Other Function uPs,uCs & Peripheral ICs

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Address Bus Width	DAC Channels	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	DMA Channels	Maximum Seated Height	ROM Words	RAM Words	Width	Data EEPROM Size	Additional Features	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Analog To Digital Convertors	Nominal Supply Voltage	PWM Channels	Sub-Category	Connectivity	ROM Programmability	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code	On Chip Program ROM Width	No. of I/O Lines
XAZU5EV-1SFVC784Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES							GRID ARRAY, FINE PITCH			125 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		3.32 mm			23 mm						30	250	23 mm		CMOS		.85 V						.8 mm	S-PBGA-B784	4			e1
XCZU1CG-1UBVA494E	Xilinx	MICROPROCESSOR CIRCUIT																				TIN SILVER BISMUTH COPPER NICKEL													30	245													4
XCZU1CG-1UBVA494I	Xilinx	MICROPROCESSOR CIRCUIT																				TIN SILVER BISMUTH COPPER NICKEL													30	245													4
XCZU4CG-2SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES							GRID ARRAY			100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM											30	250			CMOS		.85 V							S-PBGA-B784	4			e1
5CSEMA6F31C6N	Intel	SoC
ATWINC1500B-MU-Y	Microchip Technology	NETWORK CONTROLLER	INDUSTRIAL	NO LEAD	40	HQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	2.7 V	85 Cel		-40 Cel	MATTE TIN		QUAD		1 mm			5 mm					48 MHz			5 mm		CMOS		3.3 V						.4 mm	S-PQCC-N40				e3
C8051F060-GQ	Silicon Labs	SoC	INDUSTRIAL												3/3.3							MATTE TIN														260							Microcontrollers						3	Not Qualified		e3
CC1310F64RGZR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD		1 mm			7 mm						30	260	7 mm	28672	CMOS		3.3 V						.5 mm	S-PQCC-N48	3			e4
EFR32BG24A010F1024IM40-B	Silicon Labs	SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	1.71 V	125 Cel		-40 Cel			QUAD		.9 mm			5 mm								5 mm		CMOS		3 V						.4 mm	S-XQCC-N40
EFR32BG24A010F1024IM40-BR	Silicon Labs	SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	1.71 V	125 Cel		-40 Cel			QUAD		.9 mm			5 mm								5 mm		CMOS		3 V						.4 mm	S-XQCC-N40
EFR32BG24A020F1024IM48-BR	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	125 Cel		-40 Cel			QUAD		.9 mm			6 mm								6 mm		CMOS		3 V						.4 mm	S-XQCC-N48
EFR32BG24B220F1024IM48-BR	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	125 Cel		-40 Cel			QUAD		.9 mm			6 mm								6 mm		CMOS		3 V						.4 mm	S-XQCC-N48
EFR32MG24A020F1536IM40-BR	Silicon Labs	SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	1.71 V	125 Cel		-40 Cel			QUAD		.9 mm			5 mm								5 mm		CMOS		3 V						.4 mm	S-XQCC-N40
MCIMX283DVM4B	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V						GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	70 Cel		-20 Cel	TIN SILVER COPPER		BOTTOM		1.37 mm			14 mm		IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V				40	260	14 mm		CMOS		1.45 V						.8 mm	S-PBGA-B289	3	Not Qualified		e1
MCIMX6U5EVM10AD	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V						GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	105 Cel		-20 Cel	TIN SILVER COPPER		BOTTOM		1.6 mm			21 mm						40	260	21 mm		CMOS								.8 mm	S-PBGA-B624	3			e1
MGM210PA22JIA2	Silicon Labs	SYSTEM ON CHIP
MSP430F6777AIPZ	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		0	NO	16		FLATPACK, LOW PROFILE, FINE PITCH		2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	YES	1.6 mm	262144	32	14 mm	0	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY	BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT	0	.032768 MHz	30	260	14 mm	32768	CMOS	6-Ch 10-Bit	3.3 V	YES		I2C(2), IRDA(4), SPI(6), UART(4)	FLASH	I2C; SPI; UART	.5 mm	S-PQFP-G100	3		25 rpm	e4	8	62
MSP430F67791AIPZR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		0	NO	16		FLATPACK, LOW PROFILE, FINE PITCH		2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	YES	1.6 mm	524288	32	14 mm	0	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY	BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT	0	.032768 MHz	30	260	14 mm	32768	CMOS	6-Ch 10-Bit	3.3 V	YES		I2C(2), IRDA(4), SPI(6), UART(4)	FLASH	I2C; SPI; UART	.5 mm	S-PQFP-G100	3		25 rpm	e4	8	62
MSP430F6779AIPEU	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		0	NO	16		FLATPACK, LOW PROFILE, FINE PITCH		2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	YES	1.6 mm	524288	32	14 mm	0	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY	BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT	0	.032768 MHz	30	260	20 mm	32768	CMOS	6-Ch 10-Bit	3.3 V	YES		I2C(2), IRDA(4), SPI(6), UART(4)	FLASH	I2C; SPI; UART	.5 mm	R-PQFP-G128	3		25 rpm	e4	8	90
OMAPL138EZCE3	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V						GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm			13 mm		IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY		32	50 MHz	30	260	13 mm		CMOS		1.3 V					I2C; SPI; UART; USB	.65 mm	S-PBGA-B361	3		456 rpm	e1
SCANSTA111MT/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	48	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V					3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP48,.3,20	3 V	85 Cel		-40 Cel	MATTE TIN		DUAL		1.1 mm			6.1 mm						30	260	12.5 mm		CMOS		3.3 V		Other Microprocessor ICs				.5 mm	R-PDSO-G48	2	Not Qualified		e3
STSPIN32F0602TR	STMicroelectronics	MICROPROCESSOR CIRCUIT																																	NOT SPECIFIED	NOT SPECIFIED
WBZ451PE-I	Microchip Technology	SoC
XC7Z030-3FFG676E	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V						GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel		0 Cel			BOTTOM		3.24 mm			27 mm								27 mm		CMOS		1 V						1 mm	S-PBGA-B676
XCZU11EG-1FFVF1517I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM											30	245			CMOS		.85 V							R-PBGA-B1517	4			e1
XCZU19EG-2FFVC1760E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM		3.71 mm			42.5 mm						30	245	42.5 mm		CMOS		.85 V						1 mm	R-PBGA-B1760	4			e1
XCZU1CG-1SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT																				Tin/Silver/Copper (Sn/Ag/Cu)													30	250													4			e1
XCZU1EG-1SFVA625E	Xilinx	MICROPROCESSOR CIRCUIT																				Tin/Silver/Copper (Sn/Ag/Cu)													30	250													4			e1
XCZU4CG-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES							GRID ARRAY			100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM							IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)				30	250			CMOS		.72 V							S-PBGA-B784	4			e1
XCZU7EG-1FFVC1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM											30	245			CMOS		.85 V							R-PBGA-B1156	4			e1
XCZU7EG-2FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM		2.97 mm			31 mm						30	245	31 mm		CMOS		.85 V						1 mm	R-PBGA-B900	4			e1
XCZU7EG-3FFVC1156E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.927 V						GRID ARRAY		.873 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM											30	245			CMOS		.9 V							R-PBGA-B1156	4			e1
XCZU7EG-L1FFVC1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V						GRID ARRAY		.698 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM							ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY				30	245			CMOS		.72 V							R-PBGA-B1156	4			e1
XCZU7EG-L2FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V						GRID ARRAY		.698 V	110 Cel		0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM							ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY				30	245			CMOS		.72 V							R-PBGA-B900	4			e1
XVF3000-TQ128-CA	Xmos	MICROPROCESSOR CIRCUIT		GULL WING	128	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1.05 V						FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP128,.63SQ,16	.95 V	70 Cel		0 Cel			QUAD		1.2 mm			14 mm								14 mm		CMOS		1 V						.4 mm	S-PQFP-G128
5CSEBA2U19I7SN	Intel	SoC
A13	Allwinner Technology	MICROPROCESSOR CIRCUIT		GULL WING	176	HQFP	UNSPECIFIED	PLASTIC/EPOXY	YES							FLATPACK, HEAT SINK/SLUG								QUAD															CMOS									X-PQFP-G176
AR1100T-I/MQ	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.465 V	TS 16949					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.20SQ,25	3.135 V	85 Cel		-40 Cel	MATTE TIN		QUAD		1 mm			5 mm		ALSO OPERATES AT 5V SUPPLY						5 mm		CMOS		3.3 V						.65 mm	S-PQCC-N20				e3
ATMXT641TD-ATR	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		GULL WING	100	TFQFP	SQUARE	PLASTIC/EPOXY	YES	3.47 V	AEC-Q100; TS 16949					FLATPACK, THIN PROFILE, FINE PITCH	TQFP100,.63SQ	3.14 V	85 Cel		-40 Cel			QUAD		1.2 mm			14 mm								14 mm		CMOS		3.3 V						.5 mm	S-PQFP-G100
ATTPM20P-G3MA1-10-B	Microchip Technology	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	3.3 V	TS 16949					SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.11,20	1.8 V	70 Cel		0 Cel			DUAL		.6 mm			2 mm								3 mm		CMOS							SPI	.5 mm	R-PDSO-N8
CY8C4045LQI-S411	Infineon Technologies	PSoC	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1.89 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	1.71 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD		.6 mm			4 mm						30	260	4 mm		CMOS		1.8 V						.5 mm	S-XQCC-N24	3			e4
CY8C4127LQI-BL453	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL																			PURE TIN													30	260													3
CYAT827AZA59-22002	Infineon Technologies	PSoC
CYAT827AZA59-2200A	Infineon Technologies	PSoC
CYAT827AZA59-3200A	Infineon Technologies	PSoC
EFR32BG24B220F1024IM48-B	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	125 Cel		-40 Cel			QUAD		.9 mm			6 mm								6 mm		CMOS		3 V						.4 mm	S-XQCC-N48
EFR32MG22C224F512IM32-C	Silicon Labs	SYSTEM ON CHIP																				MATTE TIN													40	260													2			e3
LS1021AXE7KQB	NXP Semiconductors	MICROPROCESSOR CIRCUIT		BALL	525	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V						GRID ARRAY, HEAT SINK/SLUG		.97 V				TIN SILVER COPPER		BOTTOM		2.07 mm			19 mm						40	260	19 mm		CMOS		1 V						.8 mm	S-PBGA-B525	3			e1

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.