Other Function uPs,uCs & Peripheral ICs

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	No. of Bits	DAC Channels	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	DMA Channels	Maximum Seated Height	ROM Words	RAM Words	Width	Data EEPROM Size	Additional Features	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Analog To Digital Convertors	Maximum Supply Current	Nominal Supply Voltage	PWM Channels	Sub-Category	ROM Programmability	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code	No. of I/O Lines
MCIMX536AVV8C	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	AEC-Q100				1.1,1.3,1.8/3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.05 V	125 Cel		-40 Cel	TIN SILVER		BOTTOM		1.85 mm			19 mm						40	260	19 mm		CMOS			1.1 V		Graphics Processors			.8 mm	S-PBGA-B529	3	Not Qualified		e2
MCIMX6Z0DVM09AB	NXP Semiconductors	SoC		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V						GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.375 V	95 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.32 mm			14 mm						40	260	14 mm		CMOS								.8 mm	S-PBGA-B289	3			e1
P82B715PE4	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	12 V						IN-LINE		4.5 V	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		DUAL		5.08 mm			7.62 mm		VCCB(Min)(V) is 3, VCCB(Max)(V) is 12		0	.4 MHz	NOT SPECIFIED	260	9.81 mm		BIPOLAR			5 V				I2C	2.54 mm	R-PDIP-T8	1	Not Qualified		e4
5CSEBA6U23I7N	Intel	SoC
AM4378BZDNA100	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.378 V						GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.272 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm			17 mm						30	260	17 mm		CMOS			1.325 V					.65 mm	S-PBGA-B491	3			e1
AM5718AABCXEA	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V						GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		2.96 mm			23 mm						30	250	23 mm		CMOS			1.15 V					.8 mm	S-PBGA-B760	3		1500 rpm	e1
LS1021ASN7KQB	NXP Semiconductors	MICROPROCESSOR CIRCUIT		BALL	525	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V						GRID ARRAY, HEAT SINK/SLUG		.97 V				TIN SILVER COPPER		BOTTOM		2.07 mm			19 mm						40	260	19 mm		CMOS			1 V					.8 mm	S-PBGA-B525	3			e1
MCIMX31CVMN4CR2	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	473	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V					1.3,1.8,1.8/3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA473,23X23,32	1.22 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.54 mm			19 mm						40	260	19 mm		CMOS			1.4 V		Microprocessors			.8 mm	S-PBGA-B473	3	Not Qualified		e1
MCP25050-E/SL	Microchip Technology	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949	8			5	SMALL OUTLINE	SOP14,.24	4.5 V	125 Cel		-40 Cel	Matte Tin (Sn)		DUAL		1.75 mm			3.9 mm								8.65 mm		CMOS			5 V		Parallel IO Port			1.27 mm	R-PDSO-G14	1	Not Qualified		e3
MTFC4GLDDQ-4MIT	Micron Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	100	LBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V						GRID ARRAY, LOW PROFILE		2.7 V	85 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM		1.4 mm			14 mm						30	260	18 mm		CMOS			3.3 V					1 mm	R-PBGA-B100				e1
NRF9160-SIAA-R	Nordic Semiconductor Asa	MICROCONTROLLER, CISC	INDUSTRIAL	NO LEAD	127	LGA	RECTANGULAR	UNSPECIFIED	YES	5.5 V						GRID ARRAY	LGA127,21X30,20	3 V	85 Cel		-40 Cel			BOTTOM		1.1 mm			10.5 mm								16 mm		CMOS			3.8 V					.5 mm	R-XBGA-N127
AM6442BSFGHAALV	Texas Instruments	SYSTEM ON CHIP		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V						GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel		-40 Cel			BOTTOM		2.652 mm			17.2 mm		ALSO OPERATES AT 0.85V NOMINAL SUPPLY					250	17.2 mm		CMOS			.75 V					.8 mm	S-PBGA-B441	3		1000 rpm
EFR32MG12P432F1024IM48-CR	Silicon Labs	SYSTEM ON CHIP		NO LEAD	48	HVQCCN	SQUARE		YES	3.8 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	1.8 V	125 Cel		-40 Cel			QUAD		.9 mm			7 mm								7 mm		CMOS			3.3 V					.5 mm	S-XQCC-N48
MCIMX27VOP4A	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	404	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.52 V						GRID ARRAY, LOW PROFILE, FINE PITCH		1.38 V	85 Cel		-20 Cel	TIN SILVER COPPER		BOTTOM		1.4 mm			17 mm		ALSO OPERATES WITH 1.3VNOM @266MHZ				40	260	17 mm		CMOS			1.45 V					.65 mm	S-PBGA-B404	3	Not Qualified		e1
MCIMX6S7CVM08AB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V						GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.6 mm			21 mm		24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE				40	260	21 mm		CMOS								.8 mm	S-PBGA-B624	3			e1
MCIMX6X2AVN08AB	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V						GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.275 V	125 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.53 mm			17 mm						40	260	17 mm		CMOS			1.8 V					.8 mm	S-PBGA-B400	3			e1
NRF9160-SIAA-R7	Nordic Semiconductor Asa	MICROCONTROLLER, CISC	INDUSTRIAL	NO LEAD	127	LGA	RECTANGULAR	UNSPECIFIED	YES	5.5 V						GRID ARRAY	LGA127,21X30,20	3 V	85 Cel		-40 Cel			BOTTOM		1.1 mm			10.5 mm								16 mm		CMOS			3.8 V					.5 mm	R-XBGA-N127
XCZU25DR-2FFVE1156E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		0 Cel	TIN SILVER COPPER		BOTTOM											30	245			CMOS			.85 V						R-PBGA-B1156	4			e1
XCZU25DR-2FSVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		0 Cel	TIN SILVER COPPER		BOTTOM											30	240			CMOS			.85 V						R-PBGA-B1517	4			e1
XCZU5CG-2SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES							GRID ARRAY			100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM											30	250			CMOS			.85 V						S-PBGA-B784	4			e1
BM94801KUT-Z	ROHM	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	128	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1.65 V						FLATPACK, THIN PROFILE, FINE PITCH		1.5 V	85 Cel		-40 Cel			QUAD		1.2 mm			14 mm						NOT SPECIFIED	NOT SPECIFIED	14 mm		CMOS			1.55 V					.4 mm	S-PQFP-G128
CC1310F32RGZR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD		1 mm			7 mm						NOT SPECIFIED	260	7 mm	28672	CMOS			3.3 V					.5 mm	S-PQCC-N48	3			e4
CP2108-B02-GM	Silicon Labs	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3 V	85 Cel		-40 Cel			QUAD		.9 mm			9 mm						NOT SPECIFIED	NOT SPECIFIED	9 mm		CMOS			3.3 V					.5 mm	S-XQCC-N64
MCIMX6QP7CVT8AB	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V						GRID ARRAY, HEAT SINK/SLUG	BGA624,25X25,32	1.275 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		2.16 mm			21 mm						40	260	21 mm		CMOS			1.4 V					.8 mm	S-PBGA-B624	3			e1
MSP430F6779IPZR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V				16	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD		1.6 mm	524288	32	14 mm				0	25 MHz	30	260	14 mm	32768	CMOS		11.75 mA	3.3 V		Microcontrollers	FLASH	I2C; SPI; UART	.5 mm	S-PQFP-G100	3	Not Qualified	25 rpm	e4
MV78460-B0-BJR4C160	Marvell Technology	SoC		BALL	732	FBGA	SQUARE	PLASTIC/EPOXY	YES	.95 V						GRID ARRAY, FINE PITCH	BGA732,48X48,18	.85 V	105 Cel		0 Cel			BOTTOM		2.01 mm			23 mm								23 mm		CMOS			.9 V					.65 mm	S-PBGA-B732
SCANSTA112VS/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	TFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V					3.3	FLATPACK, THIN PROFILE, FINE PITCH	TQFP100,.63SQ	3 V	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD		1.2 mm			14 mm				0		NOT SPECIFIED	260	14 mm		CMOS			3.3 V		Other Microprocessor ICs			.5 mm	S-PQFP-G100	3	Not Qualified		e4
SLB9670XQ12FW640XUMA1	Infineon Technologies	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.95 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.65 V	85 Cel		-40 Cel			QUAD		.9 mm			5 mm		ALSO OPERATES AT 3.3V NOMINAL VOLATGE						5 mm		CMOS			1.8 V					.5 mm	S-PQCC-N32
XCZU25DR-L1FFVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V						GRID ARRAY		.698 V	100 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM							ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY				30	245			CMOS			.72 V						R-PBGA-B1517	4			e1
XCZU25DR-L1FSVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V						GRID ARRAY		.698 V	100 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM							ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY				30	240			CMOS			.72 V						R-PBGA-B1517	4			e1
XCZU25DR-L2FSVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V						GRID ARRAY		.698 V	100 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM											30	240			CMOS			.72 V						R-PBGA-B1156	4			e1
XCZU5EV-1FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM											30	245			CMOS			.85 V						R-PBGA-B900	4			e1
AX8052F151-2-TB05	Onsemi	SYSTEM ON CHIP	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.35X.55	2.2 V	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD		1 mm			5 mm							260	7 mm		CMOS			3 V					.5 mm	R-PQCC-N40	1			e4
EFR32BG24B210F1024IM48-B	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	125 Cel		-40 Cel			QUAD		.9 mm			6 mm								6 mm		CMOS			3 V					.4 mm	S-XQCC-N48
EFR32MG12P432F1024GM48-CR	Silicon Labs	SYSTEM ON CHIP		NO LEAD	48	HVQCCN	SQUARE		YES	3.8 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	1.8 V	85 Cel		-40 Cel			QUAD		.9 mm			7 mm								7 mm		CMOS			3.3 V					.5 mm	S-XQCC-N48
MCIMX6X1AVO08AB	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V						GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.275 V	125 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.53 mm			17 mm						40	260	17 mm		CMOS			1.8 V					.8 mm	S-PBGA-B400	3			e1
XC7Z035-2FBG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V						GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel		-40 Cel			BOTTOM		2.54 mm			27 mm								27 mm		CMOS			1 V					1 mm	S-PBGA-B676
453-00052R	Laird Technologies	SoC
AS5040ASSU	Ams Ag
CC3200MODR1M2AMOBT	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	BUTT	63	BCC	RECTANGULAR	UNSPECIFIED	YES	3.6 V			NO			CHIP CARRIER		2.3 V	70 Cel		-20 Cel	NICKEL GOLD	YES	BOTTOM	NO	2.45 mm			17.5 mm	0			0		30	260	20.5 mm		CMOS	4-Ch 12-Bit		3.3 V	NO			I2C; SPI; UART	1.27 mm	R-XBCC-B63	3			e4	25
CSR8675C-IBBH-R	Qualcomm	MICROPROCESSOR CIRCUIT		BALL		BGA	UNSPECIFIED	PLASTIC/EPOXY	YES							GRID ARRAY								BOTTOM															CMOS									X-PBGA-B
MTFC4GMDEA-4MIT	Micron Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.95 V						GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.65 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		.8 mm			11.5 mm		IT ALSO OPERATES AT 3.3 VOLTS						13 mm		CMOS			1.8 V					.5 mm	R-PBGA-B153				e1
XCZU4EV-L1FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V						GRID ARRAY		.698 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM							ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY				30	245			CMOS			.72 V						R-PBGA-B900	4			e1
CC2340R52E0RKPR	Texas Instruments	SoC		NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	1.71 V	125 Cel		-40 Cel			QUAD		1 mm			5 mm								5 mm		CMOS			1.8 V					.4 mm	S-PQCC-N40
CC430F5147IRGZR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V				16	2/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD		QUAD		1 mm	32768	4	7 mm		IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY	TIMER		20 MHz	30	260	7 mm	4096	CMOS			3.3 V		Microcontrollers	FLASH	I2C; SPI; UART; USB	.5 mm	S-PQCC-N48	3	Not Qualified	20 rpm	e4	30
CY8C4246PVI-DS402	Infineon Technologies	PSoC																				NICKEL PALLADIUM GOLD																											3			e4
CY8C4248LQI-BL483	Infineon Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.71 V	85 Cel		-40 Cel			QUAD		.6 mm			7 mm								7 mm		CMOS			3.3 V					.4 mm	S-XQCC-N56
EFR32MG24B120F1536IM48-B	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	125 Cel		-40 Cel			QUAD		.9 mm			6 mm								6 mm		CMOS			3 V					.4 mm	S-XQCC-N48

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.