Other Function uPs,uCs & Peripheral ICs

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

XAM1806BZWTD4

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.35 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.25 V

BOTTOM

1.4 mm

16 mm

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

16 mm

CMOS

1.3 V

.8 mm

S-PBGA-B361

Not Qualified

UC1903DW

Texas Instruments

TIM99612J

Texas Instruments

COMMERCIAL

THROUGH-HOLE

40

DIP

RECTANGULAR

CERAMIC

NO

5

IN-LINE

DIP40,.6

70 Cel

0 Cel

DUAL

TTL

5 V

Other uPs/uCs/Peripheral ICs

2.54 mm

R-XDIP-T40

Not Qualified

FPD85310VJD

Texas Instruments

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

100

TFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

FLATPACK, THIN PROFILE, FINE PITCH

3 V

70 Cel

0 Cel

QUAD

1.2 mm

14 mm

14 mm

CMOS

3.3 V

.5 mm

S-PQFP-G100

CC2540F128RHAT

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.24SQ,20

2 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1 mm

8

6 mm

COMPARATORS, TIMER(4)

30

260

6 mm

8192

CMOS

3 V

Other uPs/uCs/Peripheral ICs

SPI; USART; USB

.5 mm

S-PQCC-N40

3

Not Qualified

e4

21

XDLPC230TZDQQ1

Texas Instruments

MICROPROCESSOR CIRCUIT

AEC-Q100

DRA746BPGABCRQ1

Texas Instruments

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

760

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.2 V

AEC-Q100

GRID ARRAY, FINE PITCH

1.11 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.96 mm

23 mm

64

32 MHz

30

250

23 mm

CMOS

1.15 V

CAN; I2C; SPI; UART; USB

.8 mm

S-PBGA-B760

3

1500 rpm

e1

SNJ54LVT8996FK

Texas Instruments

MICROPROCESSOR CIRCUIT

MILITARY

NO LEAD

28

QCCN

SQUARE

CERAMIC

YES

38535Q/M;38534H;883B

3.3

CHIP CARRIER

LCC28,.45SQ

125 Cel

-55 Cel

QUAD

BICMOS

3.3 V

Other Microprocessor ICs

1.27 mm

S-XQCC-N28

Not Qualified

TFB2022AM

Texas Instruments

MICROPROCESSOR CIRCUIT

MILITARY

FLAT

256

QFF

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

FLATPACK

125 Cel

-55 Cel

QUAD

CMOS

5 V

S-CQFP-F256

Not Qualified

DRA782BDGABFQ1

Texas Instruments

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

367

BGA

SQUARE

PLASTIC/EPOXY

YES

1.11 V

AEC-Q100

GRID ARRAY

1.02 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.82 mm

15 mm

48

32 MHz

30

250

15 mm

CMOS

1.06 V

CAN; I2C; SPI; UART

.65 mm

S-PBGA-B367

3

e1

PCI6050PDV

Texas Instruments

UC1871Q

Texas Instruments

CP3SP33SMR/NOPB

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

144

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.98 V

16

1.8

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA144,12X12,32

1.62 V

85 Cel

CR16C

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

10 mm

30

260

10 mm

32768

CMOS

200 mA

1.8 V

Microcontrollers

.8 mm

S-PBGA-B144

3

Not Qualified

96 rpm

e1

CC2540F256RHAT

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.24SQ,20

2 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1 mm

8

6 mm

COMPARATORS, TIMER(4)

30

260

6 mm

8192

CMOS

3 V

Other uPs/uCs/Peripheral ICs

SPI; USART; USB

.5 mm

S-PQCC-N40

3

Not Qualified

e4

21

AWR1642ABISABLRQ1

Texas Instruments

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

161

TFBGA

SQUARE

PLASTIC/EPOXY

YES

1.32 V

AEC-Q100

GRID ARRAY, THIN PROFILE, FINE PITCH

1.14 V

125 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

1.17 mm

10.4 mm

NOT SPECIFIED

260

10.4 mm

1572864

CMOS

1.2 V

.65 mm

S-PBGA-B161

3

e1

AM1806BZWTD3

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.35 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.25 V

BOTTOM

1.4 mm

16 mm

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

16 mm

CMOS

1.3 V

.8 mm

S-PBGA-B361

Not Qualified

AWR1642ABISABLQ1

Texas Instruments

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

161

TFBGA

SQUARE

PLASTIC/EPOXY

YES

1.32 V

AEC-Q100

GRID ARRAY, THIN PROFILE, FINE PITCH

1.14 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.17 mm

10.4 mm

30

260

10.4 mm

1572864

CMOS

1.2 V

.65 mm

S-PBGA-B161

3

e1

POMAPL132BZWT2E

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.32 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.14 V

BOTTOM

1.4 mm

16 mm

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

16 mm

CMOS

1.2 V

.8 mm

S-PBGA-B361

Not Qualified

TMS9902AJDL-40

Texas Instruments

COMMERCIAL

THROUGH-HOLE

18

DIP

RECTANGULAR

CERAMIC

NO

IN-LINE

DIP18,.3

70 Cel

0 Cel

DUAL

MOS

Other Microprocessor ICs

2.54 mm

R-XDIP-T18

Not Qualified

SN74LVT8996IPWREP

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

24

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

3/3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP24,.25

2.7 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

1.2 mm

4.4 mm

0

30

260

7.8 mm

BICMOS

3.3 V

Other Microprocessor ICs

.65 mm

R-PDSO-G24

1

Not Qualified

e4

SN54AS891

Texas Instruments

TMS9903NL

Texas Instruments

COMMERCIAL

THROUGH-HOLE

20

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

IN-LINE

DIP20,.3

70 Cel

0 Cel

DUAL

MOS

Other Microprocessor ICs

2.54 mm

R-PDIP-T20

Not Qualified

SN74LS610N1

Texas Instruments

COMMERCIAL

THROUGH-HOLE

40

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

IN-LINE

DIP40,.6

70 Cel

0 Cel

DUAL

TTL

Other Microprocessor ICs

2.54 mm

R-PDIP-T40

Not Qualified

SN74AS852DWP3

Texas Instruments

COMMERCIAL

GULL WING

24

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

SMALL OUTLINE

SOP24,.4

70 Cel

0 Cel

DUAL

TTL

Other Microprocessor ICs

1.27 mm

R-PDSO-G24

CC2570RHAR

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.24SQ,20

2 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1 mm

6 mm

0

30

260

6 mm

CMOS

3 V

Other uPs/uCs/Peripheral ICs

SPI; UART

.5 mm

S-PQCC-N40

3

Not Qualified

e4

SN74LVT18512DGGR

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

64

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

2.7 V

85 Cel

LVT

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

1.2 mm

6.1 mm

0

30

260

17 mm

CMOS

24 mA

3.3 V

.5 mm

R-PDSO-G64

1

Not Qualified

e4

TLC34077

Texas Instruments

SNJ54LS608J

Texas Instruments

MICROPROCESSOR CIRCUIT

MILITARY

THROUGH-HOLE

16

DIP

RECTANGULAR

CERAMIC, GLASS-SEALED

NO

5.5 V

IN-LINE

4.5 V

125 Cel

-55 Cel

DUAL

5.08 mm

7.62 mm

NOT SPECIFIED

NOT SPECIFIED

19.56 mm

CMOS

5 V

2.54 mm

R-GDIP-T16

Not Qualified

5962-9674701Q3A

Texas Instruments

MICROPROCESSOR CIRCUIT

MILITARY

NO LEAD

28

QCCN

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

5.5 V

MIL-PRF-38535 Class Q

5

CHIP CARRIER

LCC28,.45SQ

4.5 V

125 Cel

-55 Cel

TIN LEAD

QUAD

CMOS

5 V

Other Microprocessor ICs

1.27 mm

S-CQCC-N28

Not Qualified

e0

TL331DBV

Texas Instruments

SNJ54LVT8986HV

Texas Instruments

MICROPROCESSOR CIRCUIT

MILITARY

FLAT

68

QFF

SQUARE

CERAMIC, GLASS-SEALED

YES

3.6 V

MIL-PRF-38535

3.3

FLATPACK

QFL68,.5SQ,25

2.7 V

125 Cel

-55 Cel

QUAD

3.86 mm

12.51 mm

12.51 mm

BICMOS

3 V

Other Microprocessor ICs

.635 mm

S-GQFP-F68

Not Qualified

TMS9902ANL-40

Texas Instruments

COMMERCIAL

THROUGH-HOLE

18

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

IN-LINE

DIP18,.3

70 Cel

0 Cel

DUAL

MOS

Other Microprocessor ICs

2.54 mm

R-PDIP-T18

Not Qualified

DRA756

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

760

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

BOTTOM

CMOS

S-PBGA-B760

SN54ABT8996W

Texas Instruments

MICROPROCESSOR CIRCUIT

MILITARY

FLAT

24

DFP

RECTANGULAR

CERAMIC, GLASS-SEALED

YES

5.5 V

MIL-PRF-38535

FLATPACK

4.5 V

125 Cel

-55 Cel

DUAL

2.29 mm

9.085 mm

14.355 mm

CMOS

5 V

1.27 mm

R-GDFP-F24

Not Qualified

SNJ54ABT8996W

Texas Instruments

MICROPROCESSOR CIRCUIT

MILITARY

FLAT

24

DFP

RECTANGULAR

CERAMIC, GLASS-SEALED

YES

5.5 V

MIL-PRF-38535

5

FLATPACK

FL24,.35

4.5 V

125 Cel

-55 Cel

DUAL

2.29 mm

9.085 mm

14.355 mm

BICMOS

5 V

Other Microprocessor ICs

1.27 mm

R-GDFP-F24

Not Qualified

VCBUP7TC6

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

529

HBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

GRID ARRAY, HEAT SINK/SLUG

1.14 V

85 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.3 mm

19 mm

NOT SPECIFIED

245

19 mm

CMOS

1.2 V

.8 mm

S-PBGA-B529

4

e1

TIM99612N

Texas Instruments

COMMERCIAL

THROUGH-HOLE

40

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5

IN-LINE

DIP40,.6

70 Cel

0 Cel

DUAL

TTL

5 V

Other uPs/uCs/Peripheral ICs

2.54 mm

R-PDIP-T40

Not Qualified

74LVT18512DGGRE4

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

64

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

2.7 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

1.2 mm

6.1 mm

30

260

17 mm

CMOS

3.3 V

.5 mm

R-PDSO-G64

1

Not Qualified

e4

SN74LVT8980DWR

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

24

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

3.3

SMALL OUTLINE

SOP24,.4

2.7 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

2.65 mm

7.5 mm

30

260

15.4 mm

CMOS

7 mA

3 V

Other Microprocessor ICs

1.27 mm

R-PDSO-G24

1

Not Qualified

e4

DRA780BDGABFRQ1

Texas Instruments

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

367

BGA

SQUARE

PLASTIC/EPOXY

YES

1.11 V

AEC-Q100

GRID ARRAY

1.02 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.82 mm

15 mm

48

32 MHz

30

250

15 mm

CMOS

1.06 V

CAN; I2C; SPI; UART

.65 mm

S-PBGA-B367

3

e1

SN74ACT8997DWR

Texas Instruments

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

5

SMALL OUTLINE

SOP28,.4

4.5 V

70 Cel

0 Cel

NICKEL PALLADIUM GOLD

DUAL

2.65 mm

7.5 mm

0

30

260

17.9 mm

CMOS

100 mA

5 V

Other Microprocessor ICs

1.27 mm

R-PDSO-G28

1

Not Qualified

e4

TNETV1647GSTZWT

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.25 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.15 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

16 mm

IT ASLO OPERATES IN 1V MINIMUM SUPPLY

30

260

16 mm

CMOS

1.2 V

.8 mm

S-PBGA-B361

3

e1

SN74LS608N3

Texas Instruments

MICROPROCESSOR CIRCUIT

COMMERCIAL

THROUGH-HOLE

16

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5.25 V

IN-LINE

4.75 V

70 Cel

0 Cel

DUAL

5.08 mm

7.62 mm

NOT SPECIFIED

NOT SPECIFIED

19.305 mm

CMOS

5 V

2.54 mm

R-PDIP-T16

Not Qualified

DRA755BLGABCQ1

Texas Instruments

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

760

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.2 V

AEC-Q100

GRID ARRAY, FINE PITCH

1.11 V

125 Cel

-40 Cel

BOTTOM

2.96 mm

23 mm

23 mm

CMOS

1.15 V

.8 mm

S-PBGA-B760

TUSB2040AN

Texas Instruments

MICROPROCESSOR CIRCUIT

COMMERCIAL

THROUGH-HOLE

28

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

3.6 V

3.3

IN-LINE

DIP28,.6

3 V

70 Cel

0 Cel

DUAL

5.08 mm

15.24 mm

NOT SPECIFIED

NOT SPECIFIED

36.32 mm

CMOS

100 mA

3.3 V

Bus Controllers

2.54 mm

R-PDIP-T28

Not Qualified

SN74AS856JT4

Texas Instruments

COMMERCIAL

THROUGH-HOLE

24

DIP

RECTANGULAR

CERAMIC

NO

IN-LINE

DIP24,.3

70 Cel

0 Cel

DUAL

TTL

Other uPs/uCs/Peripheral ICs

2.54 mm

R-XDIP-T24

SN74LVT8980JT

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

THROUGH-HOLE

24

DIP

RECTANGULAR

CERAMIC, GLASS-SEALED

NO

3.6 V

IN-LINE

2.7 V

85 Cel

-40 Cel

DUAL

5.08 mm

7.62 mm

32.005 mm

CMOS

7 mA

3.3 V

2.54 mm

R-GDIP-T24

Not Qualified

TMS9902AJDL

Texas Instruments

COMMERCIAL

THROUGH-HOLE

18

DIP

RECTANGULAR

CERAMIC

NO

IN-LINE

DIP18,.3

70 Cel

0 Cel

DUAL

MOS

Other uPs/uCs/Peripheral ICs

2.54 mm

R-XDIP-T18

Not Qualified

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.