Other Function uPs,uCs & Peripheral ICs

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	Maximum Seated Height	ROM Words	RAM Words	Width	Additional Features	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	ROM Programmability	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code	No. of I/O Lines
ADDI7015BBCZ	Analog Devices																															260												3
ADDI7015BBCZRL	Analog Devices																															260												3
ADSP-SC589-ENG	Analog Devices	MICROPROCESSOR CIRCUIT		BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.05 V						BOTTOM	1.5 mm			19 mm							19 mm		CMOS		1.1 V				.8 mm		S-PBGA-B529
AM68A72AHGGHAALZR	Texas Instruments	SoC		BALL	770	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V				GRID ARRAY, FINE PITCH	BGA770,28X28,32	.76 V	105 Cel		-40 Cel			BOTTOM	2.57 mm			23 mm							23 mm		CMOS		.8 V				.8 mm		S-PBGA-B770
AM68A72ATGGHAALZR	Texas Instruments	SoC		BALL	770	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V				GRID ARRAY, FINE PITCH	BGA770,28X28,32	.76 V	105 Cel		-40 Cel			BOTTOM	2.57 mm			23 mm					30	260	23 mm		CMOS		.8 V				.8 mm		S-PBGA-B770	3
ATECC608B-RBHCZ-T	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	3	VBCC	RECTANGULAR	UNSPECIFIED	YES	5.5 V				CHIP CARRIER, VERY THIN PROFILE		2 V	85 Cel		-40 Cel			BOTTOM	.55 mm			2.5 mm							6.5 mm		CMOS					1-WIRE	2 mm		R-XBCC-N3
DH82Q87SR173	Intel	MICROPROCESSOR CIRCUIT		UNSPECIFIED			RECTANGULAR	UNSPECIFIED														UNSPECIFIED													CMOS
MXD1210CWE	Maxim Integrated	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V				SMALL OUTLINE		4.5 V	70 Cel		0 Cel	TIN LEAD		DUAL	1.75 mm			3.9 mm							9.9 mm		CMOS	.5 mA	5 V				1.27 mm		R-PDSO-G16	1	Not Qualified		e0
MXD1210CWE+	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V				SMALL OUTLINE		4.5 V	70 Cel		0 Cel	Matte Tin (Sn) - annealed		DUAL	1.75 mm			3.9 mm					30	260	9.9 mm		CMOS		5 V				1.27 mm		R-PDSO-G16	1	Not Qualified		e3
OMAPL138EZCED4	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm			13 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY		32	50 MHz	30	260	13 mm		CMOS		1.3 V			I2C; SPI; UART; USB	.65 mm		S-PBGA-B361	3		456 rpm	e1
TCI6630K2LXCMS	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.997 V				GRID ARRAY		.902 V				TIN SILVER COPPER		BOTTOM									30	245			CMOS		.95 V						S-PBGA-B900	4			e1
TIR1000PSRG4	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.3 V				SMALL OUTLINE		2.7 V	70 Cel		0 Cel	NICKEL PALLADIUM GOLD		DUAL	2 mm			5.3 mm	CAN ALSO OPERATE AT 5V SUPPLY				30	260	6.2 mm		CMOS		3 V				1.27 mm		R-PDSO-G8	1	Not Qualified		e4
TMS320DM365ZCEF	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25	1.14 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm		8192	13 mm			32		30	260	13 mm		CMOS		1.2 V	Digital Signal Processors		I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B338	3	Not Qualified		e1
XCZU1EG-2SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT																		Tin/Silver/Copper (Sn/Ag/Cu)											30	250												4			e1
1SX280LN2F43I2VG	Intel	SoC FPGA
1SX280LN2F43I2VGAS	Intel	MICROPROCESSOR CIRCUIT
AM6421BSDGHAALV	Texas Instruments	SYSTEM ON CHIP		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V				GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel		-40 Cel			BOTTOM	2.652 mm			17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY						17.2 mm		CMOS		.75 V				.8 mm		S-PBGA-B441
ATSAM4C8CB-AUT	Microchip Technology	SYSTEM ON CHIP		GULL WING	100	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1.32 V				FLATPACK, THIN PROFILE, FINE PITCH	TQFP100,.63SQ	1.08 V	85 Cel		-40 Cel			QUAD	1.2 mm			14 mm							14 mm		CMOS		1.2 V				.5 mm		S-PQFP-G100
ATSAM4C8CB-AUTR	Microchip Technology	SYSTEM ON CHIP		GULL WING	100	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1.32 V				FLATPACK, THIN PROFILE, FINE PITCH	TQFP100,.63SQ	1.08 V	85 Cel		-40 Cel			QUAD	1.2 mm			14 mm							14 mm		CMOS		1.2 V				.5 mm		S-PQFP-G100
ATWINC1510-MR210PB	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	4.2 V				MICROELECTRONIC ASSEMBLY		3 V	85 Cel		-40 Cel			UNSPECIFIED	2.113 mm			14.73 mm	SEATED HGT-NOM				NOT SPECIFIED	NOT SPECIFIED	21.72 mm		CMOS		3.6 V						R-XXMA-N28
BM83SM1-00TB	Microchip Technology	PROGRAMMABLE RFSoC		NO LEAD	50	XMA	RECTANGULAR	UNSPECIFIED	YES	4.2 V				MICROELECTRONIC ASSEMBLY		3.2 V	85 Cel		-40 Cel			UNSPECIFIED	2.5 mm			15 mm							32 mm		CMOS		3.8 V				1 mm		R-XXMA-N50
CY8C4149AZI-S593	Infineon Technologies	PROGRAMMABLE SYSTEM ON CHIP																		TIN												260												3			e3
CY8C4149AZI-S595	Infineon Technologies	PROGRAMMABLE SYSTEM ON CHIP																		TIN												260												3			e3
DA14695-00000HQ2	Renesas Electronics	SoC																																										3
DS28C16Q+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR																		Matte Tin (Sn) - annealed											30	260												1			e3
ECS300	Ecs International																															230												1
MCIMX283DVM4BR2	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	70 Cel		-20 Cel	TIN SILVER COPPER		BOTTOM	1.37 mm			14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V				40	260	14 mm		CMOS		1.45 V				.8 mm		S-PBGA-B289	3			e1
MCIMX6S5DVM10AD	NXP Semiconductors	SoC	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel		0 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm			21 mm					40	260	21 mm		CMOS						.8 mm		S-PBGA-B624	3			e1
5CSEMA4U23C6N	Intel	SoC
5CSEMA6F31C8N	Intel	SoC
ADSP-21583BBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.5 mm			19 mm				500 MHz	30	260	19 mm		CMOS		1.1 V			SPI; UART	.8 mm		S-PBGA-B349	3			e1
AM4376BZDND30	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	.912 V	90 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm			17 mm					30	260	17 mm		CMOS		.95 V				.65 mm		S-PBGA-B491	3			e1
AM4378BZDND80	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.326 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.21 V	90 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm			17 mm					30	260	17 mm		CMOS		1.26 V				.65 mm		S-PBGA-B491	3			e1
AN231E04-E2-QFNTR	Anadigm
ATAES132A-SHER-B	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949			SMALL OUTLINE	SOP8,.25	2.5 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		DUAL	1.75 mm			3.9 mm						260	4.9 mm		CMOS		3.3 V				1.27 mm		R-PDSO-G8	1
ATMXT640U-CCU023	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		BALL	88	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.47 V	TS 16949			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA88,10X10,20	2.7 V	85 Cel		-40 Cel			BOTTOM	.6 mm			6 mm					30	260	6 mm		CMOS		3.3 V				.5 mm		S-PBGA-B88
ATWINC3400-MR210CA122-T	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	36		RECTANGULAR	UNSPECIFIED	YES	4.2 V				MICROELECTRONIC ASSEMBLY		3 V	85 Cel		-40 Cel			UNSPECIFIED	2.087 mm			14.732 mm	SEATED HGT-CALCULATED				NOT SPECIFIED	NOT SPECIFIED	22.428 mm		CMOS		3.6 V				1.204 mm		R-XXMA-N36
C8051F062-GQ	Silicon Labs	SoC	INDUSTRIAL										3							TIN											40	260						Microcontrollers						3	Not Qualified		e3
CC430F5145IRGZR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		16	2/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1 mm	16384	2	7 mm	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY	TIMER	0	20 MHz	30	260	7 mm	2048	CMOS		3.3 V	Microcontrollers	FLASH	I2C; SPI; UART; USB	.5 mm		S-PQCC-N48	3	Not Qualified	20 rpm	e4	30
CC430F6147IRGCR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		16	2/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD SILVER	YES	QUAD	1 mm	32768	4	9 mm	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY		0	20 MHz	30	260	9 mm	4096	CMOS		3.3 V	Microcontrollers	FLASH	I2C; SPI; UART; USB	.5 mm		S-PQCC-N64	3	Not Qualified	20 rpm	e4
D2-71083-LR	Renesas Electronics	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.9 V				FLATPACK, LOW PROFILE, FINE PITCH		1.7 V	85 Cel		-10 Cel	MATTE TIN		QUAD	1.6 mm			14 mm					30	260	14 mm		CMOS		1.8 V				.4 mm		S-PQFP-G128	3			e3
DLPC3439CZEZ	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	201	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.045 V	85 Cel		-30 Cel	TIN SILVER COPPER		BOTTOM	1 mm			13 mm					30	260	13 mm		CMOS		1.1 V				.8 mm		S-PBGA-B201	3			e1
DRA821U4TCBALMRQ1	Texas Instruments	SoC		BALL	433	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V	AEC-Q100			GRID ARRAY, FINE PITCH	BGA433,21X21,32	.76 V	125 Cel		-40 Cel			BOTTOM	2.57 mm			17.2 mm						250	17.2 mm		CMOS		.8 V				.8 mm		S-PBGA-B433	3		2000 rpm
IS2083BM-232	Microchip Technology	PROGRAMMABLE RFSoC		BALL	82	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA82,10X10,20	1.14 V	85 Cel		-40 Cel			BOTTOM	.9 mm			5.5 mm							5.5 mm		CMOS		1.2 V				.5 mm		S-PBGA-B82
IS2083BM-232-TRAY	Microchip Technology	PROGRAMMABLE RFSoC		BALL	82	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA82,10X10,20	1.14 V	85 Cel		-40 Cel			BOTTOM	.9 mm			5.5 mm							5.5 mm		CMOS		1.2 V				.5 mm		S-PBGA-B82
MCIMX233DAG4C	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.55 V				FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63SQ,16	1 V	70 Cel		-10 Cel	TIN		QUAD	1.6 mm			14 mm					40	260	14 mm		CMOS		1.35 V				.4 mm		S-PQFP-G128	3			e3
MCIMX357CJQ5C	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.33 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm			17 mm	IT ALSO OPERATES AT 1.22 TO 1.47 V				40	260	17 mm		CMOS		1.8 V				.8 mm		S-PBGA-B400	3	Not Qualified		e1
MCIMX6U8DVM10AB	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel		0 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm			21 mm					40	260	21 mm		CMOS						.8 mm		S-PBGA-B624	3			e1

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.