Microchip Technology Other Function uPs,uCs & Peripheral ICs 242

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	No. of Bits	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
ATWINC1500B-MU-Y	Microchip Technology	NETWORK CONTROLLER	INDUSTRIAL	NO LEAD	40	HQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	2.7 V	85 Cel	-40 Cel	MATTE TIN	QUAD	1 mm	5 mm			48 MHz			5 mm	CMOS	3.3 V			.4 mm	S-PQCC-N40			e3
WBZ451PE-I	Microchip Technology	SoC
AR1100T-I/MQ	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.465 V	TS 16949			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.20SQ,25	3.135 V	85 Cel	-40 Cel	MATTE TIN	QUAD	1 mm	5 mm	ALSO OPERATES AT 5V SUPPLY					5 mm	CMOS	3.3 V			.65 mm	S-PQCC-N20			e3
ATMXT641TD-ATR	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		GULL WING	100	TFQFP	SQUARE	PLASTIC/EPOXY	YES	3.47 V	AEC-Q100; TS 16949			FLATPACK, THIN PROFILE, FINE PITCH	TQFP100,.63SQ	3.14 V	85 Cel	-40 Cel		QUAD	1.2 mm	14 mm						14 mm	CMOS	3.3 V			.5 mm	S-PQFP-G100
ATTPM20P-G3MA1-10-B	Microchip Technology	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	3.3 V	TS 16949			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.11,20	1.8 V	70 Cel	0 Cel		DUAL	.6 mm	2 mm						3 mm	CMOS			SPI	.5 mm	R-PDSO-N8
M1A3P600L-1FGG144I	Microchip Technology	SoC																	TIN SILVER COPPER							30	260								3
MPFS250T-1FCSG536I	Microchip Technology	PROGRAMMABLE SoC		BALL	536	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA536,30X30,20	.97 V	100 Cel	-40 Cel		BOTTOM	1.4 mm	16 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY					16 mm	CMOS	1 V			.5 mm	S-PBGA-B536
MPFS250T-1FCVG784I	Microchip Technology	PROGRAMMABLE SoC		BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V				GRID ARRAY, FINE PITCH	BGA784,28X28,32	.97 V	100 Cel	-40 Cel		BOTTOM	2.92 mm	23 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY					23 mm	CMOS	1 V			.8 mm	S-PBGA-B784
ATECC608B-TNGTLSU-G	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2 V	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	.6 mm	2 mm		0	1 MHz			3 mm	CMOS				.5 mm	R-PDSO-N8			e4
MPFS025T-FCVG484I	Microchip Technology	PROGRAMMABLE SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V				GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel	-40 Cel		BOTTOM	2.92 mm	19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY					19 mm	CMOS	1 V			.8 mm	S-PBGA-B484
A2F200M3F-FGG256I	Microchip Technology	SoC FPGA		BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	1.575 V				GRID ARRAY, LOW PROFILE		1.425 V	100 Cel	-40 Cel	MATTE TIN	BOTTOM						30	250		CMOS	1.5 V				S-PBGA-B256	3
ATECC608A-MAHK2-S	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2 V	85 Cel	-40 Cel		DUAL	.6 mm	2 mm						3 mm	CMOS				.5 mm	R-PDSO-N8
ATECC608B-TNGTLSU-B	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2 V	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	.6 mm	2 mm		0	1 MHz			3 mm	CMOS				.5 mm	R-PDSO-N8			e4
ATSAM4C8CB-AUR	Microchip Technology	SoC	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.32 V				FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.08 V	85 Cel	-40 Cel	MATTE TIN	QUAD	1.6 mm	14 mm				40	260	14 mm	CMOS	1.2 V			.5 mm	S-PQFP-G100	3		e3
MPFS250TFCVG484E	Microchip Technology	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V				GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel	0 Cel		BOTTOM	2.92 mm	19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY					19 mm	CMOS	1 V			.8 mm	S-PBGA-B484
TA100-Y230C2X01-00T-VAO	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100			SMALL OUTLINE	SOP8,.23	2.7 V	125 Cel	-40 Cel		DUAL	1.75 mm	3.9 mm						4.9 mm	CMOS				1.27 mm	R-PDSO-G8
ATECC608B-RBHCZ-T	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	3	VBCC	RECTANGULAR	UNSPECIFIED	YES	5.5 V				CHIP CARRIER, VERY THIN PROFILE		2 V	85 Cel	-40 Cel		BOTTOM	.55 mm	2.5 mm						6.5 mm	CMOS			1-WIRE	2 mm	R-XBCC-N3
ATSAM4C8CB-AUT	Microchip Technology	SYSTEM ON CHIP		GULL WING	100	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1.32 V				FLATPACK, THIN PROFILE, FINE PITCH	TQFP100,.63SQ	1.08 V	85 Cel	-40 Cel		QUAD	1.2 mm	14 mm						14 mm	CMOS	1.2 V			.5 mm	S-PQFP-G100
ATSAM4C8CB-AUTR	Microchip Technology	SYSTEM ON CHIP		GULL WING	100	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1.32 V				FLATPACK, THIN PROFILE, FINE PITCH	TQFP100,.63SQ	1.08 V	85 Cel	-40 Cel		QUAD	1.2 mm	14 mm						14 mm	CMOS	1.2 V			.5 mm	S-PQFP-G100
ATWINC1510-MR210PB	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	4.2 V				MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	2.113 mm	14.73 mm	SEATED HGT-NOM			NOT SPECIFIED	NOT SPECIFIED	21.72 mm	CMOS	3.6 V				R-XXMA-N28
BM83SM1-00TB	Microchip Technology	PROGRAMMABLE RFSoC		NO LEAD	50	XMA	RECTANGULAR	UNSPECIFIED	YES	4.2 V				MICROELECTRONIC ASSEMBLY		3.2 V	85 Cel	-40 Cel		UNSPECIFIED	2.5 mm	15 mm						32 mm	CMOS	3.8 V			1 mm	R-XXMA-N50
ATAES132A-SHER-B	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949			SMALL OUTLINE	SOP8,.25	2.5 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	1.75 mm	3.9 mm					260	4.9 mm	CMOS	3.3 V			1.27 mm	R-PDSO-G8	1
ATMXT640U-CCU023	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		BALL	88	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.47 V	TS 16949			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA88,10X10,20	2.7 V	85 Cel	-40 Cel		BOTTOM	.6 mm	6 mm				30	260	6 mm	CMOS	3.3 V			.5 mm	S-PBGA-B88
ATWINC3400-MR210CA122-T	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	36		RECTANGULAR	UNSPECIFIED	YES	4.2 V				MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	2.087 mm	14.732 mm	SEATED HGT-CALCULATED			NOT SPECIFIED	NOT SPECIFIED	22.428 mm	CMOS	3.6 V			1.204 mm	R-XXMA-N36
IS2083BM-232	Microchip Technology	PROGRAMMABLE RFSoC		BALL	82	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA82,10X10,20	1.14 V	85 Cel	-40 Cel		BOTTOM	.9 mm	5.5 mm						5.5 mm	CMOS	1.2 V			.5 mm	S-PBGA-B82
IS2083BM-232-TRAY	Microchip Technology	PROGRAMMABLE RFSoC		BALL	82	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA82,10X10,20	1.14 V	85 Cel	-40 Cel		BOTTOM	.9 mm	5.5 mm						5.5 mm	CMOS	1.2 V			.5 mm	S-PBGA-B82
MPFS095TLS-FCSG325I	Microchip Technology	PROGRAMMABLE SoC		BALL	325		RECTANGULAR	PLASTIC/EPOXY	YES	1.03 V						.97 V	100 Cel	-40 Cel		BOTTOM			ALSO OPERATES AT 1.05V NOMINAL SUPPLY						CMOS	1 V				R-PBGA-B325
ATMXT1189TD-ABRI2CVAO	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.47 V	AEC-Q100			FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	3.14 V	105 Cel	-40 Cel		QUAD	1.6 mm	20 mm						20 mm	CMOS	3.3 V			.5 mm	S-PQFP-G144
ATWINC1500B-MU-T042	Microchip Technology	NETWORK CONTROLLER	INDUSTRIAL	NO LEAD	40	HQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	2.7 V	85 Cel	-40 Cel	MATTE TIN	QUAD	1 mm	5 mm			48 MHz			5 mm	CMOS	3.3 V			.4 mm	S-PQCC-N40			e3
ATWINC1500B-MU-Y042	Microchip Technology	NETWORK CONTROLLER	INDUSTRIAL	NO LEAD	40	HQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	2.7 V	85 Cel	-40 Cel	MATTE TIN	QUAD	1 mm	5 mm			48 MHz			5 mm	CMOS	3.3 V			.4 mm	S-PQCC-N40			e3
MPFS095TLS-FCVG484I	Microchip Technology	PROGRAMMABLE SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V				GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel	-40 Cel		BOTTOM	2.92 mm	19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY					19 mm	CMOS	1 V			.8 mm	S-PBGA-B484
A2F200M3F-FG484	Microchip Technology	SoC FPGA		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1.575 V				GRID ARRAY		1.425 V	85 Cel	0 Cel	TIN LEAD	BOTTOM									CMOS	1.5 V				S-PBGA-B484	3
ATSAMHA1E14A-MBT-BVAO	Microchip Technology	SoC	INDUSTRIAL
ATWINC1500-MR210UB	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	4.2 V				MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel	MATTE TIN	UNSPECIFIED	2.113 mm	14.73 mm	SEATED HGT-NOM					21.72 mm	CMOS	3.6 V				R-XXMA-N28			e3
M1A3P600L-1FGG484	Microchip Technology	SoC																	TIN SILVER COPPER							30	250								3
M1A3PE3000L-1PQG208	Microchip Technology	SoC																	MATTE TIN							30	245								3
MCP25055-I/P	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.5 V	TS 16949	8	3/5	IN-LINE	DIP14,.3	2.7 V	85 Cel	-40 Cel	MATTE TIN	DUAL	4.318 mm	7.62 mm						19.05 mm	CMOS	5 V	Parallel IO Port		2.54 mm	R-PDIP-T14		Not Qualified	e3
MCP25055-I/SL	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949	8	3/5	SMALL OUTLINE	SOP14,.24	2.7 V	85 Cel	-40 Cel	Matte Tin (Sn)	DUAL	1.75 mm	3.9 mm						8.65 mm	CMOS	5 V	Parallel IO Port		1.27 mm	R-PDSO-G14	1	Not Qualified	e3
MCP25055T-I/SL	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949	8	3/5	SMALL OUTLINE	SOP14,.24	2.7 V	85 Cel	-40 Cel	Matte Tin (Sn)	DUAL	1.75 mm	3.9 mm						8.65 mm	CMOS	5 V	Parallel IO Port		1.27 mm	R-PDSO-G14	1	Not Qualified	e3
MPFS095T-1FCVG784I	Microchip Technology	PROGRAMMABLE SoC		BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V				GRID ARRAY, FINE PITCH	BGA784,28X28,32	.97 V	100 Cel	-40 Cel		BOTTOM	2.92 mm	23 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY					23 mm	CMOS	1 V			.8 mm	S-PBGA-B784
A2F200M3F-1FG484I	Microchip Technology	SoC FPGA		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1.575 V				GRID ARRAY		1.425 V	100 Cel	-40 Cel	TIN LEAD	BOTTOM									CMOS	1.5 V				S-PBGA-B484	3
A2F200M3F-FG256I	Microchip Technology	SoC FPGA																	TIN LEAD																3
AR1100T-I/SO	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.465 V	TS 16949			SMALL OUTLINE	SOP20,.4	3.135 V	85 Cel	-40 Cel	MATTE TIN	DUAL	2.65 mm	7.5 mm	ALSO OPERATES AT 5V SUPPLY					12.8 mm	CMOS	3.3 V			1.27 mm	R-PDSO-G20		Not Qualified	e3
ATECC108A-MAHDA-T	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	.6 mm	2 mm				40	260	3 mm	CMOS				.5 mm	R-PDSO-N8	1		e4
ATECC508A-RBHCZ-T	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	3	LGA	RECTANGULAR	UNSPECIFIED	YES	5.5 V	TS 16949			GRID ARRAY		2 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	.55 mm	2.5 mm						6.5 mm	CMOS				2 mm	R-XLGA-N3
ATECC608B-TNGTLSS-G	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V				SMALL OUTLINE	SOP8,.23	2 V	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	1.75 mm	3.9 mm		0	1 MHz			4.9 mm	CMOS				1.27 mm	R-PDSO-G8			e4
ATMXT641TD-ATR081	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		GULL WING	100	TFQFP	SQUARE	PLASTIC/EPOXY	YES	3.47 V	AEC-Q100; TS 16949			FLATPACK, THIN PROFILE, FINE PITCH	TQFP100,.63SQ	3.14 V	85 Cel	-40 Cel		QUAD	1.2 mm	14 mm						14 mm	CMOS	3.3 V			.5 mm	S-PQFP-G100
ATMXT641TD-ATRVA1	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		GULL WING	100	TFQFP	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100; TS 16949			FLATPACK, THIN PROFILE, FINE PITCH	TQFP100,.63SQ		85 Cel	-40 Cel		QUAD	1.2 mm	14 mm						14 mm	CMOS	3.3 V			.5 mm	S-PQFP-G100

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.