Microchip Technology Other Function uPs,uCs & Peripheral ICs 242

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	No. of Bits	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
MCP25020-I/P	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.5 V	TS 16949	8	3/5	IN-LINE	DIP14,.3	2.7 V	85 Cel	-40 Cel	MATTE TIN	DUAL	4.318 mm	7.62 mm						19.05 mm	CMOS		5 V	Parallel IO Port	2.54 mm	R-PDIP-T14		Not Qualified	e3
USB4640-HZH-03	Microchip Technology	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.3 V	TS 16949		1.2,3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.28SQ,20	1.1 V	70 Cel	0 Cel	MATTE TIN	QUAD	1 mm	7 mm		0	24 MHz			7 mm	CMOS	60 mA	1.2 V	Bus Controllers	.5 mm	S-PQCC-N48		Not Qualified	e3
BM83SM1-00AB	Microchip Technology	PROGRAMMABLE RFSoC		NO LEAD	50	XMA	RECTANGULAR	UNSPECIFIED	YES	4.2 V				MICROELECTRONIC ASSEMBLY		3.2 V	85 Cel	-40 Cel	GOLD OVER NICKEL	UNSPECIFIED	2.5 mm	15 mm					260	32 mm	CMOS		3.8 V		1 mm	R-XXMA-N50	1
MPFS250TFCVG484I	Microchip Technology	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V				GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel	-40 Cel		BOTTOM	2.92 mm	19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY					19 mm	CMOS		1 V		.8 mm	S-PBGA-B484
ATSAM4C16CB-AUR	Microchip Technology	SoC	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.32 V				FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.08 V	85 Cel	-40 Cel	MATTE TIN	QUAD	1.6 mm	14 mm				40	260	14 mm	CMOS		1.2 V		.5 mm	S-PQFP-G100	3		e3
ATSHA204A-STUCZ-T	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR		GULL WING	8	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949			SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TO-236	2 V	85 Cel	-40 Cel	MATTE TIN	DUAL	1.12 mm	1.3 mm				40	260	2.9 mm	CMOS		3.3 V		.95 mm	R-PDSO-G3	1		e3
RN2903A-I/RMSA103	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	47		RECTANGULAR	UNSPECIFIED	YES	3.6 V				MICROELECTRONIC ASSEMBLY		2.1 V	85 Cel	-40 Cel	NICKEL GOLD	UNSPECIFIED	3.34 mm	17.78 mm	SEATED HGT-CALCULATED				250	26.67 mm	CMOS		3.3 V		1.27 mm	R-XXMA-N47			e4
ATECC608A-MAHCZ-S	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2 V	85 Cel	-40 Cel		DUAL	.6 mm	2 mm						3 mm	CMOS				.5 mm	R-PDSO-N8
ATWINC1500-MR210PB1172	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	3.6 V				MICROELECTRONIC ASSEMBLY		2.7 V	85 Cel	-40 Cel		UNSPECIFIED	2.113 mm	14.73 mm						21.72 mm	CMOS		3.3 V			R-XXMA-N28
ATWINC1500-MR210PB1961-T	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	4.2 V				MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	2.113 mm	14.73 mm	SEATED HGT-NOM			NOT SPECIFIED	NOT SPECIFIED	21.72 mm	CMOS		3.6 V			R-XXMA-N28
ATWINC1500-MR210PB	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	4.2 V				MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	2.113 mm	14.73 mm	SEATED HGT-NOM			NOT SPECIFIED	NOT SPECIFIED	21.72 mm	CMOS		3.6 V			R-XXMA-N28
BM83SM1-00AA	Microchip Technology	PROGRAMMABLE RFSoC		NO LEAD	50	XMA	RECTANGULAR	UNSPECIFIED	YES	4.2 V				MICROELECTRONIC ASSEMBLY		3.2 V	85 Cel	-40 Cel	GOLD OVER NICKEL	UNSPECIFIED	2.5 mm	15 mm					260	32 mm	CMOS		3.8 V		1 mm	R-XXMA-N50	1
ATECC508A-MAHDA-S	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	8	HVSON	RECTANGULAR	UNSPECIFIED	YES	5.5 V	TS 16949			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	.6 mm	2 mm				40	260	3 mm	CMOS				.5 mm	R-PDSO-N8	1
ATECC608A-MAHCZ-T	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2 V	85 Cel	-40 Cel		DUAL	.6 mm	2 mm						3 mm	CMOS				.5 mm	R-PDSO-N8
ATWINC1500-MR210PB1976	Microchip Technology	MICROPROCESSOR CIRCUIT		NO LEAD	28	XMA	RECTANGULAR	UNSPECIFIED	YES	4.2 V				MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	2.113 mm	14.73 mm						21.72 mm	CMOS		3.3 V			R-XXMA-N28
USB2660I-JZX-03-TR	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	64	QCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V	TS 16949		3.3	CHIP CARRIER	LCC64,.30SQ,16	3 V	85 Cel	-40 Cel	MATTE TIN	QUAD	.9 mm	7.5 mm						7.5 mm		275 mA	3.3 V	Bus Controllers	.4 mm	S-PQCC-N64		Not Qualified	e3
ATSHA204A-MAHDA-S	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	8	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.08,20	2 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	.6 mm	2 mm				30	260	3 mm	CMOS		3.3 V		.5 mm	R-PQCC-N8	1		e4
ZL30250LDG1	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1.89 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.71 V	85 Cel	-40 Cel		QUAD	1 mm	5 mm	IT ALSO OPERATES AT 3.3V NOMINAL SUPPLY					5 mm	CMOS		1.8 V		.5 mm	S-XQCC-N32
MPFS250T-FCSG536I	Microchip Technology	PROGRAMMABLE SoC		BALL	536	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA536,30X30,20	.97 V	100 Cel	-40 Cel		BOTTOM	1.4 mm	16 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY					16 mm	CMOS		1 V		.5 mm	S-PBGA-B536
ATMXT224S-MAUR036	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	3.47 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.24SQ,14	3 V	85 Cel	-40 Cel		QUAD	.6 mm	6 mm						6 mm	CMOS		3.3 V		.35 mm	S-XQCC-N56
ATSHA204A-XHDA-T	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR		GULL WING	8	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949			SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TSSOP8,.25	2 V	85 Cel	-40 Cel		DUAL	1.2 mm	3 mm						4.4 mm	CMOS		3.3 V		.65 mm	R-PDSO-G8
ATMXT224S-MAUR	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	3.47 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.24SQ,14	1.71 V	85 Cel	-40 Cel		QUAD	.6 mm	6 mm						6 mm	CMOS		1.8 V		.35 mm	S-XQCC-N56
ATWINC1500-MR210PB1140	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	4.2 V				MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	2.113 mm	14.73 mm	SEATED HGT-NOM			NOT SPECIFIED	NOT SPECIFIED	21.72 mm	CMOS		3.6 V			R-XXMA-N28
ATECC608A-SSHCZ-B	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949			SMALL OUTLINE	SOP8,.23	2 V	85 Cel	-40 Cel		DUAL	1.75 mm	3.9 mm						4.9 mm	CMOS				1.27 mm	R-PDSO-G8
BM83SM1-00TA	Microchip Technology	PROGRAMMABLE RFSoC		NO LEAD	50	XMA	RECTANGULAR	UNSPECIFIED	YES	4.2 V				MICROELECTRONIC ASSEMBLY		3.2 V	85 Cel	-40 Cel	GOLD OVER NICKEL	UNSPECIFIED	2.5 mm	15 mm					260	32 mm	CMOS		3.8 V		1 mm	R-XXMA-N50	1
ATMXT224S-MAUR043	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	3.47 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.24SQ,14	3 V	85 Cel	-40 Cel		QUAD	.6 mm	6 mm						6 mm	CMOS		3.3 V		.35 mm	S-XQCC-N56
MCP25050T-I/SL	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949	8	3/5	SMALL OUTLINE	SOP14,.24	2.7 V	85 Cel	-40 Cel	Matte Tin (Sn)	DUAL	1.75 mm	3.9 mm						8.65 mm	CMOS		5 V	Parallel IO Port	1.27 mm	R-PDSO-G14	1	Not Qualified	e3
ATMXT224S-MAUR033	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	3.47 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.24SQ,14	3 V	85 Cel	-40 Cel		QUAD	.6 mm	6 mm						6 mm	CMOS		3.3 V		.35 mm	S-XQCC-N56
MPFS250T-1FCVG484E	Microchip Technology	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V				GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel	0 Cel		BOTTOM	2.92 mm	19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY					19 mm	CMOS		1 V		.8 mm	S-PBGA-B484
M1A3P600L-1FGG484I	Microchip Technology	SoC																	TIN SILVER COPPER							30	250								3
MCP25050-E/SL	Microchip Technology	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949	8	5	SMALL OUTLINE	SOP14,.24	4.5 V	125 Cel	-40 Cel	Matte Tin (Sn)	DUAL	1.75 mm	3.9 mm						8.65 mm	CMOS		5 V	Parallel IO Port	1.27 mm	R-PDSO-G14	1	Not Qualified	e3
MPFS250T-FCG1152E	Microchip Technology	PROGRAMMABLE SoC		BALL	1152	BGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V				GRID ARRAY	BGA1152,34X34,40	.97 V	100 Cel	0 Cel		BOTTOM	2.99 mm	35 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY					35 mm	CMOS		1 V		1 mm	S-PBGA-B1152
MPFS250T-FCG1152I	Microchip Technology	PROGRAMMABLE SoC		BALL	1152	BGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V				GRID ARRAY	BGA1152,34X34,40	.97 V	100 Cel	-40 Cel		BOTTOM	2.99 mm	35 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY					35 mm	CMOS		1 V		1 mm	S-PBGA-B1152
A2F200M3F-CSG288I	Microchip Technology	SoC FPGA		BALL	288	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.575 V				GRID ARRAY, THIN PROFILE, FINE PITCH	BGA288,21X21,20	1.425 V	100 Cel	-40 Cel		BOTTOM	1.05 mm	11 mm						11 mm	CMOS		1.5 V		.5 mm	S-PBGA-B288	3
ATECC608A-SSHCZ-T	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949			SMALL OUTLINE	SOP8,.23	2 V	85 Cel	-40 Cel		DUAL	1.75 mm	3.9 mm						4.9 mm	CMOS				1.27 mm	R-PDSO-G8
ATSHA204A-MAHCZ-T	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	8	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.08,20	2 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	.6 mm	2 mm				40	260	3 mm	CMOS		3.3 V		.5 mm	R-PQCC-N8	1
ATWINC1500B-MU-T	Microchip Technology	NETWORK CONTROLLER	INDUSTRIAL	NO LEAD	40	HQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	2.7 V	85 Cel	-40 Cel	MATTE TIN	QUAD	1 mm	5 mm			48 MHz			5 mm	CMOS		3.3 V		.4 mm	S-PQCC-N40			e3
MCP25050T-E/SL	Microchip Technology	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949	8	5	SMALL OUTLINE	SOP14,.24	4.5 V	125 Cel	-40 Cel	Matte Tin (Sn)	DUAL	1.75 mm	3.9 mm						8.65 mm	CMOS		5 V	Parallel IO Port	1.27 mm	R-PDSO-G14	1	Not Qualified	e3
MPFS250TS-1FCVG484I	Microchip Technology	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V				GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel	-40 Cel		BOTTOM	2.92 mm	19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY					19 mm	CMOS		1 V		.8 mm	S-PBGA-B484
ATWINC1510-MR210PB1961	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	4.2 V				MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	2.113 mm	14.73 mm	SEATED HGT-NOM					21.72 mm	CMOS		3.6 V			R-XXMA-N28
ATSAM4C8CB-AU	Microchip Technology	SoC	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.32 V				FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.08 V	85 Cel	-40 Cel	MATTE TIN	QUAD	1.6 mm	14 mm				40	260	14 mm	CMOS		1.2 V		.5 mm	S-PQFP-G100	3		e3
MCP2221T-I/ST	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949		3.3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP14,.25	3 V	85 Cel	-40 Cel	MATTE TIN	DUAL	1.2 mm	4.4 mm						5 mm	CMOS	15 mA	3.3 V	Serial IO/Communication Controllers	.65 mm	R-PDSO-G14		Not Qualified	e3
MPFS250T-1FCSG536E	Microchip Technology	PROGRAMMABLE SoC		BALL	536	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA536,30X30,20	.97 V	100 Cel	0 Cel		BOTTOM	1.4 mm	16 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY					16 mm	CMOS		1 V		.5 mm	S-PBGA-B536
ATECC608B-TNGTLSU-C	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2 V	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	.6 mm	2 mm		0	1 MHz			3 mm	CMOS				.5 mm	R-PDSO-N8			e4
MPFS250T-1FCG1152E	Microchip Technology	PROGRAMMABLE SoC		BALL	1152	BGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V				GRID ARRAY	BGA1152,34X34,40	.97 V	100 Cel	0 Cel		BOTTOM	2.99 mm	35 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY					35 mm	CMOS		1 V		1 mm	S-PBGA-B1152
MPFS250T-1FCG1152I	Microchip Technology	PROGRAMMABLE SoC		BALL	1152	BGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V				GRID ARRAY	BGA1152,34X34,40	.97 V	100 Cel	-40 Cel		BOTTOM	2.99 mm	35 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY					35 mm	CMOS		1 V		1 mm	S-PBGA-B1152
M1A3PE3000L-1PQG208I	Microchip Technology	SoC																	MATTE TIN							30	245								3
MPFS250TS-FCG1152I	Microchip Technology	PROGRAMMABLE SoC		BALL	1152	BGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V				GRID ARRAY	BGA1152,34X34,40	.97 V	100 Cel	-40 Cel		BOTTOM	2.99 mm	35 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY					35 mm	CMOS		1 V		1 mm	S-PBGA-B1152

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.