Microchip Technology Other Function uPs,uCs & Peripheral ICs 242

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Address Bus Width	DAC Channels	Bit Size	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	DMA Channels	Maximum Seated Height	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	PWM Channels	ROM Programmability	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Speed	JESD-609 Code	No. of I/O Lines
MPFS095TS-FCSG536I	Microchip Technology	PROGRAMMABLE SoC		BALL	536	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA536,30X30,20	.97 V	100 Cel	-40 Cel			BOTTOM		1.4 mm	16 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY					16 mm	CMOS	1 V				.5 mm	S-PBGA-B536
MPFS250TL-FCG1152I	Microchip Technology	SoC FPGA		BALL	1152		RECTANGULAR	PLASTIC/EPOXY	YES									100 Cel	-40 Cel			BOTTOM										CMOS						R-PBGA-B1152
MPFS250TLS-FCG1152I	Microchip Technology	PROGRAMMABLE SoC		BALL	1152	BGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V					GRID ARRAY	BGA1152,34X34,40	.97 V	100 Cel	-40 Cel			BOTTOM		2.99 mm	35 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY					35 mm	CMOS	1 V				1 mm	S-PBGA-B1152
MTCH6102-I/SS	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	TS 16949				SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	1.8 V	85 Cel	-40 Cel	MATTE TIN		DUAL		2 mm	5.3 mm				40	260	10.2 mm	CMOS	3 V				.65 mm	R-PDSO-G28	2		e3
ZL30250LDF1	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1.89 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.71 V	85 Cel	-40 Cel			QUAD		1 mm	5 mm	IT ALSO OPERATES AT 3.3V NOMINAL SUPPLY					5 mm	CMOS	1.8 V				.5 mm	S-XQCC-N32
ATAES132A-MAHER-T	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2.5 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD		DUAL		.6 mm	2 mm				40	260	3 mm	CMOS	3.3 V				.5 mm	R-PDSO-N8	1
ATECC508A-MAHCZ-S	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	8	HVSON	RECTANGULAR	UNSPECIFIED	YES	5.5 V	TS 16949				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD		DUAL		.6 mm	2 mm				40	260	3 mm	CMOS					.5 mm	R-PDSO-N8	1
ATECC508A-SSHCZ-T	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949				SMALL OUTLINE	SOP8,.25	2 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD		DUAL		1.75 mm	3.9 mm				40	260	4.9 mm	CMOS					1.27 mm	R-PDSO-G8	3
ATMXT1189TD-ABI2CVAO	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.47 V	AEC-Q100				FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	3.14 V	105 Cel	-40 Cel			QUAD		1.6 mm	20 mm						20 mm	CMOS	3.3 V				.5 mm	S-PQFP-G144
ATMXT1189TD-ABSPIVAO	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.47 V	AEC-Q100				FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	3.14 V	105 Cel	-40 Cel			QUAD		1.6 mm	20 mm						20 mm	CMOS	3.3 V				.5 mm	S-PQFP-G144
ATMXT1189TD-ATI2CVAO	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.47 V	AEC-Q100				FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	3.14 V	85 Cel	-40 Cel			QUAD		1.6 mm	20 mm						20 mm	CMOS	3.3 V				.5 mm	S-PQFP-G144
ATMXT1189TD-ATRSPIVAO	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.47 V	AEC-Q100				FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	3.14 V	85 Cel	-40 Cel			QUAD		1.6 mm	20 mm						20 mm	CMOS	3.3 V				.5 mm	S-PQFP-G144
ATMXT1189TD-ATSPIVAO	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.47 V	AEC-Q100				FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	3.14 V	85 Cel	-40 Cel			QUAD		1.6 mm	20 mm						20 mm	CMOS	3.3 V				.5 mm	S-PQFP-G144
ATSAM4C16CB-AUT	Microchip Technology	SYSTEM ON CHIP		GULL WING	100	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1.32 V					FLATPACK, THIN PROFILE, FINE PITCH	TQFP100,.63SQ	1.08 V	85 Cel	-40 Cel			QUAD		1.2 mm	14 mm						14 mm	CMOS	1.2 V				.5 mm	S-PQFP-G100
MPFS250T-FCSG536E	Microchip Technology	PROGRAMMABLE SoC		BALL	536	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA536,30X30,20	.97 V	100 Cel	0 Cel			BOTTOM		1.4 mm	16 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY					16 mm	CMOS	1 V				.5 mm	S-PBGA-B536
WP32C2W6NFEI-400B2	Microchip Technology	MICROPROCESSOR CIRCUIT		BALL	896	BGA	SQUARE	PLASTIC/EPOXY	YES						GRID ARRAY	BGA896(UNSPEC)				TIN SILVER COPPER		BOTTOM										CMOS						S-PBGA-B896			e1
ATBTLC1000A-UU-T	Microchip Technology	SoC		BALL	31	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	4.3 V					GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA31,9X7,14	1.8 V	85 Cel	-40 Cel			BOTTOM		.541 mm	2.142 mm						2.282 mm	CMOS	3.6 V				.35 mm	R-PBGA-B31
ATWINC1500-MR210UB1140	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	4.2 V					MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel			UNSPECIFIED		2.113 mm	14.73 mm	SEATED HGT-NOM			NOT SPECIFIED	NOT SPECIFIED	21.72 mm	CMOS	3.6 V					R-XXMA-N28
HSA2-040SAA/A2320A	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.465 V					SMALL OUTLINE	SOP28,.4	3.135 V	85 Cel	-40 Cel	MATTE TIN		DUAL		2.64 mm	7.49 mm						17.87 mm	CMOS	3.3 V			USB	1.27 mm	R-PDSO-G28	1		e3
HS12-100S0S/12SS30	Microchip Technology	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES						SMALL OUTLINE	SOP20,.4		70 Cel	0 Cel			DUAL		2.64 mm	7.49 mm	Touch Screen Microcontroller					12.8 mm	CMOS					1.27 mm	R-PDSO-G20
HSA2-040SCA/A2324	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	28		RECTANGULAR	PLASTIC/EPOXY	YES	3.465 V							3.135 V	85 Cel	-40 Cel	Matte Tin (Sn)		DUAL								250		CMOS	3.3 V					R-PDSO-G28	1		e3
A2F200M3F-1CSG288	Microchip Technology	SoC FPGA		BALL	288	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.575 V					GRID ARRAY, THIN PROFILE, FINE PITCH		1.425 V	85 Cel	0 Cel	TIN SILVER COPPER		BOTTOM										CMOS	1.5 V					S-PBGA-B288	3
AT97SC3204-X2MA-20	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES			0	NO	8	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20		70 Cel	0 Cel	MATTE TIN	NO	QUAD	NO	.9 mm	6 mm		0				6 mm	CMOS	3.3 V	NO	EEPROM		.5 mm	S-XQCC-N40			e3	0
AT97SC3205-U3A15-20	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES			0	NO	8	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25		85 Cel	-40 Cel	MATTE TIN	NO	DUAL	NO	1.1 mm	4.4 mm		0				9.7 mm	CMOS	3.3 V	NO	EEPROM	I2C	.65 mm	R-PDSO-G28		33 rpm	e3	6
ATECC108A-SSHDA-B	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V					SMALL OUTLINE	SOP8,.23	2 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD		DUAL		1.75 mm	3.9 mm				40	260	4.9 mm	CMOS					1.27 mm	R-PDSO-G8	3		e4
ATECC608A-TNGTLSU-G	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V					SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2 V	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		DUAL		.6 mm	2 mm						3 mm	CMOS				I2C	.5 mm	R-PDSO-N8			e4
ATMXT1067TD-ABRI2CVAO	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		GULL WING	128	TFQFP	SQUARE	PLASTIC/EPOXY	YES	3.47 V	AEC-Q100				FLATPACK, THIN PROFILE, FINE PITCH	TQFP128,.63SQ,16	3.14 V	105 Cel	-40 Cel			QUAD		1.2 mm	14 mm						14 mm	CMOS	3.3 V				.4 mm	S-PQFP-G128	3
ATMXT224E-MAHR030	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.47 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	85 Cel	-40 Cel			QUAD		.6 mm	7 mm						7 mm	CMOS	1.8 V				.4 mm	S-PQCC-N48
ATMXT224T-CCU027	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		BALL	64	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.47 V					GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA64,8X8,20	3 V	85 Cel	-40 Cel			BOTTOM		.6 mm	5 mm						5 mm	CMOS	3.3 V				.5 mm	S-PBGA-B64
ATMXT224T-MAU023	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS																														CMOS
ATMXT224T-MAUR	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS																														CMOS
ATMXT224T-MAUR041	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS																														CMOS
ATMXT540E-ATR	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		GULL WING	100	TFQFP	SQUARE	PLASTIC/EPOXY	YES	3.47 V					FLATPACK, THIN PROFILE, FINE PITCH	TQFP100,.63SQ	2.57 V	85 Cel	-40 Cel			QUAD		1.2 mm	14 mm						14 mm	CMOS	2.7 V				.5 mm	S-PQFP-G100
ATMXT640T-CCU035	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		BALL	84	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.47 V					GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA84,10X10,20	3 V	85 Cel	-40 Cel			BOTTOM		.6 mm	6 mm						6 mm	CMOS	3.3 V				.5 mm	S-PBGA-B84
ATMXT641TD-ABR	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		GULL WING	100	TFQFP	SQUARE	PLASTIC/EPOXY	YES	3.47 V	AEC-Q100; TS 16949				FLATPACK, THIN PROFILE, FINE PITCH	TQFP100,.63SQ	3.14 V	105 Cel	-40 Cel			QUAD		1.2 mm	14 mm						14 mm	CMOS	3.3 V				.5 mm	S-PQFP-G100
ATSAM4C32CA-AU	Microchip Technology	SoC	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.32 V					FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.08 V	85 Cel	-40 Cel	MATTE TIN		QUAD		1.6 mm	14 mm				40	260	14 mm	CMOS	1.2 V				.5 mm	S-PQFP-G100	3		e3
ATSHA204A-SSHCZ-T	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR		GULL WING	3	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949				SMALL OUTLINE	SOP8,.25	2 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD		DUAL		1.75 mm	3.9 mm						4.9 mm	CMOS	3.3 V				1.27 mm	R-PDSO-G8
ATTPM20P-G6MA1-10	Microchip Technology	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	3.3 V	TS 16949				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	1.8 V	70 Cel	0 Cel			DUAL		.6 mm	2 mm						3 mm	CMOS				SPI	.5 mm	R-PDSO-N8
ATWILC1000B-MU-Y	Microchip Technology	SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16		85 Cel	-40 Cel	MATTE TIN		QUAD		1 mm	5 mm						5 mm	CMOS	1.1 V				.4 mm	S-XQCC-N40
ATWINC1510B-MU-Y042	Microchip Technology	NETWORK CONTROLLER	INDUSTRIAL	NO LEAD	40	HQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	2.7 V	85 Cel	-40 Cel	MATTE TIN		QUAD		1 mm	5 mm			48 MHz			5 mm	CMOS	3.3 V				.4 mm	S-PQCC-N40			e3
ATWINC3400-MR210CA131-T	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	36		RECTANGULAR	UNSPECIFIED	YES	4.2 V					MICROELECTRONIC ASSEMBLY		2.5 V	85 Cel	-40 Cel			UNSPECIFIED		2.0874 mm	14.732 mm	SEATED HGT-CALCULATED			NOT SPECIFIED	NOT SPECIFIED	22.3774 mm	CMOS	3.6 V				1.204 mm	R-XXMA-N36
CEC1712H-S2-I/SX	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	84	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.89 V					GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA84,10X10,25	1.71 V	85 Cel	-40 Cel			BOTTOM		.8 mm	7 mm	3.3V NOM SUPPLY ALSO AVAILABLE					7 mm	CMOS	1.8 V			I2C, QSPI, UART	.65 mm	S-PBGA-B84
HSA2-040SCA/A2320A	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	28		RECTANGULAR	PLASTIC/EPOXY	YES	3.465 V							3.135 V	85 Cel	-40 Cel	MATTE TIN		DUAL								250		CMOS	3.3 V					R-PDSO-G28	1		e3
HSA2-040SCA/A2324TR	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.465 V					SMALL OUTLINE		3.135 V	85 Cel	-40 Cel	Matte Tin (Sn)		DUAL								250		CMOS	3.3 V					R-PDSO-G28	1		e3
M1A3PE3000L-FGG896	Microchip Technology	SoC																		TIN SILVER COPPER									30	245									3
MEC1418-I/SZ	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	144	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V					GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2 V	85 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM		.8 mm	9 mm						9 mm	CMOS	3 V				.65 mm	S-PBGA-B144			e1
MEC1705Q-C2-I/SZ	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	144	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.89 V					GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.71 V	85 Cel	-40 Cel			BOTTOM		.8 mm	9 mm	ALSO OPERATES AT 3.3V NOMINAL SUPPLY VOLTAGE					9 mm	CMOS	1.8 V				.65 mm	S-PBGA-B144
SCH3106-NU	Microchip Technology	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	128	TFQFP	SQUARE	PLASTIC/EPOXY	YES	3.63 V					FLATPACK, THIN PROFILE, FINE PITCH		2.97 V	70 Cel	0 Cel	MATTE TIN		QUAD		1.2 mm	14 mm						14 mm	CMOS	3.3 V				.4 mm	S-PQFP-G128			e3

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.