SYSTEM ON CHIP Other Function uPs,uCs & Peripheral ICs 852

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code
MIMXRT1051CVL5B	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.15 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.43 mm	10 mm		40	260	10 mm	CMOS			.65 mm	S-PBGA-B196	3			e1
XC7Z010-3CLG400E	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	1.6 mm	17 mm				17 mm	CMOS	1 V		.8 mm	S-PBGA-B400	3			e1
XC7Z035-1FFG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel		BOTTOM	3.24 mm	27 mm				27 mm	CMOS	1 V		1 mm	S-PBGA-B676
MCIMX6Q6AVT10AC	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH		1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm	24MHZ NOMINAL EXTERNAL FREQUENCY AVAILABLE	40	260	21 mm	CMOS			.8 mm	S-PBGA-B624	3			e1
XC7Z015-L1CLG485I	Xilinx	SYSTEM ON CHIP		BALL	485	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA485,22X22,32	.95 V	100 Cel	-40 Cel		BOTTOM	1.6 mm	19 mm				19 mm	CMOS	1 V		.8 mm	S-PBGA-B485
XC7Z035-2FFG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel		BOTTOM	3.24 mm	27 mm				27 mm	CMOS	1 V		1 mm	S-PBGA-B676
AM4376BZDND100	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.378 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.272 V	90 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	17 mm		30	260	17 mm	CMOS	1.325 V		.65 mm	S-PBGA-B491	3			e1
XC7Z007S-2CLG225I	Xilinx	SYSTEM ON CHIP		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	.95 V	100 Cel	-40 Cel		BOTTOM	1.5 mm	13 mm				13 mm	CMOS	1 V		.8 mm	S-PBGA-B225
MCIMX6U7CVM08AC	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	40	260	21 mm	CMOS			.8 mm	S-PBGA-B624	3			e1
MCIMX6S7CVM08ACR	NXP Semiconductors	SYSTEM ON CHIP		BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	40	260	21 mm	CMOS			.8 mm	S-PBGA-B624	3			e1
XC7Z035-L2FBG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel		BOTTOM	2.54 mm	27 mm				27 mm	CMOS	1 V		1 mm	S-PBGA-B676
AM6442BSEFHAALV	Texas Instruments	SYSTEM ON CHIP		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.652 mm	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY	30	250	17.2 mm	CMOS	.75 V		.8 mm	S-PBGA-B441	3		1000 rpm
XC7Z100-2FFG900I	Xilinx	SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel	-40 Cel		BOTTOM	3.24 mm	27 mm				27 mm	CMOS	1 V		1 mm	S-PBGA-B900
AM4376BZDNA100	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.378 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.272 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	17 mm		30	260	17 mm	CMOS	1.325 V		.65 mm	S-PBGA-B491	3			e1
MCIMX6G2CVM05AB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.15 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.32 mm	14 mm		40	260	14 mm	CMOS			.8 mm	S-PBGA-B289	3			e1
XC7Z030-1FFG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel		BOTTOM	3.24 mm	27 mm				27 mm	CMOS	1 V		1 mm	S-PBGA-B676
MCIMX6G2CVK05AB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	272	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.15 V	105 Cel	-40 Cel		BOTTOM	1.23 mm	9 mm		40	260	9 mm	CMOS			.5 mm	S-PBGA-B272	3
MCIMX257CJM4A	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.52 V		1.2/1.5,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.38 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	17 mm	ALSO REQUIRES 3.3 V I/O SUPPLY	40	260	17 mm	CMOS	1.45 V	Microprocessors	.8 mm	S-PBGA-B400	3	Not Qualified		e1
XC7Z045-1FFG900I	Xilinx	SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel	-40 Cel		BOTTOM	3.24 mm	27 mm				27 mm	CMOS	1 V		1 mm	S-PBGA-B900
MCIMX6U5EVM10AC	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm		40	260	21 mm	CMOS			.8 mm	S-PBGA-B624	3			e1
XC7Z030-2SBG485I	Xilinx	SYSTEM ON CHIP		BALL	485	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA485,22X22,32	.95 V	100 Cel	-40 Cel		BOTTOM	2.44 mm	19 mm				19 mm	CMOS	1 V		.8 mm	S-PBGA-B485
XC7Z045-1FFG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel		BOTTOM	3.24 mm	27 mm				27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z030-2FBG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel		BOTTOM	2.54 mm	27 mm				27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z045-1FBG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel		BOTTOM	2.54 mm	27 mm				27 mm	CMOS	1 V		1 mm	S-PBGA-B676
MIMXRT1052CVL5A	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32	1.15 V	105 Cel	-40 Cel		BOTTOM	1.52 mm	10 mm	24MHZ NOMINAL CRYSTAL FREQUENCY AVAILABLE			10 mm	CMOS			.65 mm	S-PBGA-B196
XC7Z045-2FBG676E	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	0 Cel		BOTTOM	2.54 mm	27 mm				27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z007S-1CLG225I	Xilinx	SYSTEM ON CHIP		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	.95 V	100 Cel	-40 Cel		BOTTOM	1.5 mm	13 mm				13 mm	CMOS	1 V		.8 mm	S-PBGA-B225
XC7Z030-L2FFG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel		BOTTOM	3.24 mm	27 mm				27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z045-1FBG676C	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	85 Cel	0 Cel		BOTTOM	2.54 mm	27 mm				27 mm	CMOS	1 V		1 mm	S-PBGA-B676
MCIMX536AVP8C2	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	AEC-Q100		GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.05 V	125 Cel	-40 Cel	TIN SILVER	BOTTOM	1.85 mm	19 mm		40	260	19 mm	CMOS	1.1 V		.8 mm	S-PBGA-B529	3			e2
XC7Z030-1FFG676C	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	85 Cel	0 Cel		BOTTOM	3.24 mm	27 mm				27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z007S-2CLG400I	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel	-40 Cel		BOTTOM	1.6 mm	17 mm				17 mm	CMOS	1 V		.8 mm	S-PBGA-B400
XC7Z020-2CLG484E	Xilinx	SYSTEM ON CHIP		BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32	.95 V	100 Cel	0 Cel		BOTTOM	1.6 mm	19 mm				19 mm	CMOS	1 V		.8 mm	S-PBGA-B484
MCIMX6S7CVM08AD	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	40	260	21 mm	CMOS			.8 mm	S-PBGA-B624	3			e1
XC7Z015-2CLG485E	Xilinx	SYSTEM ON CHIP		BALL	485	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA485,22X22,32	.95 V	100 Cel	0 Cel		BOTTOM	1.6 mm	19 mm				19 mm	CMOS	1 V		.8 mm	S-PBGA-B485
XC7Z035-1FBG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel		BOTTOM	2.54 mm	27 mm				27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z045-2FFG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel		BOTTOM	3.24 mm	27 mm				27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z030-1FBG676C	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	85 Cel	0 Cel		BOTTOM	2.54 mm	27 mm				27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z020-3CLG484E	Xilinx	SYSTEM ON CHIP		BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32	.95 V	100 Cel	0 Cel		BOTTOM	1.6 mm	19 mm				19 mm	CMOS	1 V		.8 mm	S-PBGA-B484
XC7Z100-2FFG1156I	Xilinx	SYSTEM ON CHIP		BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA1156,34X34,40	.95 V	100 Cel	-40 Cel		BOTTOM	3.1 mm	35 mm				35 mm	CMOS	1 V		1 mm	S-PBGA-B1156
MCIMX6U5DVM10AC	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm		40	260	21 mm	CMOS			.8 mm	S-PBGA-B624	3			e1
MCIMX7D2DVM12SD	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	541	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.25 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA541,25X25,29	1.2 V	85 Cel	0 Cel		BOTTOM	1.42 mm	19 mm		40	260	19 mm	CMOS	1.225 V		.75 mm	S-PBGA-B541	3
MCIMX6U5DVM10ACR	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.35 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm		40	260	21 mm	CMOS	1.4 V		.8 mm	S-PBGA-B624	3			e1
MCIMX6Q5EYM10AC	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24MHZ NOMINAL FREQ AVAILABLE	40	260	21 mm	CMOS			.8 mm	S-PBGA-B624	3			e1
MCIMX6G3CVM05AB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.15 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.32 mm	14 mm		40	260	14 mm	CMOS			.8 mm	S-PBGA-B289	3			e1
XC7Z015-1CLG485I	Xilinx	SYSTEM ON CHIP		BALL	485	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA485,22X22,32	.95 V	100 Cel	-40 Cel		BOTTOM	1.6 mm	19 mm				19 mm	CMOS	1 V		.8 mm	S-PBGA-B485
XC7Z035-1FBG676C	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	85 Cel	0 Cel		BOTTOM	2.54 mm	27 mm				27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z014S-1CLG400C	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	85 Cel	0 Cel		BOTTOM	1.6 mm	17 mm				17 mm	CMOS	1 V		.8 mm	S-PBGA-B400

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.