SYSTEM ON CHIP Other Function uPs,uCs & Peripheral ICs 852

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code
MCIMX6X1AVK08AB	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,25	1.275 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	14 mm		40	260	14 mm	CMOS	1.8 V		.65 mm	S-PBGA-B400	3			e1
XC7Z014S-1CLG484C	Xilinx	SYSTEM ON CHIP		BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32	.95 V	85 Cel	0 Cel		BOTTOM	1.6 mm	19 mm				19 mm	CMOS	1 V		.8 mm	S-PBGA-B484
AM6442BSDGHAALV	Texas Instruments	SYSTEM ON CHIP		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.652 mm	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY		250	17.2 mm	CMOS	.75 V		.8 mm	S-PBGA-B441	3		1000 rpm
AM6442BSDFHAALV	Texas Instruments	SYSTEM ON CHIP		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.652 mm	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY			17.2 mm	CMOS	.75 V		.8 mm	S-PBGA-B441			1000 rpm
AM6411BKCGHAALV	Texas Instruments	SYSTEM ON CHIP		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.652 mm	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY		250	17.2 mm	CMOS	.75 V		.8 mm	S-PBGA-B441	3
AS5134-ZSST	Ams Ag	SYSTEM ON CHIP
MGM210PB32JIA2	Silicon Labs	SYSTEM ON CHIP
XC7Z012S-1CLG485C	Xilinx	SYSTEM ON CHIP		BALL	485	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA485,22X22,32	.95 V	85 Cel	0 Cel		BOTTOM	1.6 mm	19 mm				19 mm	CMOS	1 V		.8 mm	S-PBGA-B485
MGM210PA32JIA2R	Silicon Labs	SYSTEM ON CHIP
XAM6442ASFGGAALV	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.652 mm	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY		250	17.2 mm	CMOS	.75 V		.8 mm	S-PBGA-B441	3		1000 rpm	e1
XC7Z100-L2FFG1156I	Xilinx	SYSTEM ON CHIP		BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA1156,34X34,40	.95 V	100 Cel	-40 Cel		BOTTOM	3.1 mm	35 mm				35 mm	CMOS	1 V		1 mm	S-PBGA-B1156
AM4378BZDN100	Texas Instruments	SYSTEM ON CHIP	OTHER	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.378 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.272 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	17 mm		30	260	17 mm	CMOS	1.325 V		.65 mm	S-PBGA-B491	3			e1
MCIMX283CVM4BR2	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V		1.4,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.37 mm	14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V	40	260	14 mm	CMOS	1.45 V	Microprocessors	.8 mm	S-PBGA-B289	3	Not Qualified		e1
MCIMX535DVV1B	Freescale Semiconductor	SYSTEM ON CHIP		BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V			GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.2 V	85 Cel	-20 Cel	Tin/Silver (Sn/Ag)	BOTTOM	1.85 mm	19 mm		40	260	19 mm	CMOS	1.25 V		.8 mm	S-PBGA-B529	3	Not Qualified		e2
MCIMX6Y2DVM09AA	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.375 V	95 Cel	0 Cel		BOTTOM	1.32 mm	14 mm		40	260	14 mm	CMOS			.8 mm	S-PBGA-B289	3
MGM210PA22JIA2R	Silicon Labs	SYSTEM ON CHIP
D2-45057-QR-T	Renesas Electronics	SYSTEM ON CHIP		NO LEAD	68	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.9 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.4SQ,20	1.7 V	85 Cel	-10 Cel	NICKEL PALLADIUM GOLD	QUAD	1 mm	10 mm				10 mm	CMOS	1.8 V		.5 mm	S-PQCC-N68	3			e4
MCIMX357CJQ5CR2	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.22 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	17 mm		40	260	17 mm		1.8 V		.8 mm	S-PBGA-B400	3			e1
MIMXRT1051CVJ5BR	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32	1.15 V	105 Cel	-40 Cel		BOTTOM	1.52 mm	12 mm				12 mm	CMOS			.8 mm	S-PBGA-B196
AM4376BZDN100	Texas Instruments	SYSTEM ON CHIP	OTHER	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.378 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.272 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	17 mm		30	260	17 mm	CMOS	1.325 V		.65 mm	S-PBGA-B491	3			e1
AM4376BZDNA80	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.326 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.21 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	17 mm		30	260	17 mm	CMOS	1.26 V		.65 mm	S-PBGA-B491	3			e1
MCIMX536AVV8C	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	AEC-Q100	1.1,1.3,1.8/3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.05 V	125 Cel	-40 Cel	TIN SILVER	BOTTOM	1.85 mm	19 mm		40	260	19 mm	CMOS	1.1 V	Graphics Processors	.8 mm	S-PBGA-B529	3	Not Qualified		e2
AM4378BZDNA100	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.378 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.272 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	17 mm		30	260	17 mm	CMOS	1.325 V		.65 mm	S-PBGA-B491	3			e1
AM5718AABCXEA	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V			GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm	23 mm		30	250	23 mm	CMOS	1.15 V		.8 mm	S-PBGA-B760	3		1500 rpm	e1
MCIMX31CVMN4CR2	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	473	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V		1.3,1.8,1.8/3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA473,23X23,32	1.22 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.54 mm	19 mm		40	260	19 mm	CMOS	1.4 V	Microprocessors	.8 mm	S-PBGA-B473	3	Not Qualified		e1
AM6442BSFGHAALV	Texas Instruments	SYSTEM ON CHIP		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.652 mm	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY		250	17.2 mm	CMOS	.75 V		.8 mm	S-PBGA-B441	3		1000 rpm
EFR32MG12P432F1024IM48-CR	Silicon Labs	SYSTEM ON CHIP		NO LEAD	48	HVQCCN	SQUARE		YES	3.8 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	1.8 V	125 Cel	-40 Cel		QUAD	.9 mm	7 mm				7 mm	CMOS	3.3 V		.5 mm	S-XQCC-N48
MCIMX27VOP4A	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	404	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.52 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.38 V	85 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	17 mm	ALSO OPERATES WITH 1.3VNOM @266MHZ	40	260	17 mm	CMOS	1.45 V		.65 mm	S-PBGA-B404	3	Not Qualified		e1
MCIMX6S7CVM08AB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	40	260	21 mm	CMOS			.8 mm	S-PBGA-B624	3			e1
MCIMX6X2AVN08AB	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.275 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.53 mm	17 mm		40	260	17 mm	CMOS	1.8 V		.8 mm	S-PBGA-B400	3			e1
AX8052F151-2-TB05	Onsemi	SYSTEM ON CHIP	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.35X.55	2.2 V	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	1 mm	5 mm			260	7 mm	CMOS	3 V		.5 mm	R-PQCC-N40	1			e4
EFR32MG12P432F1024GM48-CR	Silicon Labs	SYSTEM ON CHIP		NO LEAD	48	HVQCCN	SQUARE		YES	3.8 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	1.8 V	85 Cel	-40 Cel		QUAD	.9 mm	7 mm				7 mm	CMOS	3.3 V		.5 mm	S-XQCC-N48
MCIMX6X1AVO08AB	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.275 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.53 mm	17 mm		40	260	17 mm	CMOS	1.8 V		.8 mm	S-PBGA-B400	3			e1
XC7Z035-2FBG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel		BOTTOM	2.54 mm	27 mm				27 mm	CMOS	1 V		1 mm	S-PBGA-B676
MCIMX233CAG4C	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.55 V			FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63SQ,16	1 V	85 Cel	-40 Cel	TIN	QUAD	1.6 mm	14 mm		40	260	14 mm	CMOS	1.35 V		.4 mm	S-PQFP-G128	3			e3
MGM210PB32JIA2R	Silicon Labs	SYSTEM ON CHIP
XC7Z100-L2FFG900I	Xilinx	SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel	-40 Cel		BOTTOM	3.24 mm	27 mm				27 mm	CMOS	1 V		1 mm	S-PBGA-B900
AM6422BSDGHAALV	Texas Instruments	SYSTEM ON CHIP		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.652 mm	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY	30	250	17.2 mm	CMOS	.75 V		.8 mm	S-PBGA-B441	3		1000 rpm
MCIMX280DVM4B	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	70 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.37 mm	14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V	40	260	14 mm	CMOS	1.45 V		.8 mm	S-PBGA-B289	3	Not Qualified		e1
MCIMX286CVM4BR2	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V		1.4,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.37 mm	14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V	40	260	14 mm	CMOS	1.45 V	Microprocessors	.8 mm	S-PBGA-B289	3	Not Qualified		e1
AM6442BSEGHAALV	Texas Instruments	SYSTEM ON CHIP		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.652 mm	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY			17.2 mm	CMOS	.75 V		.8 mm	S-PBGA-B441			1000 rpm
AS5134-ZSSM	Ams Ag	SYSTEM ON CHIP																MATTE TIN													3			e3
AM5718AABCX	Texas Instruments	SYSTEM ON CHIP	OTHER	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V			GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm	23 mm		30	250	23 mm	CMOS	1.15 V		.8 mm	S-PBGA-B760	3		1500 rpm	e1
AM5718AABCXA	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V			GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm	23 mm		30	250	23 mm	CMOS	1.15 V		.8 mm	S-PBGA-B760	3		1500 rpm	e1
MCIMX6S6AVM08ACR	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE;EACH GPIO MODULE SUPPORTS 32 BITS OF I/O	40	260	21 mm	CMOS			.8 mm	S-PBGA-B624	3			e1
EFR32MG22C224F512IM40-C	Silicon Labs	SYSTEM ON CHIP																MATTE TIN					40	260							2			e3
AM5716AABCXEQ1	Texas Instruments	SYSTEM ON CHIP	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100		GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm	23 mm		30	250	23 mm	CMOS	1.15 V		.8 mm	S-PBGA-B760	3			e1
EFR32MG12P432F1024GM48-C	Silicon Labs	SYSTEM ON CHIP

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.