Other Function uPs,uCs & Peripheral ICs

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Address Bus Width	DAC Channels	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	DMA Channels	Maximum Seated Height	ROM Words	RAM Words	Width	Data EEPROM Size	Additional Features	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Analog To Digital Convertors	Maximum Supply Current	Nominal Supply Voltage	PWM Channels	Sub-Category	Connectivity	ROM Programmability	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code	On Chip Program ROM Width	No. of I/O Lines
MEC1521H-B0-I/SZ-TR	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	144	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.89 V						GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA144,13X13,25	1.71 V	85 Cel		-40 Cel			BOTTOM		.8 mm			9 mm		ALSO OPERATES AT 3.3V NOMINAL VOLATGE		0	.032768 MHz			9 mm		CMOS			1.8 V					I2C, ESPI, UART	.65 mm	S-PBGA-B144
MFRC53101T/0FE,118	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	32	SOP	RECTANGULAR	PLASTIC/EPOXY	YES						3.3/5,5	SMALL OUTLINE	SOP32,.4		85 Cel		-25 Cel	NICKEL PALLADIUM GOLD		DUAL											30	250					150 mA			Other Microprocessor ICs				1.27 mm	R-PDSO-G32	1	Not Qualified		e4
MIMX8MN3CVTIZAA	NXP Semiconductors	SYSTEM ON CHIP																				TIN SILVER													40	260														3			e2
MKW41Z256VHT4	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	QCCN	SQUARE	UNSPECIFIED	YES	3.6 V						CHIP CARRIER		1.71 V	105 Cel		-40 Cel	NICKEL GOLD		QUAD											40	260			CMOS			3.3 V							S-XQCC-N48	3			e4
MPC8548ECHXAQG	Freescale Semiconductor	SoC	INDUSTRIAL	BALL	783	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1.155 V					1.1,1.8/2.5,2.5/3.3	GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel		-40 Cel	Tin/Lead/Silver (Sn/Pb/Ag)		BOTTOM		3.38 mm			29 mm						40	260	29 mm		CMOS			1.1 V		Microprocessors				1 mm	S-CBGA-B783	1	Not Qualified		e0
MPC8548ECHXAUJ	Freescale Semiconductor	SoC	INDUSTRIAL	BALL	783	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1.155 V					1.1,1.8/2.5,2.5/3.3	GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel		-40 Cel	Tin/Lead/Silver (Sn/Pb/Ag)		BOTTOM		3.38 mm			29 mm						40	260	29 mm		CMOS			1.1 V		Microprocessors				1 mm	S-CBGA-B783	1	Not Qualified		e0
MPFS025T-1FCSG325E	Microchip Technology	PROGRAMMABLE SoC		BALL	325		RECTANGULAR	PLASTIC/EPOXY	YES	1.03 V								.97 V	100 Cel		0 Cel			BOTTOM							ALSO OPERATES AT 1.05V NOMINAL SUPPLY								CMOS			1 V							R-PBGA-B325
MPFS025T-1FCVG484E	Microchip Technology	PROGRAMMABLE SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V						GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel		0 Cel			BOTTOM		2.92 mm			19 mm		ALSO OPERATES AT 1.05V NOMINAL SUPPLY						19 mm		CMOS			1 V						.8 mm	S-PBGA-B484
MPFS025T-1FCVG484I	Microchip Technology	PROGRAMMABLE SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V						GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel		-40 Cel			BOTTOM		2.92 mm			19 mm		ALSO OPERATES AT 1.05V NOMINAL SUPPLY						19 mm		CMOS			1 V						.8 mm	S-PBGA-B484
MPFS025T-FCSG325E	Microchip Technology	PROGRAMMABLE SoC		BALL	325		RECTANGULAR	PLASTIC/EPOXY	YES	1.03 V								.97 V	100 Cel		0 Cel			BOTTOM							ALSO OPERATES AT 1.05V NOMINAL SUPPLY								CMOS			1 V							R-PBGA-B325
MPFS025T-FCSG325I	Microchip Technology	PROGRAMMABLE SoC		BALL	325		RECTANGULAR	PLASTIC/EPOXY	YES	1.03 V								.97 V	100 Cel		-40 Cel			BOTTOM							ALSO OPERATES AT 1.05V NOMINAL SUPPLY								CMOS			1 V							R-PBGA-B325
MPFS095T-1FCSG536E	Microchip Technology	PROGRAMMABLE SoC		BALL	536	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V						GRID ARRAY, LOW PROFILE, FINE PITCH	BGA536,30X30,20	.97 V	100 Cel		0 Cel			BOTTOM		1.4 mm			16 mm		ALSO OPERATES AT 1.05V NOMINAL SUPPLY						16 mm		CMOS			1 V						.5 mm	S-PBGA-B536
MPFS095T-1FCVG484I	Microchip Technology	PROGRAMMABLE SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V						GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel		-40 Cel			BOTTOM		2.92 mm			19 mm		ALSO OPERATES AT 1.05V NOMINAL SUPPLY						19 mm		CMOS			1 V						.8 mm	S-PBGA-B484
MPFS160T-1FCVG484I	Microchip Technology	PROGRAMMABLE SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V						GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel		-40 Cel			BOTTOM		2.92 mm			19 mm		ALSO OPERATES AT 1.05V NOMINAL SUPPLY						19 mm		CMOS			1 V						.8 mm	S-PBGA-B484
MPFS160T-1FCVG784E	Microchip Technology	PROGRAMMABLE SoC		BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V						GRID ARRAY, FINE PITCH	BGA784,28X28,32	.97 V	100 Cel		0 Cel			BOTTOM		2.92 mm			23 mm		ALSO OPERATES AT 1.05V NOMINAL SUPPLY						23 mm		CMOS			1 V						.8 mm	S-PBGA-B784
MPFS160TS-FCVG484I	Microchip Technology	PROGRAMMABLE SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V						GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel		-40 Cel			BOTTOM		2.92 mm			19 mm		ALSO OPERATES AT 1.05V NOMINAL SUPPLY						19 mm		CMOS			1 V						.8 mm	S-PBGA-B484
MSP430F67471IPZ	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V				16	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD		1.6 mm	262144	32	14 mm				0		30	260	14 mm	32768	CMOS		11.75 mA	3.3 V		Microcontrollers		FLASH	I2C; SPI; UART	.5 mm	S-PQFP-G100	3	Not Qualified	25 rpm	e4
MSP430F67641AIPZR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V						FLATPACK, LOW PROFILE, FINE PITCH		1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD		1.6 mm		8	14 mm				0		30	260	14 mm	8192	CMOS			3.3 V					I2C; SPI; UART	.5 mm	S-PQFP-G100	3			e4
MSP430F67651AIPEU	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		0	NO	16		FLATPACK, LOW PROFILE, FINE PITCH		2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	YES	1.6 mm	131072	16	14 mm	0	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY	BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT	0	.032768 MHz	30	260	20 mm	16384	CMOS	6-Ch 10-Bit		3.3 V	YES		I2C(2), IRDA(4), SPI(6), UART(4)	FLASH	I2C; SPI; UART	.5 mm	R-PQFP-G128	3		25 rpm	e4	8	90
MSP430F67751AIPEUR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		0	NO	16		FLATPACK, LOW PROFILE, FINE PITCH		2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	YES	1.6 mm	131072	16	14 mm	0	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY	BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT	0	.032768 MHz	30	260	20 mm	16384	CMOS	6-Ch 10-Bit		3.3 V	YES		I2C(2), IRDA(4), SPI(6), UART(4)	FLASH	I2C; SPI; UART	.5 mm	R-PQFP-G128	3		25 rpm	e4	8	90
MSP430F67781AIPEU	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		0	NO	16		FLATPACK, LOW PROFILE, FINE PITCH		2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	YES	1.6 mm	524288	16	14 mm	0	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY	BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT	0	.032768 MHz	30	260	20 mm	16384	CMOS	6-Ch 10-Bit		3.3 V	YES		I2C(2), IRDA(4), SPI(6), UART(4)	FLASH	I2C; SPI; UART	.5 mm	R-PQFP-G128	3		25 rpm	e4	8	90
MSP430F6778IPZ	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V				16	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD		1.6 mm	524288	16	14 mm				0	25 MHz	30	260	14 mm	16384	CMOS		11.75 mA	3.3 V		Microcontrollers		FLASH	I2C; SPI; UART	.5 mm	S-PQFP-G100	3	Not Qualified	25 rpm	e4
NT3H1201W0FHKH	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	8	QCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V						CHIP CARRIER		1.7 V	95 Cel		-40 Cel			QUAD		.5 mm			1.6 mm							260	1.6 mm		CMOS										S-PQCC-N8	1
OMAPL138EZWTA3R	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V						GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.4 mm			16 mm		IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY		32	50 MHz	30	260	16 mm		CMOS			1.3 V					I2C; SPI; UART; USB	.8 mm	S-PBGA-B361	3		456 rpm	e1
PIC32CX1012BZ25048-I/MYX	Microchip Technology	SoC
PIC32MZ1025W104132-I/NX	Microchip Technology	SoC	INDUSTRIAL
SLB9645VQ12FW13333XUMA1	Infineon Technologies	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.98 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.62 V	85 Cel		-20 Cel	NICKEL GOLD PALLADIUM SILVER		QUAD		.9 mm			5 mm		ALSO OPERATES AT 3.3V NOMINAL VOLATGE						5 mm		CMOS			1.8 V						.5 mm	S-PQCC-N32	3
ST33GTPMA020FAE5	STMicroelectronics	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		AEC-Q100					SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25		105 Cel		-40 Cel			DUAL		1.2 mm			4.4 mm		also operates with 3.3v and 5v nominal						6.5 mm		CMOS			1.8 V						.65 mm	R-PDSO-G20
ST33HTPH2X32AHC5	STMicroelectronics	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		105 Cel		-40 Cel			QUAD		1 mm			5 mm		ALSO AVAILABLE WITH 3.3V NOM SUPPLY						5 mm		CMOS			1.8 V						.5 mm	S-XQCC-N32
ST4SIM-110A	STMicroelectronics	CRYPTOGRAPHIC AUTHENTICATOR
ST4SIM-110M	STMicroelectronics	CRYPTOGRAPHIC AUTHENTICATOR
ST4SIM-200S	STMicroelectronics	CRYPTOGRAPHIC AUTHENTICATOR
STM32W108HBU61TR	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	QCCN	SQUARE	PLASTIC/EPOXY	YES					32	1.25,1.8,2.5/3.3	CHIP CARRIER	LCC40,.24SQ,20		85 Cel	CORTEX-M3	-40 Cel	MATTE TIN		QUAD			131072								30	260		8192	CMOS		150 mA			Microcontrollers		FLASH		.5 mm	S-PQCC-N40	3	Not Qualified	24 rpm	e3
STWBC-EPTR	STMicroelectronics	MICROPROCESSOR CIRCUIT																																	NOT SPECIFIED	NOT SPECIFIED
STWBCTR	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			105 Cel		-40 Cel			QUAD		1 mm			5 mm								5 mm		CMOS			5 V						.5 mm	S-XQCC-N32
TDA4AL88TGAALZRQ1	Texas Instruments	SYSTEM ON CHIP		BALL	770	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V	AEC-Q100; ISO 26262					GRID ARRAY, FINE PITCH	BGA770,28X28,32	.76 V	125 Cel		-40 Cel			BOTTOM		2.57 mm			23 mm								23 mm		CMOS			.8 V						.8 mm	S-PBGA-B770	3		2000 rpm
TW8816-LA3-GRS	Renesas Electronics																					MATTE TIN													30	260														3			e3
VCBU65WMCE30	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V						GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	85 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm			13 mm				32		30	260	13 mm		CMOS			1.35 V					I2C; SPI; UART; USB	.65 mm	S-PBGA-B338	3			e1
VS3673UNION	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V						GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	85 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm			13 mm				32		30	260	13 mm		CMOS			1.35 V					I2C; SPI; UART; USB	.65 mm	S-PBGA-B338	3			e1
XC7Z012S-1CLG485I	Xilinx	SYSTEM ON CHIP		BALL	485	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V						GRID ARRAY, LOW PROFILE, FINE PITCH	BGA485,22X22,32	.95 V	100 Cel		-40 Cel			BOTTOM		1.6 mm			19 mm								19 mm		CMOS			1 V						.8 mm	S-PBGA-B485
XCZU11EG-1FFVC1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM											30	245			CMOS			.85 V							R-PBGA-B1156	4			e1
XCZU11EG-1FFVC1760I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM											30	245			CMOS			.85 V							R-PBGA-B1760	4			e1
XCZU11EG-2FFVB1517I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM											30	245			CMOS			.85 V							R-PBGA-B1517	4			e1
XCZU11EG-3FFVC1156E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.927 V						GRID ARRAY		.873 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM											30	245			CMOS			.9 V							R-PBGA-B1156	4			e1
XCZU19EG-2FFVE1924I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1924	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM											30	245			CMOS			.85 V							R-PBGA-B1924	4			e1
XCZU1CG-1SBVA484E	Xilinx	MICROPROCESSOR CIRCUIT																				Tin/Silver/Copper (Sn/Ag/Cu)													30	250														4			e1
XCZU1CG-1SBVA484I	Xilinx	MICROPROCESSOR CIRCUIT																				Tin/Silver/Copper (Sn/Ag/Cu)													30	250														4			e1
XCZU1CG-1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT																				Tin/Silver/Copper (Sn/Ag/Cu)													30	250														4			e1

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.