Microchip Technology Other Function uPs,uCs & Peripheral ICs 242

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	No. of Bits	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
ATWILC1000B-UU-T	Microchip Technology	SoC		BALL	55	VFBGA	SQUARE	PLASTIC/EPOXY	YES					GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA55,8X8,14		85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	.589 mm	3.24 mm						3.24 mm	CMOS	1.1 V			.35 mm	S-PBGA-B55
ATWINC3400-MR210CA143	Microchip Technology	MICROPROCESSOR CIRCUIT
ECE1200-I/LD	Microchip Technology	MICROPROCESSOR CIRCUIT		NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.89 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	1.71 V	85 Cel	-40 Cel		QUAD	.9 mm	5 mm						5 mm	CMOS	1.8 V			.4 mm	S-PQCC-N40
M1A3P1000L-1FG256I	Microchip Technology	SoC
MEC1521H-B0-I/SZ	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	144	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.89 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA144,13X13,25	1.71 V	85 Cel	-40 Cel		BOTTOM	.8 mm	9 mm	ALSO OPERATES AT 3.3V NOMINAL VOLATGE	0	.032768 MHz			9 mm	CMOS	1.8 V		I2C, ESPI, UART	.65 mm	S-PBGA-B144
MEC1521H-B0-I/SZ-TR	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	144	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.89 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA144,13X13,25	1.71 V	85 Cel	-40 Cel		BOTTOM	.8 mm	9 mm	ALSO OPERATES AT 3.3V NOMINAL VOLATGE	0	.032768 MHz			9 mm	CMOS	1.8 V		I2C, ESPI, UART	.65 mm	S-PBGA-B144
MPFS025T-1FCSG325E	Microchip Technology	PROGRAMMABLE SoC		BALL	325		RECTANGULAR	PLASTIC/EPOXY	YES	1.03 V						.97 V	100 Cel	0 Cel		BOTTOM			ALSO OPERATES AT 1.05V NOMINAL SUPPLY						CMOS	1 V				R-PBGA-B325
MPFS025T-1FCVG484E	Microchip Technology	PROGRAMMABLE SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V				GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel	0 Cel		BOTTOM	2.92 mm	19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY					19 mm	CMOS	1 V			.8 mm	S-PBGA-B484
MPFS025T-1FCVG484I	Microchip Technology	PROGRAMMABLE SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V				GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel	-40 Cel		BOTTOM	2.92 mm	19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY					19 mm	CMOS	1 V			.8 mm	S-PBGA-B484
MPFS025T-FCSG325E	Microchip Technology	PROGRAMMABLE SoC		BALL	325		RECTANGULAR	PLASTIC/EPOXY	YES	1.03 V						.97 V	100 Cel	0 Cel		BOTTOM			ALSO OPERATES AT 1.05V NOMINAL SUPPLY						CMOS	1 V				R-PBGA-B325
MPFS025T-FCSG325I	Microchip Technology	PROGRAMMABLE SoC		BALL	325		RECTANGULAR	PLASTIC/EPOXY	YES	1.03 V						.97 V	100 Cel	-40 Cel		BOTTOM			ALSO OPERATES AT 1.05V NOMINAL SUPPLY						CMOS	1 V				R-PBGA-B325
MPFS095T-1FCSG536E	Microchip Technology	PROGRAMMABLE SoC		BALL	536	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA536,30X30,20	.97 V	100 Cel	0 Cel		BOTTOM	1.4 mm	16 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY					16 mm	CMOS	1 V			.5 mm	S-PBGA-B536
MPFS095T-1FCVG484I	Microchip Technology	PROGRAMMABLE SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V				GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel	-40 Cel		BOTTOM	2.92 mm	19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY					19 mm	CMOS	1 V			.8 mm	S-PBGA-B484
MPFS160T-1FCVG484I	Microchip Technology	PROGRAMMABLE SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V				GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel	-40 Cel		BOTTOM	2.92 mm	19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY					19 mm	CMOS	1 V			.8 mm	S-PBGA-B484
MPFS160T-1FCVG784E	Microchip Technology	PROGRAMMABLE SoC		BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V				GRID ARRAY, FINE PITCH	BGA784,28X28,32	.97 V	100 Cel	0 Cel		BOTTOM	2.92 mm	23 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY					23 mm	CMOS	1 V			.8 mm	S-PBGA-B784
MPFS160TS-FCVG484I	Microchip Technology	PROGRAMMABLE SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V				GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel	-40 Cel		BOTTOM	2.92 mm	19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY					19 mm	CMOS	1 V			.8 mm	S-PBGA-B484
PIC32CX1012BZ25048-I/MYX	Microchip Technology	SoC
PIC32MZ1025W104132-I/NX	Microchip Technology	SoC	INDUSTRIAL
A2F200M3F-1FGG256I	Microchip Technology	SoC FPGA																	TIN SILVER COPPER							30	250								3
A2F200M3F-CS288I	Microchip Technology	SoC FPGA																	TIN LEAD SILVER
AT32UC3A4256HHB-C1UR	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	100	VFBGA	SQUARE	PLASTIC/EPOXY	YES					GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA100,10X10,25		85 Cel	-40 Cel		BOTTOM	1 mm	7 mm						7 mm	CMOS	3.3 V			.65 mm	S-PBGA-B100
ATAES132A-SHEQ-B	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949			SMALL OUTLINE	SOP8,.25	2.5 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	1.75 mm	3.9 mm						4.9 mm	CMOS	3.3 V			1.27 mm	R-PDSO-G8	3
ATAES132A-SHEQ-T	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949			SMALL OUTLINE	SOP8,.25	2.5 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	1.75 mm	3.9 mm						4.9 mm	CMOS	3.3 V			1.27 mm	R-PDSO-G8
ATAES132A-SHER-T	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949			SMALL OUTLINE	SOP8,.25	2.5 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	1.75 mm	3.9 mm					260	4.9 mm	CMOS	3.3 V			1.27 mm	R-PDSO-G8	1
ATECC108A-SSHDA-T	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V				SMALL OUTLINE	SOP8,.23	2 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	1.75 mm	3.9 mm				40	260	4.9 mm	CMOS				1.27 mm	R-PDSO-G8	3		e4
ATECC608A-TFLXTLSS	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V				SMALL OUTLINE	SOP8,.23	2 V	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	1.75 mm	3.9 mm						4.9 mm	CMOS				1.27 mm	R-PDSO-G8			e4
ATECC608B-MAVDA-S	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2 V	100 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	.6 mm	2 mm				30	260	3 mm	CMOS			I2C	.5 mm	R-PDSO-N8	1		e4
ATECC608B-TFLXTLSS-PROTO	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V				SMALL OUTLINE	SOP8,.23	2 V	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	1.75 mm	3.9 mm		0	1 MHz			4.9 mm	CMOS				1.27 mm	R-PDSO-G8			e4
ATECC608B-TFLXTLSU	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2 V	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	.6 mm	2 mm		0	1 MHz			3 mm	CMOS				.5 mm	R-PDSO-N8			e4
ATMXT640UD-CCU001	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		BALL	88	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.47 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA88,10X10,20	3.14 V	85 Cel	-40 Cel		BOTTOM	.6 mm	6 mm						6 mm	CMOS	3.3 V			.5 mm	S-PBGA-B88
ATSAM4C16CB-AUTR	Microchip Technology	SYSTEM ON CHIP		GULL WING	100	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1.32 V				FLATPACK, THIN PROFILE, FINE PITCH	TQFP100,.63SQ	1.08 V	85 Cel	-40 Cel		QUAD	1.2 mm	14 mm						14 mm	CMOS	1.2 V			.5 mm	S-PQFP-G100
ATTPM20P-H6MA1-10	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES		TS 16949			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20		85 Cel	-40 Cel		DUAL	.6 mm	2 mm						3 mm	CMOS	3.3 V		SPI	.5 mm	R-PDSO-N8
ATTPM20P-H6MA1-10-B	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES		TS 16949			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20		85 Cel	-40 Cel		DUAL	.6 mm	2 mm						3 mm	CMOS	3.3 V		SPI	.5 mm	R-PDSO-N8
ATWINC1500-MR210UB1976	Microchip Technology	MICROPROCESSOR CIRCUIT		NO LEAD	28	XMA	RECTANGULAR	UNSPECIFIED	YES	4.2 V				MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	2.113 mm	14.73 mm						21.72 mm	CMOS	3.3 V				R-XXMA-N28
ATWINC1510-MR210PB1944	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	3.6 V				MICROELECTRONIC ASSEMBLY		2.7 V	85 Cel	-40 Cel		UNSPECIFIED	2.113 mm	14.73 mm						21.72 mm	CMOS	3.3 V				R-XXMA-N28
ATWINC1510-MR210PB1954	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	3.6 V				MICROELECTRONIC ASSEMBLY		2.7 V	85 Cel	-40 Cel		UNSPECIFIED	2.113 mm	14.73 mm						21.72 mm	CMOS	3.3 V				R-XXMA-N28
ATWINC1510-MR210PB1963	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	4.2 V				MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	2.113 mm	14.73 mm	SEATED HGT-NOM					21.72 mm	CMOS	3.6 V				R-XXMA-N28
ATWINC1510-MR210PB1963-T	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	3.6 V	TS 16949			MICROELECTRONIC ASSEMBLY		2.7 V	85 Cel	-40 Cel		UNSPECIFIED									CMOS	3.3 V		I2C, SPI		R-XXMA-N28
ATWINC1510-MR210PB1976	Microchip Technology	MICROPROCESSOR CIRCUIT		NO LEAD	28	XMA	RECTANGULAR	UNSPECIFIED	YES	4.2 V				MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	2.113 mm	14.73 mm						21.72 mm	CMOS	3.3 V				R-XXMA-N28
ATWINC1510B-MU-Y	Microchip Technology	NETWORK CONTROLLER	INDUSTRIAL	NO LEAD	40	HQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	2.7 V	85 Cel	-40 Cel	MATTE TIN	QUAD	1 mm	5 mm			48 MHz			5 mm	CMOS	3.3 V			.4 mm	S-PQCC-N40			e3
ATWINC3400-MR210UA122	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	36		RECTANGULAR	UNSPECIFIED	YES	4.2 V				MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	2.087 mm	14.732 mm	SEATED HGT-CALCULATED			NOT SPECIFIED	NOT SPECIFIED	22.428 mm	CMOS	3.6 V			1.204 mm	R-XXMA-N36
M1A3P1000L-1FGG256	Microchip Technology	SoC																	TIN SILVER COPPER							30	250								3
M1A3P600L-1FG144I	Microchip Technology	SoC
M1A3P600L-FG484I	Microchip Technology	SoC
M1A3PE3000L-PQG208	Microchip Technology	SoC																	MATTE TIN							30	245								3
MCP25025-I/SL	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949	8	3/5	SMALL OUTLINE	SOP14,.24	2.7 V	85 Cel	-40 Cel	Matte Tin (Sn)	DUAL	1.75 mm	3.9 mm						8.65 mm	CMOS	5 V	Parallel IO Port		1.27 mm	R-PDSO-G14	1	Not Qualified	e3
MCP25025T-I/SL	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949	8	3/5	SMALL OUTLINE	SOP14,.24	2.7 V	85 Cel	-40 Cel	Matte Tin (Sn)	DUAL	1.75 mm	3.9 mm						8.65 mm	CMOS	5 V	Parallel IO Port		1.27 mm	R-PDSO-G14	1	Not Qualified	e3
MPFS095TL-FCSG536E	Microchip Technology	PROGRAMMABLE SoC		BALL	536	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA536,30X30,20	.97 V	100 Cel	0 Cel		BOTTOM	1.4 mm	16 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY					16 mm	CMOS	1 V			.5 mm	S-PBGA-B536

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.