Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Information Access Method | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | No. of Bits | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Interrupt Capability | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Ultraviolet Erasable | Terminal Position | DMA Channels | No. of Ports | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | ROM Bits Size | No. of Timers | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Minimum Time | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | Volatile | JESD-609 Code | Maximum Standby Current | On Chip Program ROM Width | No. of I/O Lines | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
BALL |
361 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.35 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.25 V |
BOTTOM |
1.3 mm |
13 mm |
IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY |
13 mm |
CMOS |
1.3 V |
.65 mm |
S-PBGA-B361 |
Not Qualified |
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|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
TIN SILVER COPPER |
30 |
245 |
4 |
e1 |
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|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
64 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
2.7 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
1.2 mm |
6.1 mm |
30 |
260 |
17 mm |
CMOS |
3.3 V |
.5 mm |
R-PDSO-G64 |
1 |
Not Qualified |
e4 |
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Texas Instruments |
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|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
COMMERCIAL EXTENDED |
BALL |
361 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
32 |
1.2,1.8,3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA361,19X19,32 |
1.14 V |
85 Cel |
0 Cel |
BOTTOM |
1.4 mm |
16384 |
16 mm |
DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ ,32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY |
NOT SPECIFIED |
NOT SPECIFIED |
16 mm |
CMOS |
1.2 V |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B361 |
Not Qualified |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
AUTOMOTIVE |
BALL |
760 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.2 V |
AEC-Q100 |
GRID ARRAY, FINE PITCH |
1.11 V |
125 Cel |
-40 Cel |
BOTTOM |
2.96 mm |
23 mm |
23 mm |
CMOS |
1.15 V |
.8 mm |
S-PBGA-B760 |
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|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
AUTOMOTIVE |
BALL |
367 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.11 V |
AEC-Q100 |
GRID ARRAY |
1.02 V |
125 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
2.82 mm |
15 mm |
48 |
32 MHz |
30 |
250 |
15 mm |
CMOS |
1.06 V |
CAN; I2C; SPI; UART |
.65 mm |
S-PBGA-B367 |
3 |
e1 |
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|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
2 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
5 mm |
0 |
30 |
260 |
5 mm |
CMOS |
3 V |
Other uPs/uCs/Peripheral ICs |
I2C; SPI; UART; USART |
.5 mm |
S-PQCC-N32 |
3 |
Not Qualified |
e4 |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
BALL |
361 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.14 V |
BOTTOM |
1.4 mm |
16 mm |
IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY |
16 mm |
CMOS |
1.2 V |
.8 mm |
S-PBGA-B361 |
Not Qualified |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
3 V |
70 Cel |
0 Cel |
QUAD |
1.6 mm |
7 mm |
NOT SPECIFIED |
NOT SPECIFIED |
7 mm |
CMOS |
100 mA |
3.3 V |
Bus Controllers |
.5 mm |
S-PQFP-G48 |
Not Qualified |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
MILITARY |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
5.5 V |
MIL-PRF-38535 |
5 |
IN-LINE |
DIP28,.3 |
4.5 V |
125 Cel |
ACT |
-55 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
5.08 mm |
7.62 mm |
0 |
NOT SPECIFIED |
NOT SPECIFIED |
36.83 mm |
CMOS |
.1 mA |
5 V |
Other Microprocessor ICs |
2.54 mm |
R-GDIP-T28 |
Not Qualified |
e0 |
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Texas Instruments |
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|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
3 V |
70 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1.6 mm |
10 mm |
30 |
260 |
10 mm |
CMOS |
45 mA |
3.3 V |
Bus Controllers |
.5 mm |
S-PQFP-G64 |
3 |
Not Qualified |
e4 |
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Texas Instruments |
COMMERCIAL |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
IN-LINE |
DIP24,.3 |
70 Cel |
0 Cel |
DUAL |
TTL |
Other uPs/uCs/Peripheral ICs |
2.54 mm |
R-PDIP-T24 |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
MILITARY |
NO LEAD |
28 |
QCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
5.5 V |
MIL-PRF-38535 Class Q |
5 |
CHIP CARRIER |
LCC28,.45SQ |
4.5 V |
125 Cel |
-55 Cel |
QUAD |
2.03 mm |
11.43 mm |
NOT SPECIFIED |
NOT SPECIFIED |
11.43 mm |
BICMOS |
5 V |
Other Microprocessor ICs |
1.27 mm |
S-CQCC-N28 |
Not Qualified |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
OTHER |
BALL |
338 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.42 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.28 V |
85 Cel |
0 Cel |
BOTTOM |
1.3 mm |
13 mm |
13 mm |
CMOS |
1.35 V |
.65 mm |
S-PBGA-B338 |
Not Qualified |
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Texas Instruments |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5 |
IN-LINE |
DIP40,.6 |
70 Cel |
0 Cel |
DUAL |
TTL |
5 V |
Other Microprocessor ICs |
2.54 mm |
R-PDIP-T40 |
Not Qualified |
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Texas Instruments |
MILITARY |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
MIL-STD-883 Class B (Modified) |
IN-LINE |
DIP40,.6 |
125 Cel |
-55 Cel |
DUAL |
TTL |
Other uPs/uCs/Peripheral ICs |
2.54 mm |
R-XDIP-T40 |
Not Qualified |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.25 V |
SMALL OUTLINE |
4.75 V |
70 Cel |
0 Cel |
DUAL |
1.75 mm |
3.9 mm |
9.9 mm |
CMOS |
5 V |
1.27 mm |
R-PDSO-G16 |
Not Qualified |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
GULL WING |
100 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
3 V |
70 Cel |
0 Cel |
QUAD |
1.2 mm |
14 mm |
NOT SPECIFIED |
NOT SPECIFIED |
14 mm |
CMOS |
3.3 V |
.5 mm |
S-PQFP-G100 |
Not Qualified |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
OTHER |
BALL |
316 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.14 V |
85 Cel |
0 Cel |
BOTTOM |
1.4 mm |
16 mm |
16 mm |
CMOS |
1.2 V |
.8 mm |
S-PBGA-B316 |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
MILITARY |
NO LEAD |
20 |
QCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
5.5 V |
CHIP CARRIER |
4.5 V |
125 Cel |
-55 Cel |
QUAD |
2.03 mm |
8.89 mm |
NOT SPECIFIED |
NOT SPECIFIED |
8.89 mm |
CMOS |
5 V |
1.27 mm |
S-CQCC-N20 |
Not Qualified |
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Texas Instruments |
COMMERCIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5 |
IN-LINE |
DIP28,.6 |
70 Cel |
0 Cel |
DUAL |
BIPOLAR |
5 V |
Other Microprocessor ICs |
2.54 mm |
R-PDIP-T28 |
Not Qualified |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.65 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.45 V |
70 Cel |
0 Cel |
QUAD |
1 mm |
4 mm |
4 mm |
CMOS |
1.5 V |
.5 mm |
S-PQCC-N24 |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
MILITARY |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
5.5 V |
IN-LINE |
4.5 V |
125 Cel |
-55 Cel |
DUAL |
5.08 mm |
7.62 mm |
NOT SPECIFIED |
NOT SPECIFIED |
19.56 mm |
CMOS |
5 V |
2.54 mm |
R-GDIP-T16 |
Not Qualified |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
14 V |
IN-LINE |
4 V |
70 Cel |
0 Cel |
DUAL |
5.08 mm |
7.62 mm |
NOT SPECIFIED |
NOT SPECIFIED |
19.305 mm |
CMOS |
18 mA |
5 V |
2.54 mm |
R-PDIP-T16 |
Not Qualified |
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|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
3/3.3 |
SMALL OUTLINE |
SOP24,.4 |
2.7 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2.65 mm |
7.5 mm |
30 |
260 |
15.4 mm |
BICMOS |
3 V |
Other Microprocessor ICs |
1.27 mm |
R-PDSO-G24 |
1 |
Not Qualified |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR CIRCUIT |
AUTOMOTIVE |
BALL |
367 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.11 V |
AEC-Q100 |
GRID ARRAY, FINE PITCH |
BGA367,22X22,25 |
1.02 V |
125 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
2.82 mm |
15 mm |
32 |
32 MHz |
15 mm |
CMOS |
1.06 V |
CAN(2), I2C(2), SPI(4), QSPI, UART(3) |
.65 mm |
S-PBGA-B367 |
e1 |
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Texas Instruments |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
J BEND |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
CHIP CARRIER |
4.75 V |
70 Cel |
0 Cel |
QUAD |
4.57 mm |
19.13 mm |
19.13 mm |
CMOS |
5 V |
1.27 mm |
S-PQCC-J52 |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
MILITARY |
GULL WING |
68 |
QFP |
CERAMIC |
YES |
5 |
FLATPACK |
QFP68(UNSPEC) |
125 Cel |
-55 Cel |
QUAD |
CMOS |
5 V |
Other Microprocessor ICs |
Not Qualified |
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Texas Instruments |
MILITARY |
NO LEAD |
28 |
QCCN |
SQUARE |
CERAMIC |
YES |
MIL-STD-883 Class B (Modified) |
CHIP CARRIER |
LCC28,.45SQ |
125 Cel |
-55 Cel |
QUAD |
TTL |
Other uPs/uCs/Peripheral ICs |
1.27 mm |
S-XQCC-N28 |
Not Qualified |
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|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
OTHER |
BALL |
361 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.25 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.15 V |
85 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
16 mm |
IT ASLO OPERATES IN 1V MINIMUM SUPPLY |
30 |
260 |
16 mm |
CMOS |
1.2 V |
.8 mm |
S-PBGA-B361 |
3 |
e1 |
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Texas Instruments |
COMMERCIAL |
GULL WING |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
SMALL OUTLINE |
SOP24,.4 |
70 Cel |
0 Cel |
DUAL |
TTL |
Other uPs/uCs/Peripheral ICs |
1.27 mm |
R-PDSO-G24 |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
GULL WING |
100 |
HVFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH |
3 V |
70 Cel |
0 Cel |
QUAD |
1 mm |
14 mm |
NOT SPECIFIED |
NOT SPECIFIED |
14 mm |
CMOS |
3.3 V |
.5 mm |
S-PQFP-G100 |
Not Qualified |
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|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
AUTOMOTIVE |
BALL |
760 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.2 V |
AEC-Q100 |
GRID ARRAY, FINE PITCH |
1.11 V |
125 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
2.96 mm |
23 mm |
64 |
32 MHz |
30 |
250 |
23 mm |
CMOS |
1.15 V |
CAN; I2C; SPI; UART; USB |
.8 mm |
S-PBGA-B760 |
3 |
1176 rpm |
e1 |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
64 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
2.7 V |
85 Cel |
-40 Cel |
DUAL |
1.2 mm |
6.1 mm |
NOT SPECIFIED |
NOT SPECIFIED |
17 mm |
CMOS |
3.3 V |
.5 mm |
R-PDSO-G64 |
Not Qualified |
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Texas Instruments |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
OTHER |
NO LEAD |
46 |
RECTANGULAR |
UNSPECIFIED |
YES |
4.8 V |
MICROELECTRONIC ASSEMBLY |
2.7 V |
70 Cel |
-20 Cel |
QUAD |
2 mm |
13.5 mm |
SEATED HGT-NOM |
16.3 mm |
CMOS |
3.6 V |
R-XQMA-N46 |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
MILITARY |
GULL WING |
256 |
QFP |
SQUARE |
CERAMIC, GLASS-SEALED |
YES |
5.25 V |
FLATPACK |
4.75 V |
125 Cel |
-55 Cel |
QUAD |
CMOS |
5 V |
S-GQFP-G256 |
Not Qualified |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
J BEND |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
CHIP CARRIER |
4.75 V |
70 Cel |
0 Cel |
QUAD |
4.57 mm |
19.1262 mm |
19.1262 mm |
CMOS |
5 V |
1.27 mm |
S-PQCC-J52 |
Not Qualified |
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|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
FLATPACK, LOW PROFILE, FINE PITCH |
NICKEL PALLADIUM GOLD |
QUAD |
1.6 mm |
7 mm |
30 |
260 |
7 mm |
CMOS |
.5 mm |
S-PQFP-G48 |
3 |
Not Qualified |
e4 |
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Texas Instruments |
INDUSTRIAL |
THROUGH-HOLE |
18 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
IN-LINE |
DIP18,.3 |
85 Cel |
-40 Cel |
DUAL |
MOS |
Other Microprocessor ICs |
2.54 mm |
R-XDIP-T18 |
Not Qualified |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
BALL |
361 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.14 V |
BOTTOM |
1.4 mm |
16 mm |
IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY |
16 mm |
CMOS |
1.2 V |
.8 mm |
S-PBGA-B361 |
Not Qualified |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
24 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5 |
SMALL OUTLINE, SHRINK PITCH |
SSOP24,.3 |
85 Cel |
-40 Cel |
DUAL |
5 V |
Other Microprocessor ICs |
.635 mm |
R-PDSO-G24 |
Not Qualified |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
24 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP24,.25 |
2.7 V |
85 Cel |
-40 Cel |
DUAL |
1.2 mm |
4.4 mm |
NOT SPECIFIED |
NOT SPECIFIED |
7.8 mm |
CMOS |
3 V |
Other Microprocessor ICs |
.65 mm |
R-PDSO-G24 |
Not Qualified |
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|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.24SQ,20 |
2 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
6 mm |
0 |
30 |
260 |
6 mm |
CMOS |
3 V |
Other uPs/uCs/Peripheral ICs |
SPI; UART |
.5 mm |
S-PQCC-N40 |
3 |
Not Qualified |
e4 |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
GULL WING |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.3 V |
3/5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.25 |
2.7 V |
70 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
1.2 mm |
3 mm |
CAN ALSO OPERATE AT 5V SUPPLY |
30 |
260 |
4.4 mm |
CMOS |
3 V |
Serial IO/Communication Controllers |
UART |
.65 mm |
R-PDSO-G8 |
1 |
Not Qualified |
e4 |
Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.
Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.
Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.
Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.