Other Function uPs,uCs & Peripheral ICs

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Address Bus Width	DAC Channels	Bit Size	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	DMA Channels	Maximum Seated Height	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	PWM Channels	Sub-Category	ROM Programmability	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code	No. of I/O Lines
XCZU19EG-3FFVD1760E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.927 V					GRID ARRAY		.873 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM							30	245		CMOS	.9 V						R-PBGA-B1760	4		e1
XCZU19EG-L2FFVB1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V					GRID ARRAY		.698 V	110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM				ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	245		CMOS	.72 V						R-PBGA-B1517	4		e1
XCZU1CG-L1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT																		Tin/Silver/Copper (Sn/Ag/Cu)									30	250										4		e1
XCZU1CG-L2UBVA494E	Xilinx	MICROPROCESSOR CIRCUIT																		TIN SILVER BISMUTH COPPER NICKEL									30	245										4
XCZU21DR-2FFVD1156E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V					GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER		BOTTOM							30	245		CMOS	.85 V						R-PBGA-B1156	4		e1
XCZU27DR-2FFVE1156E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V					GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER		BOTTOM							30	245		CMOS	.85 V						R-PBGA-B1156	4		e1
XCZU27DR-2FSVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V					GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM							30	240		CMOS	.85 V						R-PBGA-B1517	4		e1
XCZU28DR-1FFVE1156E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V					GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER		BOTTOM							30	245		CMOS	.85 V						R-PBGA-B1156	4		e1
XCZU28DR-L2FFVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V					GRID ARRAY		.698 V	110 Cel	0 Cel	TIN SILVER COPPER		BOTTOM				ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	245		CMOS	.72 V						R-PBGA-B1517	4		e1
XCZU2CG-2SBVA484E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V					GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM		2.61 mm	19 mm				30	250	19 mm	CMOS	.85 V					.8 mm	R-PBGA-B484	4		e1
XCZU3EG-L1UBVA530I	Xilinx	PROGRAMMABLE SoC																											30	245										4
XCZU42DR-1FFVE1156E	Xilinx	PROGRAMMABLE SoC
XCZU42DR-1FSVE1156E	Xilinx	PROGRAMMABLE SoC
XCZU43DR-L2FSVE1156I	Xilinx	PROGRAMMABLE SoC
XCZU47DR-1FFVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V					GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER		BOTTOM							30	245		CMOS	.85 V						R-PBGA-B1517	4		e1
XCZU48DR-2FSVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V					GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER		BOTTOM							30	240		CMOS	.85 V						R-PBGA-B1517	4		e1
XCZU49DR-1FSVF1760I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V					GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM							30	240		CMOS	.85 V						R-PBGA-B1760	4		e1
XCZU49DR-2FSVF1760I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V					GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM							30	240		CMOS	.85 V						R-PBGA-B1760	4		e1
XCZU49DR-L2FFVF1760I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V					GRID ARRAY		.698 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM							30	245		CMOS	.72 V						R-PBGA-B1760	4		e1
XCZU4EG-2SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V					GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM							30	250		CMOS	.85 V						R-PBGA-B784	4		e1
XCZU65DR-2FSVE1156I	Xilinx	PROGRAMMABLE SoC
XCZU6CG-2FFVC900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V					GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM							30	245		CMOS	.85 V						R-PBGA-B900	4		e1
XCZU6CG-3FFVB1156E	Xilinx																			TIN SILVER COPPER																				4		e1
XCZU7CG-1FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V					GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM							30	245		CMOS	.85 V						R-PBGA-B900	4		e1
XCZU7CG-2FFVF1517I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V					GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM							30	245		CMOS	.85 V						R-PBGA-B1517	4		e1
XCZU7EG-1FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V					GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM							30	245		CMOS	.85 V						R-PBGA-B900	4		e1
XCZU7EV-2FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V					GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM		2.97 mm	31 mm				30	245	31 mm	CMOS	.85 V					1 mm	R-PBGA-B900	4		e1
XCZU9CG-1FFVC900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V					GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM							30	245		CMOS	.85 V						R-PBGA-B900	4		e1
XQ7Z045-1RFG676Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES						GRID ARRAY			125 Cel	-40 Cel			BOTTOM		3.37 mm	27 mm				NOT SPECIFIED	NOT SPECIFIED	27 mm	CMOS						1 mm	S-PBGA-B676
XQZU7EV-1FFRB900M	Xilinx	PROGRAMMABLE SoC		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V					GRID ARRAY	BGA900,30X30,40	.808 V	125 Cel	-55 Cel	Tin/Lead (Sn/Pb)		BOTTOM		3.71 mm	31 mm					225	31 mm	CMOS	.85 V					1 mm	S-PBGA-B900	4		e0
XQZU7EV-L1FFRB900I	Xilinx	PROGRAMMABLE SoC		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V					GRID ARRAY	BGA900,30X30,40	.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)		BOTTOM		3.71 mm	31 mm					225	31 mm	CMOS	.85 V					1 mm	S-PBGA-B900	4		e0
HSA2-040SAA/A2320A	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.465 V					SMALL OUTLINE	SOP28,.4	3.135 V	85 Cel	-40 Cel	MATTE TIN		DUAL		2.64 mm	7.49 mm						17.87 mm	CMOS	3.3 V				USB	1.27 mm	R-PDSO-G28	1		e3
CY8C4146LQE-S423	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1.89 V	AEC-Q100				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.71 V	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD		QUAD		.6 mm	6 mm						6 mm	CMOS	1.8 V					.5 mm	S-XQCC-N40	3		e4
HS12-100S0S/12SS30	Microchip Technology	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES						SMALL OUTLINE	SOP20,.4		70 Cel	0 Cel			DUAL		2.64 mm	7.49 mm	Touch Screen Microcontroller					12.8 mm	CMOS						1.27 mm	R-PDSO-G20
HSA2-040SCA/A2324	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	28		RECTANGULAR	PLASTIC/EPOXY	YES	3.465 V							3.135 V	85 Cel	-40 Cel	Matte Tin (Sn)		DUAL								250		CMOS	3.3 V						R-PDSO-G28	1		e3
1SX280HU1F50I1VG	Intel	SoC FPGA
66AK2L06XCMSA	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V					GRID ARRAY, FINE PITCH		.95 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM		3.55 mm	25 mm				30	245	25 mm	CMOS	1.05 V					.8 mm	S-PBGA-B900	4		e1
A2F200M3F-1CSG288	Microchip Technology	SoC FPGA		BALL	288	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.575 V					GRID ARRAY, THIN PROFILE, FINE PITCH		1.425 V	85 Cel	0 Cel	TIN SILVER COPPER		BOTTOM										CMOS	1.5 V						S-PBGA-B288	3
ADSP-SC584CBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	95 Cel	-40 Cel			BOTTOM		1.5 mm	19 mm			500 MHz	30	260	19 mm	CMOS	1.1 V				SPI; UART	.8 mm	S-PBGA-B349	3
ADSP-SC587BBCZ-4B	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel	-40 Cel			BOTTOM		1.5 mm	19 mm			500 MHz	30	260	19 mm	CMOS	1.1 V				SPI; UART	.8 mm	S-PBGA-B349	3
ADSP-SC589KBCZ-5B	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel	0 Cel			BOTTOM		1.5 mm	19 mm			500 MHz		260	19 mm	CMOS	1.1 V				SPI; UART	.8 mm	S-PBGA-B349	3
ADUCM330WFSBCPZ-RL	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	18 V	AEC-Q100				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.24SQ,20	3.6 V	115 Cel	-40 Cel			QUAD		1 mm	6 mm				NOT SPECIFIED	NOT SPECIFIED	6 mm	CMOS					SPI	.5 mm	S-XQCC-N32
AGB75LC04-QU-E	Amulet Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	1.32 V					FLATPACK, FINE PITCH	QFP208,1.2SQ,20	1.08 V	85 Cel	-40 Cel			QUAD		4.1 mm	28 mm						28 mm	CMOS	1.2 V					.5 mm	S-PQFP-G208	3
AMZ8127DMB	Advanced Micro Devices		MILITARY	THROUGH-HOLE	24	DIP	RECTANGULAR	CERAMIC	NO		MIL-STD-883 Class B (Modified)				IN-LINE	DIP24,.3		125 Cel	-55 Cel	Tin/Lead (Sn/Pb)		DUAL										ECL			Other uPs/uCs/Peripheral ICs			2.54 mm	R-XDIP-T24		Not Qualified	e0
AN231E04-E2-QFNTY	Anadigm
AR9331-AL1A	Qualcomm	MICROPROCESSOR CIRCUIT		NO LEAD	148	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.26 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.14 V					BOTTOM		.9 mm	12 mm						12 mm	CMOS	1.2 V					.5 mm	S-PBCC-N148
AS5145B-HSSM	Ams Ag	SYSTEM ON CHIP																		TIN										260										3		e3
AT97SC3204-X2MA-20	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES			0	NO	8	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20		70 Cel	0 Cel	MATTE TIN	NO	QUAD	NO	.9 mm	6 mm		0				6 mm	CMOS	3.3 V	NO		EEPROM		.5 mm	S-XQCC-N40			e3	0

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.