Other Function uPs,uCs & Peripheral ICs

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	External Data Bus Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
XCZU19EG-2FFVB1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM					30	245			CMOS		.85 V			R-PBGA-B1517	4		e1
AM4376BZDND80	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.326 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.21 V	90 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	17 mm			30	260	17 mm		CMOS		1.26 V		.65 mm	S-PBGA-B491	3		e1
CC1310F32RGZT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	1 mm	7 mm			NOT SPECIFIED	260	7 mm	28672	CMOS		3.3 V		.5 mm	S-PQCC-N48	3		e4
MCIMX6L8DVN10AA	NXP Semiconductors	SoC		BALL	432	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, THIN PROFILE, FINE PITCH	BGA432,24X24,20	1.375 V	95 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.1 mm	13 mm			40	260	13 mm		CMOS				.5 mm	S-PBGA-B432	3		e1
SLB9665XQ20FW563XUMA2	Infineon Technologies	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	3 V	85 Cel		-40 Cel	NICKEL GOLD PALLADIUM SILVER	QUAD	.9 mm	5 mm					5 mm		CMOS		3.3 V		.5 mm	S-PQCC-N32	3
USB2660I-JZX-03-TR	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	64	QCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V	TS 16949	3.3	CHIP CARRIER	LCC64,.30SQ,16	3 V	85 Cel		-40 Cel	MATTE TIN	QUAD	.9 mm	7.5 mm					7.5 mm			275 mA	3.3 V	Bus Controllers	.4 mm	S-PQCC-N64		Not Qualified	e3
88E1111-BAB	Marvell Technology
AX8052F143-3-TX40	Onsemi	SYSTEM ON CHIP	INDUSTRIAL	NO LEAD	40	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V			CHIP CARRIER, VERY THIN PROFILE, HEAT SINK/SLUG	LCC40,.2X.28,20	1.8 V	85 Cel		-40 Cel	NICKEL GOLD PALLADIUM	QUAD	1 mm	5 mm			30	260	7 mm		CMOS		3 V		.5 mm	R-PQCC-N40	1
CLRC66301HN,151	NXP Semiconductors
CY8CPLC10-28PVXIT	Infineon Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V		5	SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	4.75 V	85 Cel		-40 Cel	MATTE TIN	DUAL	2 mm	5.3 mm			20	260	10.2 mm		CMOS		5 V	Other uPs/uCs/Peripheral ICs	.65 mm	R-PDSO-G28	3	Not Qualified	e3
EFR32MG21A010F512IM32-B	Silicon Labs	SYSTEM ON CHIP	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.16SQ,16	1.71 V	125 Cel		-40 Cel	MATTE TIN	QUAD	.9 mm	4 mm			40	260	4 mm		CMOS		3 V		.4 mm	S-XQCC-N32	2		e3
SCANSTA112SMX/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	100	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V		3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA100,10X10,32	3 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm	10 mm		0	30	260	10 mm		CMOS		3.3 V	Other Microprocessor ICs	.8 mm	S-PBGA-B100	4	Not Qualified	e1
XC7Z015-3CLG485E	Xilinx	SYSTEM ON CHIP		BALL	485	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA485,22X22,32	.95 V	100 Cel		0 Cel		BOTTOM	1.6 mm	19 mm					19 mm		CMOS		1 V		.8 mm	S-PBGA-B485
XC7Z035-1FFG676C	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	85 Cel		0 Cel		BOTTOM	3.24 mm	27 mm					27 mm		CMOS		1 V		1 mm	S-PBGA-B676
XCZU3EG-1SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM					30	250			CMOS		.85 V			R-PBGA-B784	4		e1
BGM13S22F512GA-V3R	Silicon Labs	SoC
CY8CPLC10-28PVXI	Infineon Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V		5	SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	4.75 V	85 Cel		-40 Cel	MATTE TIN	DUAL	2 mm	5.3 mm			20	260	10.2 mm		CMOS		5 V	Other uPs/uCs/Peripheral ICs	.65 mm	R-PDSO-G28	3	Not Qualified	e3
MCIMX7D7DVM10SC	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	541	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.25 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA541,25X25,30	1.045 V	95 Cel		0 Cel		BOTTOM	1.4 mm	19 mm			40	260	19 mm		CMOS		1.1 V		.75 mm	S-PBGA-B541	3
XC7Z045-3FFG676E	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	3.24 mm	27 mm					27 mm		CMOS		1 V		1 mm	S-PBGA-B676	4		e1
AM4372BZDNA80	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.326 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.21 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	17 mm			30	260	17 mm		CMOS		1.26 V		.65 mm	S-PBGA-B491	3		e1
XCZU7EV-3FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.927 V			GRID ARRAY		.873 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM					30	245			CMOS		.9 V			R-PBGA-B900	4		e1
ATSHA204A-MAHDA-S	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	8	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.08,20	2 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	.6 mm	2 mm			30	260	3 mm		CMOS		3.3 V		.5 mm	R-PQCC-N8	1		e4
DA16200MOD-AAC4WA32	Renesas Electronics	SYSTEM ON CHIP																							40	260
MCIMX515DJM8CR2	NXP Semiconductors	SYSTEM ON CHIP		BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel		-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	19 mm			40	260	19 mm		CMOS		1.1 V	Graphics Processors	.8 mm	S-PBGA-B529	3	Not Qualified	e1
MCIMX6X4CVM08AB	NXP Semiconductors	SoC	INDUSTRIAL	BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.275 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.52 mm	19 mm			40	260	19 mm		CMOS				.8 mm	S-PBGA-B529	3		e1
ST33HTPH2X32AHD4	STMicroelectronics	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		105 Cel		-40 Cel		QUAD	1 mm	5 mm	ALSO OPERATES AT 3.3V NOMINAL VOLATGE		NOT SPECIFIED	NOT SPECIFIED	5 mm		CMOS		1.8 V		.5 mm	S-XQCC-N32
CC1310F64RHBT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	1 mm	5 mm			NOT SPECIFIED	260	5 mm	28672	CMOS		3.3 V		.5 mm	S-PQCC-N32	3		e4
EFR32MG21A010F1024IM32-B	Silicon Labs	SYSTEM ON CHIP	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.16SQ,16	1.71 V	125 Cel		-40 Cel	MATTE TIN	QUAD	.9 mm	4 mm			40	260	4 mm		CMOS		3 V		.4 mm	S-XQCC-N32	2		e3
MCIMX6X1CVK08AB	NXP Semiconductors	SoC	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.275 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	14 mm			40	260	14 mm		CMOS				.8 mm	S-PBGA-B400	3		e1
ZL30250LDG1	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1.89 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.71 V	85 Cel		-40 Cel		QUAD	1 mm	5 mm	IT ALSO OPERATES AT 3.3V NOMINAL SUPPLY				5 mm		CMOS		1.8 V		.5 mm	S-XQCC-N32
AX-SFUS-1-01-TB05	Onsemi	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	3.6 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel		-40 Cel	NICKEL GOLD PALLADIUM	QUAD	1 mm	5 mm			30	260	7 mm		CMOS		3 V		.5 mm	R-XQCC-N40	1
CY8C4149AZI-S598	Infineon Technologies	PROGRAMMABLE SYSTEM ON CHIP																	TIN							260									3		e3
MIMX8MD6DVAJZAA	NXP Semiconductors	SoC																								260									3
XC7Z015-1CL485I	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	485	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32	.95 V	100 Cel		-40 Cel		BOTTOM	1.6 mm	19 mm					19 mm		CMOS		1 V		.8 mm	S-PBGA-B485
AM5716AABCX	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V			GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	90 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm	23 mm			30	250	23 mm		CMOS		1.15 V		.8 mm	S-PBGA-B760	3		e1
AM6231ASGGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel		-40 Cel		BOTTOM	.89 mm	13 mm					13 mm		CMOS		.75 V		.5 mm	S-PBGA-B425
MCIMX6S5EVM10AB	NXP Semiconductors	SoC	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	105 Cel		-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm			40	260	21 mm		CMOS				.8 mm	S-PBGA-B624	3		e1
MCIMX7D3DVK10SC	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	488	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.25 V			GRID ARRAY, THIN PROFILE, FINE PITCH	BGA488,28X28,16	1.045 V	95 Cel		0 Cel		BOTTOM	1.1 mm	12 mm			40	260	12 mm		CMOS		1.1 V		.4 mm	S-PBGA-B488	3
LTC4263IS#PBF	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V			SMALL OUTLINE		4.5 V	85 Cel		-40 Cel	MATTE TIN	DUAL	1.752 mm	3.899 mm			30	260	8.649 mm		CMOS		5 V		1.27 mm	R-PDSO-G14	1	Not Qualified	e3
MPFS250T-FCSG536I	Microchip Technology	PROGRAMMABLE SoC		BALL	536	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA536,30X30,20	.97 V	100 Cel		-40 Cel		BOTTOM	1.4 mm	16 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY				16 mm		CMOS		1 V		.5 mm	S-PBGA-B536
SE051P2HQ1/Z011AZ	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.12SQ,16	1.62 V	105 Cel		-40 Cel		QUAD	.33 mm	3 mm				260	3 mm		CMOS		1.8 V		.4 mm	S-XQCC-N20	1
XCZU11EG-1FFVC1156E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM					30	245			CMOS		.85 V			R-PBGA-B1156	4		e1
ATMXT224S-MAUR036	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	3.47 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.24SQ,14	3 V	85 Cel		-40 Cel		QUAD	.6 mm	6 mm					6 mm		CMOS		3.3 V		.35 mm	S-XQCC-N56
ATSHA204A-XHDA-T	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR		GULL WING	8	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TSSOP8,.25	2 V	85 Cel		-40 Cel		DUAL	1.2 mm	3 mm					4.4 mm		CMOS		3.3 V		.65 mm	R-PDSO-G8
AM6421BSFGHAALV	Texas Instruments	SYSTEM ON CHIP		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel		-40 Cel		BOTTOM	2.652 mm	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY		30	250	17.2 mm		CMOS		.75 V		.8 mm	S-PBGA-B441	3
ATMXT224S-MAUR	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	3.47 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.24SQ,14	1.71 V	85 Cel		-40 Cel		QUAD	.6 mm	6 mm					6 mm		CMOS		1.8 V		.35 mm	S-XQCC-N56
ATWINC1500-MR210PB1140	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	4.2 V			MICROELECTRONIC ASSEMBLY		3 V	85 Cel		-40 Cel		UNSPECIFIED	2.113 mm	14.73 mm	SEATED HGT-NOM		NOT SPECIFIED	NOT SPECIFIED	21.72 mm		CMOS		3.6 V			R-XXMA-N28
CY8C4248LQI-BL543	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL																PURE TIN																3

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.