Other Function uPs,uCs & Peripheral ICs

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
XCZU11EG-3FFVC1760E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.927 V			GRID ARRAY		.873 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM				30	245		CMOS	.9 V			R-PBGA-B1760	4		e1
XCZU15EG-1FFVC900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM				30	245		CMOS	.85 V			R-PBGA-B900	4		e1
XCZU15EG-L2FFVC900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY		.698 V	110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	30	245		CMOS	.72 V			R-PBGA-B900	4		e1
XCZU17EG-2FFVB1517I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM				30	245		CMOS	.85 V			R-PBGA-B1517	4		e1
XCZU19EG-1FFVB1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM				30	245		CMOS	.85 V			R-PBGA-B1517	4		e1
XCZU19EG-2FFVD1760I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM				30	245		CMOS	.85 V			R-PBGA-B1760	4		e1
XCZU19EG-2FFVE1924E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1924	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.71 mm	45 mm		30	245	45 mm	CMOS	.85 V		1 mm	R-PBGA-B1924	4		e1
XCZU27DR-1FFVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM				30	245		CMOS	.85 V			R-PBGA-B1156	4		e1
XCZU3TCG-2SFVD784E	Xilinx	PROGRAMMABLE SoC
XCZU3TCG-L1SFVC784I	Xilinx	PROGRAMMABLE SoC
XCZU49DR-2FFVF1760E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM				30	245		CMOS	.85 V			R-PBGA-B1760	4		e1
XCZU4CG-2FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	2.88 mm	31 mm		30	245	31 mm	CMOS	.85 V		1 mm	R-PBGA-B900	4		e1
XCZU4EG-2FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM				30	245		CMOS	.85 V			R-PBGA-B900	4		e1
XCZU4EG-2SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	3.32 mm	23 mm		30	250	23 mm	CMOS	.85 V		.8 mm	R-PBGA-B784	4		e1
XCZU5EG-1FBVB900E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY	BGA900,30X30,40	.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.88 mm	31 mm		30	245	31 mm	CMOS	.85 V		1 mm	R-PBGA-B900	4		e1
XCZU5EG-L1FBVB900I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY	BGA900,30X30,40	.698 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.88 mm	31 mm	ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	30	245	31 mm	CMOS	.72 V		1 mm	R-PBGA-B900	4		e1
XCZU6EG-2FFVC900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM				30	245		CMOS	.85 V			R-PBGA-B900	4		e1
XCZU7EG-1FFVF1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM				30	245		CMOS	.85 V			R-PBGA-B1517	4		e1
ADSP-SC598BBPZ8	Analog Devices	MICROPROCESSOR CIRCUIT
ADSP-SC598KBPZ8	Analog Devices	MICROPROCESSOR CIRCUIT
ATBTLC1000A-UU-T	Microchip Technology	SoC		BALL	31	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	4.3 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA31,9X7,14	1.8 V	85 Cel	-40 Cel		BOTTOM	.541 mm	2.142 mm				2.282 mm	CMOS	3.6 V		.35 mm	R-PBGA-B31
ATWINC1500-MR210UB1140	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	4.2 V			MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	2.113 mm	14.73 mm	SEATED HGT-NOM	NOT SPECIFIED	NOT SPECIFIED	21.72 mm	CMOS	3.6 V			R-XXMA-N28
LS1043AXE7MQB	NXP Semiconductors	SoC		BALL	621		SQUARE	PLASTIC/EPOXY	YES							105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.92 mm	21 mm		30	250	21 mm	CMOS			.8 mm	S-PBGA-B621	3		e1
MCIMX513DJM8C	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	19 mm		40	260	19 mm	CMOS	1.1 V	Graphics Processors	.8 mm	S-PBGA-B529	3	Not Qualified	e1
MFEV710,599	NXP Semiconductors
NT3H1101W0FHK	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	8	VQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V			CHIP CARRIER, VERY THIN PROFILE		1.8 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.5 mm	1.6 mm				1.6 mm	CMOS			.5 mm	S-PQCC-N8	1		e4
XCZU11EG-1FFVB1517I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM				30	245		CMOS	.85 V			R-PBGA-B1517	4		e1
XCZU11EG-L2FFVC1156E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY		.698 V	110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	30	245		CMOS	.72 V			R-PBGA-B1156	4		e1
XCZU2CG-L2SFVA625E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	625	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY		.698 V	110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	30	250		CMOS	.72 V			R-PBGA-B625	4		e1
AX-SIP-SFEU-API-1-01-TX30	Onsemi	MICROPROCESSOR CIRCUIT	OTHER	BUTT	44	HVBCC	RECTANGULAR	UNSPECIFIED	YES	3.6 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2 V	85 Cel	-30 Cel	NICKEL GOLD PALLADIUM	BOTTOM	.996 mm	7 mm		30	260	9 mm	CMOS	3 V			R-XBCC-B44	3
STDP9320-BB	STMicroelectronics
10AS016E4F29I3LG	Intel	SoC		BALL	780	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V			GRID ARRAY	BGA780,28X28,40	.87 V	100 Cel	-40 Cel		BOTTOM	3.35 mm	29 mm				29 mm	TSMC	.9 V		1 mm	S-PBGA-B780
88AP270MA2-BHE1C520	Marvell Technology	SoC		BALL			SQUARE	PLASTIC/EPOXY	YES	3.3 V		1.8/3.3			1.8 V	85 Cel	-25 Cel	TIN SILVER COPPER	BOTTOM							CMOS		Graphics Processors				Not Qualified	e1
SP1ML-868	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	16		RECTANGULAR	UNSPECIFIED	NO	3.6 V			MICROELECTRONIC ASSEMBLY		1.8 V	85 Cel	-40 Cel		DUAL	2.5 mm	13.4 mm		NOT SPECIFIED	NOT SPECIFIED	14 mm	CMOS	3 V		1.5 mm	R-XDMA-N16
XCZU27DR-2FSVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM				30	240		CMOS	.85 V			R-PBGA-B1156	4		e1
EFR32MG24B010F1024IM48-B	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	125 Cel	-40 Cel		QUAD	.9 mm	6 mm				6 mm	CMOS	3 V		.4 mm	S-XQCC-N48
88AP270MA2-BHE1C416	Marvell Technology	SoC		BALL			SQUARE	PLASTIC/EPOXY	YES	3.3 V		1.8/3.3			1.8 V	85 Cel	-25 Cel	TIN SILVER COPPER	BOTTOM							CMOS		Graphics Processors				Not Qualified	e1
XCZU27DR-2FFVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM				30	245		CMOS	.85 V			R-PBGA-B1517	4		e1
FLI32652H-BG	STMicroelectronics																	TIN SILVER COPPER					30	250							3		e1
EFR32FG12P433F1024GM68-C	Silicon Labs	SYSTEM ON CHIP		NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.62 V	85 Cel	-40 Cel		QUAD	.9 mm	8 mm				8 mm	CMOS	1.8 V		.4 mm	S-XQCC-N68
MCIMX534AVP8C2	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	AEC-Q100		GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.05 V	125 Cel	-40 Cel		BOTTOM	1.85 mm	19 mm				19 mm	CMOS	1.1 V		.8 mm	S-PBGA-B529
CY8CTMG100-00LFXI	Cypress Semiconductor																							260							3
FAN6961DY	Fairchild Semiconductor
MCIMX27LVOP4A	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	404	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.52 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.38 V	85 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	17 mm	ALSO OPERATES WITH 1.3VNOM @266MHZ	40	260	17 mm	CMOS	1.45 V		.65 mm	S-PBGA-B404	3	Not Qualified	e1
XCVP1702-3DSEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
CSR8675C-ICXT-R	Qualcomm	MICROPROCESSOR CIRCUIT		BALL		BGA	UNSPECIFIED	PLASTIC/EPOXY	YES				GRID ARRAY						BOTTOM							CMOS				X-PBGA-B
LS1023ASN7KQB	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	621	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA621,25X25,32	.87 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	21 mm		30	250	21 mm	CMOS	.9 V		.8 mm	S-PBGA-B621	3		e1
MCIMX515CJM6C	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V		1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	.95 V	85 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	19 mm		40	260	19 mm	CMOS	1 V	Graphics Processors	.8 mm	S-PBGA-B529	3	Not Qualified	e1

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.