Other Function uPs,uCs & Peripheral ICs

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Address Bus Width	DAC Channels	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	ADC Channels	Ultraviolet Erasable	Terminal Position	DMA Channels	Maximum Seated Height	ROM Words	RAM Words	Width	Data EEPROM Size	Additional Features	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	ROM Bits Size	RAM Bytes	Technology	Analog To Digital Convertors	Nominal Supply Voltage	PWM Channels	Sub-Category	Connectivity	ROM Programmability	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code	On Chip Program ROM Width	No. of I/O Lines
LS1046AXE8Q1A	NXP Semiconductors	SoC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V						GRID ARRAY, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM		2.61 mm			23 mm						30	250	23 mm			CMOS		1 V						.8 mm	S-PBGA-B780	3			e1
M1A3P600L-1FGG144I	Microchip Technology	SoC																				TIN SILVER COPPER														30	260														3
MAXQ1061EUD+	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14		RECTANGULAR	PLASTIC/EPOXY	YES										109 Cel		-40 Cel	Matte Tin (Sn) - annealed			DUAL											30	260				CMOS									R-PDSO-G14	1			e3
MCIMX534AVV8C	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	AEC-Q100				1.1,1.3,1.8/3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.05 V	125 Cel		-40 Cel	TIN SILVER			BOTTOM		1.85 mm			19 mm						40	260	19 mm			CMOS		1.1 V		Graphics Processors				.8 mm	S-PBGA-B529	3	Not Qualified		e2
MCIMX6X4AVM08AB	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V						GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.275 V	125 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM		1.52 mm			19 mm						40	260	19 mm			CMOS								.8 mm	S-PBGA-B529	3			e1
MGM210PA32JIA2	Silicon Labs	SYSTEM ON CHIP
MKW01Z128CHN	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BUTT	60	VBCC	SQUARE	PLASTIC/EPOXY	YES	3.6 V						CHIP CARRIER, VERY THIN PROFILE		1.8 V	85 Cel		-40 Cel	NICKEL GOLD			BOTTOM		.98 mm			8 mm						40	260	8 mm			CMOS		3.3 V						.5 mm	S-PBCC-B60	3			e4
MPFS250T-1FCSG536I	Microchip Technology	PROGRAMMABLE SoC		BALL	536	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V						GRID ARRAY, LOW PROFILE, FINE PITCH	BGA536,30X30,20	.97 V	100 Cel		-40 Cel				BOTTOM		1.4 mm			16 mm		ALSO OPERATES AT 1.05V NOMINAL SUPPLY						16 mm			CMOS		1 V						.5 mm	S-PBGA-B536
MPFS250T-1FCVG784I	Microchip Technology	PROGRAMMABLE SoC		BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V						GRID ARRAY, FINE PITCH	BGA784,28X28,32	.97 V	100 Cel		-40 Cel				BOTTOM		2.92 mm			23 mm		ALSO OPERATES AT 1.05V NOMINAL SUPPLY						23 mm			CMOS		1 V						.8 mm	S-PBGA-B784
MSP430F6777AIPZR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		0	NO	16		FLATPACK, LOW PROFILE, FINE PITCH		2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES		QUAD	YES	1.6 mm	262144	32	14 mm	0	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY	BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT	0	.032768 MHz	30	260	14 mm		32768	CMOS	6-Ch 10-Bit	3.3 V	YES		I2C(2), IRDA(4), SPI(6), UART(4)	FLASH	I2C; SPI; UART	.5 mm	S-PQFP-G100	3		25 rpm	e4	8	62
SCANSTA112VS	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	TFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V					3.3	FLATPACK, THIN PROFILE, FINE PITCH	TQFP100,.63SQ	3 V	85 Cel		-40 Cel	Tin/Lead (Sn/Pb)			QUAD		1.2 mm			14 mm				0		NOT SPECIFIED	260	14 mm			CMOS		3.3 V		Other Microprocessor ICs				.5 mm	S-PQFP-G100	3	Not Qualified		e0
SCIMX538DZK1C	NXP Semiconductors	MICROPROCESSOR CIRCUIT		BALL	529	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.4 V					0.9/1.25,1.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA529,23X23,32	1.2 V							BOTTOM		.986 mm			12 mm						NOT SPECIFIED	NOT SPECIFIED	12 mm			CMOS		1.25 V		Graphics Processors				.5 mm	S-PBGA-B529		Not Qualified
XAZU7EV-1FBVB900Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES							GRID ARRAY	BGA900,30X30,40		125 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM		2.97 mm			31 mm				0		30	245	31 mm			CMOS		.85 V					CAN, I2C, SPI, UART	1 mm	S-PBGA-B900	4			e1
XC7Z014S-2CLG484E	Xilinx	SYSTEM ON CHIP		BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V						GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32	.95 V	100 Cel		0 Cel				BOTTOM		1.6 mm			19 mm								19 mm			CMOS		1 V						.8 mm	S-PBGA-B484
XC7Z035-2FBG676E	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V						GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel		0 Cel				BOTTOM		2.54 mm			27 mm								27 mm			CMOS		1 V						1 mm	S-PBGA-B676
XCZU4CG-L2SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES							GRID ARRAY						Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)			BOTTOM							IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)				30	250				CMOS		.72 V							S-PBGA-B784	4			e1
XCZU7EG-1FFVC1156E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)			BOTTOM											30	245				CMOS		.85 V							R-PBGA-B1156	4			e1
XCZU9EG-2FFVB1156E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)			BOTTOM		3.42 mm			35 mm						30	245	35 mm			CMOS		.85 V						1 mm	R-PBGA-B1156	4			e1
1904	Satcon Electronics
1SX250HN3F43E2VG	Intel	SoC FPGA
66AK2L06XCMSA2	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V						GRID ARRAY, FINE PITCH		.95 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)			BOTTOM		3.55 mm			25 mm						30	245	25 mm			CMOS		1.05 V						.8 mm	S-PBGA-B900	4			e1
AM4378BZDNA80	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.326 V						GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.21 V	105 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM		1.3 mm			17 mm						30	260	17 mm			CMOS		1.26 V						.65 mm	S-PBGA-B491	3			e1
AM4379BZDNA100	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.378 V						GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.272 V	105 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM		1.3 mm			17 mm						30	260	17 mm			CMOS		1.325 V						.65 mm	S-PBGA-B491	3			e1
AM6251ATGGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V						GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel		-40 Cel				BOTTOM		.89 mm			13 mm								13 mm			CMOS		.75 V						.5 mm	S-PBGA-B425
AS5046ASST	Ams Ag
ATECC608B-TNGTLSU-G	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V						SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2 V	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)			DUAL		.6 mm			2 mm				0	1 MHz			3 mm			CMOS								.5 mm	R-PDSO-N8				e4
CY8C3246PVI-147	Infineon Technologies	PSoC	INDUSTRIAL												1.8/5							NICKEL PALLADIUM GOLD		N												20	260		524288 Bits						Other uPs/uCs/Peripheral ICs						3	Not Qualified		e4
CY8C6347BZI-BLD33	Infineon Technologies	PROGRAMMABLE SoC																				TIN SILVER COPPER																													3			e1
EFR32MG12P433F1024GM68-C	Silicon Labs	SYSTEM ON CHIP
MCIMX286CVM4CR2	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V						GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	85 Cel		-40 Cel				BOTTOM		1.37 mm			14 mm		IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V				40	260	14 mm			CMOS		1.45 V						.8 mm	S-PBGA-B289	3
MCIMX356AVM4B	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V	AEC-Q100					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.22 V	85 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM		1.6 mm			17 mm						40	260	17 mm			CMOS		1.8 V						.8 mm	S-PBGA-B400	3	Not Qualified		e1
MCIMX6Y0DVM05AA	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V						GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.275 V	95 Cel		0 Cel				BOTTOM		1.32 mm			14 mm						40	260	14 mm			CMOS								.8 mm	S-PBGA-B289	3
MIMXRT117HCVM8A	NXP Semiconductors	SoC		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V						GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.1 V	105 Cel		-40 Cel				BOTTOM		1.52 mm			14 mm								14 mm			CMOS								.8 mm	S-PBGA-B289
MPFS025T-FCVG484I	Microchip Technology	PROGRAMMABLE SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V						GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel		-40 Cel				BOTTOM		2.92 mm			19 mm		ALSO OPERATES AT 1.05V NOMINAL SUPPLY						19 mm			CMOS		1 V						.8 mm	S-PBGA-B484
SE050A1HQ1/Z01SGZ	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR	OTHER	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.12SQ,16	1.62 V	85 Cel		-25 Cel	NICKEL PALLADIUM GOLD SILVER			QUAD		.33 mm			3 mm						30	260	3 mm			CMOS		1.8 V						.4 mm	S-PQCC-N20	1			e4
ST33HTPH2028AHD1	STMicroelectronics	CRYPTOGRAPHIC AUTHENTICATOR		GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES							SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25		105 Cel		-40 Cel				DUAL		1.2 mm			4.4 mm		ALSO OPERATES AT 3.3V NOMINAL VOLATGE				NOT SPECIFIED	NOT SPECIFIED	9.7 mm			CMOS		1.8 V						.65 mm	R-PDSO-G28
ST33HTPH2E28AAF1	STMicroelectronics	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES							SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25		105 Cel		-40 Cel				DUAL		1.2 mm			4.4 mm		ALSO OPERATES AT 3.3V NOMINAL VOLATGE						9.7 mm			CMOS		1.8 V						.65 mm	R-PDSO-G28
TMC389-LA	Trinamic Motion Control & Kg																					MATTE TIN															260														3			e3
UCD3138ARGCR	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3 V	125 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	YES		QUAD		1 mm			9 mm				0	2 MHz	30	260	9 mm			CMOS		3.3 V					I2C; UART	.5 mm	S-PQCC-N64	2			e4
XC7Z100-1FFG900C	Xilinx	SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V						GRID ARRAY	BGA900,30X30,40	.95 V	85 Cel		0 Cel				BOTTOM		3.24 mm			27 mm								27 mm			CMOS		1 V						1 mm	S-PBGA-B900
XCZU1CG-1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT																				Tin/Silver/Copper (Sn/Ag/Cu)														30	250														4			e1
XCZU1EG-1SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT																				Tin/Silver/Copper (Sn/Ag/Cu)														30	250														4			e1
XCZU28DR-2FFVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM											30	245				CMOS		.85 V							R-PBGA-B1517	4			e1
XCZU3CG-1SBVA484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)			BOTTOM											30	250				CMOS		.85 V							R-PBGA-B484	4			e1
XCZU7EV-1FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)			BOTTOM											30	245				CMOS		.85 V							R-PBGA-B900	4			e1
5CSEBA2U19I7N	Intel	SoC
5CSEBA4U19I7SN	Intel	SoC
5CSEBA4U23I7N	Intel	SoC

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.