Other Function uPs,uCs & Peripheral ICs

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	Ultraviolet Erasable	Terminal Position	Maximum Seated Height	ROM Words	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	ROM Bits Size	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	ROM Programmability	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code
10AS027E3F29E2LG	Intel	SoC		BALL	780	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V				GRID ARRAY	BGA780,28X28,40	.87 V	100 Cel		0 Cel			BOTTOM	3.35 mm		29 mm	ALSO OPERATES AT 0.95V NOMINAL SUPPLY			29 mm			TSMC		.9 V			1 mm	S-PBGA-B780
5CSEBA6U19I7SN	Intel	SoC
5CSXFC6C6U23C6N	Intel	SoC
88AP270MA2-BHE1E312	Marvell Technology	SoC	INDUSTRIAL	BALL			SQUARE	PLASTIC/EPOXY	YES	3.3 V			1.8/3.3			1.8 V				TIN SILVER COPPER		BOTTOM										CMOS			Graphics Processors					Not Qualified		e1
BCM53346A0KFSBG	Broadcom
BCM5389IFBG	Broadcom
DH82HM86SR17E	Intel	MICROPROCESSOR CIRCUIT
EFR32FG12P231F1024GM48-CR	Silicon Labs	SYSTEM ON CHIP		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	1.62 V	85 Cel		-40 Cel			QUAD	.9 mm		7 mm				7 mm			CMOS		1.8 V			.5 mm	S-XQCC-N48
EFR32MG12P232F1024GM48-C	Silicon Labs	SYSTEM ON CHIP
EFR32MG12P232F1024GM48-CR	Silicon Labs	SYSTEM ON CHIP
EFR32MG21B020F512IM32-B	Silicon Labs	SYSTEM ON CHIP	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.16SQ,16	1.71 V	125 Cel		-40 Cel			QUAD	.9 mm		4 mm				4 mm			CMOS		3 V			.4 mm	S-XQCC-N32
EM3587-RTR	Silicon Labs	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.32 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.18 V	85 Cel		-40 Cel			QUAD	.9 mm		7 mm				7 mm			CMOS		1.25 V			.5 mm	S-PQCC-N48
F6820P	National Semiconductor
MCIMX253DJM4A	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.52 V			1.2/1.5,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.38 V	70 Cel		-20 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm		17 mm	ALSO REQUIRES 3.3 V I/O SUPPLY	40	260	17 mm			CMOS		1.45 V	Microprocessors		.8 mm	S-PBGA-B400	3	Not Qualified		e1
MCIMX287CVM4C	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	85 Cel		-40 Cel			BOTTOM	1.37 mm		14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V	40	260	14 mm			CMOS		1.45 V			.8 mm	S-PBGA-B289	3
MCIMX6G2CVM05AA	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.15 V	105 Cel		-40 Cel			BOTTOM	1.32 mm		14 mm		40	260	14 mm			CMOS					.8 mm	S-PBGA-B289	3
XA7Z020-1CLG400I	Xilinx	MICROPROCESSOR CIRCUIT		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100		1,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32					Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	N	BOTTOM	1.6 mm		17 mm		30	260	17 mm			CMOS			Other uPs/uCs/Peripheral ICs		.8 mm	S-PBGA-B400	3	Not Qualified		e1
XCVC1902-2MLEVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V				GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.775 V	110 Cel		0 Cel			BOTTOM	4 mm		40 mm				40 mm			CMOS		.8 V			.92 mm	S-PBGA-B1760
XCVM1802-2MSEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V				GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel		0 Cel	TIN SILVER COPPER		BOTTOM	4 mm		45 mm				45 mm			CMOS		.8 V			.92 mm	S-PBGA-B2197				e1
XCZU19EG-1FFVD1760I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM					30	245				CMOS		.85 V				R-PBGA-B1760	4			e1
XCZU47DR-1FFVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM					30	245				CMOS		.85 V				R-PBGA-B1517	4			e1
XCZU49DR-1FSVF1760E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel		0 Cel	TIN SILVER COPPER		BOTTOM					30	240				CMOS		.85 V				R-PBGA-B1760	4			e1
XCZU5EV-1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM					30	250				CMOS		.85 V				R-PBGA-B784	4			e1
XCZU6CG-1FFVC900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM					30	245				CMOS		.85 V				R-PBGA-B900	4			e1
XCZU7EG-1FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM					30	245				CMOS		.85 V				R-PBGA-B900	4			e1
XQ7Z030-1RF676Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES				1,1.8	GRID ARRAY	BGA676,26X26,40		125 Cel		-40 Cel	TIN LEAD	N	BOTTOM	3.37 mm		27 mm		30	225	27 mm			CMOS			Other uPs/uCs/Peripheral ICs		1 mm	S-PBGA-B676	4	Not Qualified		e0
XQ7Z045-1RF676I	Xilinx	MICROPROCESSOR CIRCUIT		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES				1,1.8	GRID ARRAY	BGA676,26X26,40					TIN LEAD	N	BOTTOM	3.37 mm		27 mm				27 mm			CMOS			Other uPs/uCs/Peripheral ICs		1 mm	S-PBGA-B676		Not Qualified		e0
XQZU3EG-1SFRC784I	Xilinx	PROGRAMMABLE SoC		BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES	.892 V				GRID ARRAY, FINE PITCH	BGA784,28X28,32	.808 V	100 Cel		-40 Cel	TIN LEAD		BOTTOM	3.52 mm		23 mm		20	220	23 mm			CMOS		.85 V			.8 mm	S-PBGA-B784	4			e0
10AS016C3U19E2LG	Intel	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V				GRID ARRAY, FINE PITCH	BGA484,22X22,32	.87 V	100 Cel		0 Cel			BOTTOM	3.25 mm		19 mm	ALSO OPERATES AT 0.95V NOMINAL SUPPLY			19 mm			TSMC		.9 V			.8 mm	S-PBGA-B484
10AS016E4F29E3SG	Intel	SoC		BALL	780	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V				GRID ARRAY	BGA780,28X28,40	.87 V	100 Cel		0 Cel			BOTTOM	3.35 mm		29 mm				29 mm			TSMC		.9 V			1 mm	S-PBGA-B780
10AS048E3F29E2LG	Intel	SoC		BALL	780	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V				GRID ARRAY	BGA780,28X28,40	.87 V	100 Cel		0 Cel			BOTTOM	3.35 mm		29 mm	ALSO OPERATES AT 0.95V NOMINAL SUPPLY			29 mm			TSMC		.9 V			1 mm	S-PBGA-B780
136PC15A2L	Honeywell Sensing And Control
41FR2	Honeywell Sensing And Control
5CSEBA2U23C8N	Intel	SoC
5CSEBA4U19A7N	Intel	SoC
5CSEBA4U23C8SN	Intel	SoC
5CSEBA6U23A7N	Intel	SoC
5CSXFC6C6U23C7N	Intel	SoC
88AP162-B0-BJD2C004	Marvell Technology	SoC		BALL			SQUARE	PLASTIC/EPOXY	YES	3.3 V						1.8 V	85 Cel		-25 Cel			BOTTOM										CMOS
88AP168-B0-BJD2C010	Marvell Technology	SoC		BALL			SQUARE	PLASTIC/EPOXY	YES	3.3 V						1.8 V						BOTTOM										CMOS
AS82527F8	Intel		AUTOMOTIVE	GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY	YES				5	FLATPACK	QFP44,.5SQ,32		125 Cel		-40 Cel			QUAD										CMOS	50 mA	5 V	Other uPs/uCs/Peripheral ICs		.8 mm	S-PQFP-G44		Not Qualified
AT43USB326-AU	Atmel	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	48	QFP	SQUARE	PLASTIC/EPOXY	YES				5	FLATPACK	QFP48,.35SQ,20		85 Cel		-40 Cel			QUAD											40 mA	5 V	Other Microprocessor ICs		.5 mm	S-PQFP-G48		Not Qualified
BCM5396KFBG	Broadcom
CY8C20647S-24LQXI	Cypress Semiconductor	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V		8	1.8/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	85 Cel	M8C	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD	.6 mm	16384	6 mm		30	260	6 mm		2048	CMOS	4 mA	3.3 V	Microcontrollers	FLASH	.4 mm	S-XQCC-N48	3	Not Qualified	25.2 rpm	e4
CY8C24794-24LQXI	Infineon Technologies	PROGRAMMABLE SoC
CY8C3245PVI-134	Infineon Technologies	PSoC	INDUSTRIAL										1.8/5							NICKEL PALLADIUM GOLD	N						20	260		262144 Bits					Other uPs/uCs/Peripheral ICs				3	Not Qualified		e4
CY8C3445AXI-104	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V			2/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.71 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	N	QUAD	1.6 mm		14 mm		40	260	14 mm	32768 Bits		CMOS		3.3 V	Other uPs/uCs/Peripheral ICs		.5 mm	S-PQFP-G100	3	Not Qualified		e4
CY8C4025LQS-S411	Infineon Technologies	PSoC																		NICKEL PALLADIUM GOLD																			3			e4

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.