Other Function uPs,uCs & Peripheral ICs

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	ADC Channels	Ultraviolet Erasable	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	External Data Bus Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	ROM Bits Size	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
CY8C3446LTI-073	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V			2/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	1.71 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		N	QUAD	1 mm		7 mm			20	260	7 mm	65536 Bits		CMOS		3.3 V	Other uPs/uCs/Peripheral ICs		.5 mm		S-XQCC-N48	3	Not Qualified	e4
D2-45057-QR	Renesas Electronics	SYSTEM ON CHIP		NO LEAD	68	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.9 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.4SQ,20	1.7 V	85 Cel		-10 Cel	NICKEL PALLADIUM GOLD			QUAD	1 mm		10 mm					10 mm			CMOS		1.8 V			.5 mm		S-PQCC-N68	3		e4
LS1043AXE8QQB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V				GRID ARRAY, FINE PITCH		.87 V	105 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM	2.07 mm		23 mm	ALSO OPERATES AT 1V SUPPLY NOM		30	250	23 mm			CMOS		.9 V			.8 mm		S-PBGA-B780	3		e1
MCIMX351AVM4B	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V	AEC-Q100			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,25	1.22 V	85 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM	1.6 mm		17 mm			40	260	17 mm			CMOS					.8 mm		S-PBGA-B400	3	Not Qualified	e1
MCIMX6QP7CVT8AA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, HEAT SINK/SLUG	BGA624,25X25,32	1.275 V	105 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM	2.16 mm		21 mm			40	260	21 mm			CMOS		1.4 V			.8 mm		S-PBGA-B624	3		e1
MCIMX6X3CVN08AB	NXP Semiconductors	SoC	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.275 V	105 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM	1.53 mm		17 mm			40	260	17 mm			CMOS					.8 mm		S-PBGA-B400	3		e1
MCIMX6X3CVO08AB	NXP Semiconductors	SoC	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.275 V	105 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM	1.53 mm		17 mm			40	260	17 mm			CMOS					.8 mm		S-PBGA-B400	3		e1
S32G254ASBK0VUCR	NXP Semiconductors	SoC	INDUSTRIAL																										40	260												3
STV0991FA	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	201	TFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100			GRID ARRAY, THIN PROFILE, FINE PITCH			105 Cel		-40 Cel				BOTTOM	1.12 mm		10 mm			NOT SPECIFIED	NOT SPECIFIED	10 mm			CMOS		1.1 V			.65 mm		S-PBGA-B201
STV0991FA/TR	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	201	TFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100			GRID ARRAY, THIN PROFILE, FINE PITCH			105 Cel		-40 Cel				BOTTOM	1.12 mm		10 mm			NOT SPECIFIED	NOT SPECIFIED	10 mm			CMOS		1.1 V			.65 mm		S-PBGA-B201
STV0991FAR/TR	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	201	TFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100			GRID ARRAY, THIN PROFILE, FINE PITCH			105 Cel		-40 Cel				BOTTOM	1.12 mm		10 mm			NOT SPECIFIED	NOT SPECIFIED	10 mm			CMOS		1.1 V			.65 mm		S-PBGA-B201
TCI6630K2LXCMSA	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.997 V				GRID ARRAY		.902 V				TIN SILVER COPPER			BOTTOM						30	245				CMOS		.95 V					S-PBGA-B900	4		e1
XCZU1EG-L1SBVA484I	Xilinx	MICROPROCESSOR CIRCUIT																		Tin/Silver/Copper (Sn/Ag/Cu)									30	250												4		e1
XCZU4CG-2FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)			BOTTOM						30	245				CMOS		.85 V					R-PBGA-B900	4		e1
XCZU5CG-2FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)			BOTTOM	2.88 mm		31 mm			30	245	31 mm			CMOS		.85 V			1 mm		R-PBGA-B900	4		e1
XCZU5EG-2SFVC784E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY	BGA784,28X28,32	.825 V	100 Cel		0 Cel	TIN SILVER COPPER			BOTTOM	3.32 mm		23 mm			30	250	23 mm			CMOS		.85 V			.8 mm		R-PBGA-B784	4		e1
AGFA006R16A2E3V	Intel	SoC FPGA		BALL	1546		RECTANGULAR	PLASTIC/EPOXY	YES								100 Cel		0 Cel				BOTTOM																		R-PBGA-B1546
AGFA027R24C2E3E	Intel	SoC FPGA		BALL	2340		RECTANGULAR	PLASTIC/EPOXY	YES								100 Cel		0 Cel				BOTTOM																		R-PBGA-B2340
AGFB012R24B2E2V	Intel	SoC FPGA
AGFB027R24C2E2V	Intel	SoC FPGA
AGFB027R25A2E2V	Intel	SoC FPGA
AGIB022R31B1E2V	Intel	SoC FPGA		BALL	3184		RECTANGULAR	PLASTIC/EPOXY	YES								100 Cel		0 Cel				BOTTOM																		R-PBGA-B3184
AGIB027R31B2E3E	Intel	SoC FPGA		BALL	3184		RECTANGULAR	PLASTIC/EPOXY	YES								100 Cel		0 Cel				BOTTOM																		R-PBGA-B3184
AGIB027R31B2I1V	Intel	SoC FPGA		BALL	3184		RECTANGULAR	PLASTIC/EPOXY	YES								100 Cel		-40 Cel				BOTTOM																		R-PBGA-B3184
AGIB027R31B2I3V	Intel	SoC FPGA		BALL	3184		RECTANGULAR	PLASTIC/EPOXY	YES								100 Cel		-40 Cel				BOTTOM																		R-PBGA-B3184
AGIB027R31B3E3E	Intel	SoC FPGA		BALL	3184		RECTANGULAR	PLASTIC/EPOXY	YES								100 Cel		0 Cel				BOTTOM																		R-PBGA-B3184
CY8C6244AZI-S4D93	Infineon Technologies	SoC		GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V				FLATPACK, LOW PROFILE, FINE PITCH	QFP80,.55SQ,20	1.7 V	85 Cel		-40 Cel				QUAD	1.6 mm		12 mm					12 mm			CMOS		1.8 V			.5 mm		S-PQFP-G80	3
DM355SDZCEA216	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V		32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	100 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM	1.3 mm	8192	13 mm	IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O	32	30	260	13 mm			CMOS		1.3 V	Digital Signal Processors	I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified	e1
MPFS250TFCVG484E	Microchip Technology	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V				GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel		0 Cel				BOTTOM	2.92 mm		19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY				19 mm			CMOS		1 V			.8 mm		S-PBGA-B484
MSP430F67641AIPNR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V				FLATPACK, LOW PROFILE, FINE PITCH		1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES		QUAD	1.6 mm	8	12 mm		0	30	260	12 mm		8192	CMOS		3.3 V		I2C; SPI; UART	.5 mm		S-PQFP-G80	3		e4
MXD1210EWE	Maxim Integrated	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V				SMALL OUTLINE		4.5 V	85 Cel		-40 Cel	TIN LEAD			DUAL	1.75 mm		3.9 mm					9.9 mm			CMOS	.5 mA	5 V			1.27 mm		R-PDSO-G16	1	Not Qualified	e0
MXD1210EWE+	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V				SMALL OUTLINE		4.5 V	85 Cel		-40 Cel	Matte Tin (Sn) - annealed			DUAL	1.75 mm		3.9 mm			30	260	9.9 mm			CMOS		5 V			1.27 mm		R-PDSO-G16	1	Not Qualified	e3
S32G234MABK0VUCT	NXP Semiconductors	SoC	INDUSTRIAL																										40	260												3
S32G234MSBK0VUCR	NXP Semiconductors	SoC	INDUSTRIAL																										40	260												3
S32G234MSBK0VUCT	NXP Semiconductors	SoC	INDUSTRIAL																										40	260												3
S32G254AABK0CUCR	NXP Semiconductors	SoC	INDUSTRIAL																										40	260												3
S32G254AABK0CUCT	NXP Semiconductors	SoC	INDUSTRIAL																										40	260												3
S32G254AABK0VUCR	NXP Semiconductors	SoC	INDUSTRIAL																										40	260												3
S32G254AABK0VUCT	NXP Semiconductors	SoC	INDUSTRIAL																										40	260												3
S32G254ASBK0VUCT	NXP Semiconductors	SoC	INDUSTRIAL																										40	260												3
TA100-Y230C2X01-00T-VAO	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100			SMALL OUTLINE	SOP8,.23	2.7 V	125 Cel		-40 Cel				DUAL	1.75 mm		3.9 mm					4.9 mm			CMOS					1.27 mm		R-PDSO-G8
TCI6630K2LXCMS2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.997 V				GRID ARRAY		.902 V				TIN SILVER COPPER			BOTTOM						30	245				CMOS		.95 V					S-PBGA-B900	4		e1
TDA8029HL/C207	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	6 V				FLATPACK, LOW PROFILE		2.7 V	90 Cel		-40 Cel				QUAD	1.6 mm		7 mm					7 mm			CMOS		3.3 V			.8 mm		S-PQFP-G32
VCBUSAM6467CT	Texas Instruments	MICROPROCESSOR CIRCUIT																		TIN SILVER COPPER									30	245												4		e1
XCVM1802-1MSEVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V				GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.775 V	100 Cel		0 Cel	TIN SILVER COPPER			BOTTOM	4 mm		40 mm					40 mm			CMOS		.8 V			.92 mm		S-PBGA-B1760			e1
XCZU1EG-1UBVA494I	Xilinx	MICROPROCESSOR CIRCUIT																		TIN SILVER BISMUTH COPPER NICKEL									30	245												4
XCZU48DR-2FSVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM						30	240				CMOS		.85 V					R-PBGA-B1517	4		e1
5CSEMA4U23I7N	Intel	SoC

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.