES AT 1.22 TO 1.47 V	40	260	17 mm	CMOS	1.8 V	.8 mm	S-PBGA-B400	3	Not Qualified		e1
MCIMX353DVM5B	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.33 V	70 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	17 mm	IT ALSO OPERATES AT 1.22 TO 1.47 V	40	260	17 mm	CMOS	1.8 V	.8 mm	S-PBGA-B400	3	Not Qualified		e1
MCIMX357CVM5B	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.33 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	17 mm	IT ALSO OPERATES AT 1.22 TO 1.47 V	40	260	17 mm	CMOS	1.8 V	.8 mm	S-PBGA-B400	3	Not Qualified		e1
MCIMX357DVM5B	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.33 V	70 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	17 mm	IT ALSO OPERATES AT 1.22 TO 1.47 V	40	260	17 mm	CMOS	1.8 V	.8 mm	S-PBGA-B400	3	Not Qualified		e1
MIMX8MN3CVTIZAA	NXP Semiconductors	SYSTEM ON CHIP															TIN SILVER					40	260						3			e2
TDA4AL88TGAALZRQ1	Texas Instruments	SYSTEM ON CHIP		BALL	770	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V	AEC-Q100; ISO 26262	GRID ARRAY, FINE PITCH	BGA770,28X28,32	.76 V	125 Cel	-40 Cel		BOTTOM	2.57 mm	23 mm				23 mm	CMOS	.8 V	.8 mm	S-PBGA-B770	3		2000 rpm
XC7Z012S-1CLG485I	Xilinx	SYSTEM ON CHIP		BALL	485	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA485,22X22,32	.95 V	100 Cel	-40 Cel		BOTTOM	1.6 mm	19 mm				19 mm	CMOS	1 V	.8 mm	S-PBGA-B485
66AK2G12ABY100	Texas Instruments	SYSTEM ON CHIP	COMMERCIAL	BALL	625	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA625,25X25,32	.95 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.56 mm	21 mm		30	260	21 mm	CMOS	1 V	.8 mm	S-PBGA-B625	3			e1
AM6412BKCGHAALV	Texas Instruments	SYSTEM ON CHIP		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.652 mm	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY			17.2 mm	CMOS	.75 V	.8 mm	S-PBGA-B441
ATSAM4C16CB-AUTR	Microchip Technology	SYSTEM ON CHIP		GULL WING	100	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1.32 V		FLATPACK, THIN PROFILE, FINE PITCH	TQFP100,.63SQ	1.08 V	85 Cel	-40 Cel		QUAD	1.2 mm	14 mm				14 mm	CMOS	1.2 V	.5 mm	S-PQFP-G100
CYW20721B2KUMLG	Infineon Technologies	SYSTEM ON CHIP		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	3.63 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	1.76 V	85 Cel	-30 Cel		QUAD	.6 mm	5 mm				5 mm	CMOS	3 V	.4 mm	S-XQCC-N40
EFR32MG12P433F1024GM48-CR	Silicon Labs	SYSTEM ON CHIP
EFR32MG13P632F512GM32-D	Silicon Labs	SYSTEM ON CHIP		NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.8 V	85 Cel	-40 Cel		QUAD	.9 mm	5 mm				5 mm	CMOS	3.3 V	.5 mm	S-XQCC-N32
EFR32MG13P632F512GM48-DR	Silicon Labs	SYSTEM ON CHIP		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	1.8 V	85 Cel	-40 Cel		QUAD	.9 mm	7 mm				7 mm	CMOS	3.3 V	.5 mm	S-XQCC-N48
EFR32MG14P733F256IM48-BR	Silicon Labs	SYSTEM ON CHIP
EFR32MG21B020F1024IM32-B	Silicon Labs	SYSTEM ON CHIP	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.16SQ,16	1.71 V	125 Cel	-40 Cel		QUAD	.9 mm	4 mm				4 mm	CMOS	3 V	.4 mm	S-XQCC-N32
MCIMX257DJM4A,557	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.52 V		GRID ARRAY, LOW PROFILE, FINE PITCH		1.38 V	70 Cel	-20 Cel		BOTTOM	1.6 mm	17 mm	ALSO REQUIRES 3.3 V I/O SUPPLY			17 mm	CMOS	1.45 V	.8 mm	S-PBGA-B400
MCIMX286DVM4C	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	70 Cel	-20 Cel		BOTTOM	1.37 mm	14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V	40	260	14 mm	CMOS	1.45 V	.8 mm	S-PBGA-B289	3
MCIMX6D5EYM10AD	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH		1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24MHZ NOMINAL FREQ AVAILABLE	40	260	21 mm	CMOS		.8 mm	S-PBGA-B624	3			e1
MIMX8QX2AVLFZAC	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	609	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, FINE PITCH	BGA609,35X35,32	1.05 V	125 Cel	-40 Cel		BOTTOM	2.52 mm	21 mm		40	260	21 mm	CMOS	1.1 V	.8 mm	S-PBGA-B609	3
XC7Z045-3FBG676E	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	0 Cel		BOTTOM	2.54 mm	27 mm				27 mm	CMOS	1 V	1 mm	S-PBGA-B676

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.