Other Function uPs,uCs & Peripheral ICs

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	DAC Channels	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	DMA Channels	Maximum Seated Height	ROM Words	RAM Words	Width	Data EEPROM Size	Additional Features	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	PWM Channels	Sub-Category	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code	On Chip Program ROM Width	No. of I/O Lines
TMS320DM6446AZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	85 Cel	0 Cel	TIN SILVER COPPER		BOTTOM		1.4 mm		16384	16 mm		DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ ,32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY		48		30	260	16 mm	CMOS		1.2 V		Digital Signal Processors	I2C; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified	e1
TMSDM6446AZWT-COM	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V					GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel	0 Cel	TIN SILVER COPPER		BOTTOM		1.4 mm			16 mm						30	260	16 mm	CMOS		1.2 V				.8 mm		S-PBGA-B361	3		e1
TNETV6446AINZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V					GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel	0 Cel	TIN SILVER COPPER		BOTTOM		1.4 mm			16 mm						30	260	16 mm	CMOS		1.2 V				.8 mm		S-PBGA-B361	3		e1
TW8819AT-NA2-GRT	Renesas Electronics																			NICKEL GOLD PALLADIUM SILVER																									3
TXC-06880BIOG	Transwitch
UCD3138A64PFCR	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	80	TFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		NO			FLATPACK, THIN PROFILE, FINE PITCH		3 V	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	NO	1.2 mm	65536		12 mm	2K		COMPARATOR(7)	0	2 MHz	30	260	12 mm	CMOS		3.3 V	NO		I2C; SPI; UART	.5 mm		S-PQFP-G80	3		e4	8	43
XC7Z030-1FF676I	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V					GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel			BOTTOM		2.54 mm			27 mm								27 mm	CMOS		1 V				1 mm		S-PBGA-B676
XC7Z045-3FBG676E	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V					GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	0 Cel			BOTTOM		2.54 mm			27 mm								27 mm	CMOS		1 V				1 mm		S-PBGA-B676
XCZU11EG-L1FFVF1517I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V					GRID ARRAY		.698 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM							ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY				30	245		CMOS		.72 V						R-PBGA-B1517	4		e1
XCZU11EG-L2FFVC1760E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V					GRID ARRAY		.698 V	110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM							ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY				30	245		CMOS		.72 V						R-PBGA-B1760	4		e1
XCZU19EG-1FFVB1517I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V					GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM											30	245		CMOS		.85 V						R-PBGA-B1517	4		e1
XCZU1CG-2UBVA494I	Xilinx	MICROPROCESSOR CIRCUIT																		TIN SILVER BISMUTH COPPER NICKEL													30	245											4
XCZU1CG-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT																		Tin/Silver/Copper (Sn/Ag/Cu)													30	250											4		e1
XCZU1CG-L2SBVA484E	Xilinx	MICROPROCESSOR CIRCUIT																		Tin/Silver/Copper (Sn/Ag/Cu)													30	250											4		e1
XCZU1CG-L2SFVA625E	Xilinx	MICROPROCESSOR CIRCUIT																		Tin/Silver/Copper (Sn/Ag/Cu)													30	250											4		e1
XCZU2EG-L1SBVA484I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V					GRID ARRAY		.698 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM							ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY							CMOS		.72 V						R-PBGA-B484	4		e1
XCZU3CG-1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V					GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM											30	250		CMOS		.85 V						R-PBGA-B625	4		e1
XCZU3CG-L2SFVA625E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	625	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V					GRID ARRAY		.698 V	110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM							ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY				30	250		CMOS		.72 V						R-PBGA-B625	4		e1
XCZU3EG-2SBVA484E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V					GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER		BOTTOM		2.61 mm			19 mm								19 mm	CMOS		.85 V				.8 mm		R-PBGA-B484	4		e1
XCZU49DR-2FFVF1760I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V					GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM											30	245		CMOS		.85 V						R-PBGA-B1760	4		e1
XCZU4CG-2SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES						GRID ARRAY, FINE PITCH			100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM		3.32 mm			23 mm						30	250	23 mm	CMOS		.85 V				.8 mm		S-PBGA-B784	4		e1
XCZU4EG-L2SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V					GRID ARRAY		.698 V	110 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM							ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY				30	250		CMOS		.72 V						R-PBGA-B784	4		e1
XCZU5EG-2SFVC784I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V					GRID ARRAY	BGA784,28X28,32	.825 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM		3.32 mm			23 mm						30	250	23 mm	CMOS		.85 V				.8 mm		R-PBGA-B784	4		e1
XCZU5EG-3FBVB900E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.927 V					GRID ARRAY	BGA900,30X30,40	.873 V	100 Cel	0 Cel	TIN SILVER COPPER		BOTTOM		2.88 mm			31 mm						30	245	31 mm	CMOS		.9 V				1 mm		R-PBGA-B900	4		e1
XCZU5EV-2SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V					GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM		3.32 mm			23 mm						30	250	23 mm	CMOS		.85 V				.8 mm		R-PBGA-B784	4		e1
XCZU7CG-2FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V					GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM											30	245		CMOS		.85 V						R-PBGA-B900	4		e1
XCZU7EG-2FFVC1156E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V					GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM		3.51 mm			35 mm						30	245	35 mm	CMOS		.85 V				1 mm		R-PBGA-B1156	4		e1
XCZU7EG-2FFVC1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V					GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM											30	245		CMOS		.85 V						R-PBGA-B1156	4		e1
XCZU7EV-L1FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V					GRID ARRAY		.698 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM							ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY				30	245		CMOS		.72 V						R-PBGA-B900	4		e1
XCZU9CG-2FFVC900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V					GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM											30	245		CMOS		.85 V						R-PBGA-B900	4		e1
XCZU9EG-3FFVB1156E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.927 V					GRID ARRAY		.873 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM											30	245		CMOS		.9 V						R-PBGA-B1156	4		e1
XCZU9EG-3FFVC900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.927 V					GRID ARRAY		.873 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM											30	245		CMOS		.9 V						R-PBGA-B900	4		e1
XCZU9EG-L1FFVC900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V					GRID ARRAY		.698 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM							ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY				30	245		CMOS		.72 V						R-PBGA-B900	4		e1
XTDA4VPXXXGAALY	Texas Instruments	SoC		BALL	1414	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V					GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA1414,38X38,32	.76 V	70 Cel	0 Cel			BOTTOM		3.341 mm			31 mm								31 mm	CMOS		.8 V				.8 mm		S-PBGA-B1414
Z16C3010VEC	IXYS Corporation		INDUSTRIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES					5	CHIP CARRIER	LDCC68,1.0SQ		85 Cel	-40 Cel			QUAD														CMOS	50 mA	5 V		Other uPs/uCs/Peripheral ICs		1.27 mm		S-PQCC-J68		Not Qualified
ZL30250LDF1	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1.89 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.71 V	85 Cel	-40 Cel			QUAD		1 mm			5 mm		IT ALSO OPERATES AT 3.3V NOMINAL SUPPLY						5 mm	CMOS		1.8 V				.5 mm		S-XQCC-N32
10AS057K4F40E3SG	Intel	SoC		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V					GRID ARRAY	BGA1517,39X39,40	.87 V	100 Cel	0 Cel			BOTTOM		3.5 mm			40 mm								40 mm	TSMC		.9 V				1 mm		S-PBGA-B1517
1SX085HN3F43I2LG	Intel	MICROPROCESSOR CIRCUIT
1SX110HN1F43E1VG	Intel	MICROPROCESSOR CIRCUIT
1SX165HN1F43E2VG	Intel	SoC FPGA
1SX250LU3F50I3XG	Intel	SoC FPGA
1SX280HN3F43E1VG	Intel	SoC FPGA
5CSEBA5U19C6N	Intel	SoC
5CSEMA5F31C8N	Intel	SoC
AD6620ASZ	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	80	QFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V				3.3	FLATPACK	QFP80,.7SQ	3 V	85 Cel	-40 Cel	MATTE TIN		QUAD		3.4 mm			14 mm							260	14 mm	CMOS		3.3 V		DSP Peripherals		.65 mm		S-PQFP-G80	3	Not Qualified	e3
AGFA006R16A3E3V	Intel	SoC FPGA		BALL	1546		RECTANGULAR	PLASTIC/EPOXY	YES									100 Cel	0 Cel			BOTTOM																						R-PBGA-B1546
ATAES132A-MAHER-T	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2.5 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD		DUAL		.6 mm			2 mm						40	260	3 mm	CMOS		3.3 V				.5 mm		R-PDSO-N8	1
ATECC508A-MAHCZ-S	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	8	HVSON	RECTANGULAR	UNSPECIFIED	YES	5.5 V	TS 16949				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD		DUAL		.6 mm			2 mm						40	260	3 mm	CMOS						.5 mm		R-PDSO-N8	1

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.