Other Function uPs,uCs & Peripheral ICs

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Address Bus Width	No. of Bits	DAC Channels	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	DMA Channels	Maximum Seated Height	ROM Words	RAM Words	Width	Data EEPROM Size	Additional Features	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Analog To Digital Convertors	Nominal Supply Voltage	PWM Channels	Sub-Category	Connectivity	ROM Programmability	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code	On Chip Program ROM Width	No. of I/O Lines
XC7Z045-1FBG676C	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V							GRID ARRAY	BGA676,26X26,40	.95 V	85 Cel		0 Cel			BOTTOM		2.54 mm			27 mm								27 mm		CMOS		1 V						1 mm	S-PBGA-B676
BGM13S32F512GA-V3	Silicon Labs	SoC
CC1310F64RGZT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD		1 mm			7 mm						NOT SPECIFIED	260	7 mm	28672	CMOS		3.3 V						.5 mm	S-PQCC-N48	3			e4
STSPIN32F0	STMicroelectronics	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	45 V							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		8 V	125 Cel		-40 Cel			QUAD		1 mm			7 mm						NOT SPECIFIED	NOT SPECIFIED	7 mm		CMOS								.5 mm	S-XQCC-N48
MCIMX536AVP8C2	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	AEC-Q100						GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.05 V	125 Cel		-40 Cel	TIN SILVER		BOTTOM		1.85 mm			19 mm						40	260	19 mm		CMOS		1.1 V						.8 mm	S-PBGA-B529	3			e2
NRF52833-QIAA-B-R	Nordic Semiconductor Asa	SoC		NO LEAD	73		SQUARE	UNSPECIFIED	YES	5.5 V									1.7 V	105 Cel		-40 Cel			QUAD							ALSO AVAILABLE WITH QFN-40 AND WLCSP-95 PACKAGE								CMOS									S-XQCC-N73
CY8C21434-24LQXIT	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	5.25 V							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	4.75 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD		1 mm			5 mm		ALSO OPERATES AT 2.7V AND 3.3V SUPPLY				40	260	5 mm		CMOS		5 V						.5 mm	S-XQCC-N32	3	Not Qualified		e4
SLB9670XQ20FW785XUMA1	Infineon Technologies	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.95 V							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.65 V	85 Cel		-40 Cel			BOTTOM		.9 mm			5 mm		ALSO AVAILABLE WITH 3.3V NOM SUPPLY						5 mm		CMOS		1.8 V						.5 mm	S-PQCC-N32
CC1310F128RHBT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD		1 mm			5 mm						NOT SPECIFIED	260	5 mm	28672	CMOS		3.3 V						.5 mm	S-PQCC-N32	3			e4
DA14531MOD-00F0100C	Renesas Electronics	SoC																																			250													3
SE050B2HQ1/Z01SFZ	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.12SQ,16	1.62 V	105 Cel		-40 Cel	NICKEL PALLADIUM GOLD SILVER		QUAD		.33 mm			3 mm						30	260	3 mm		CMOS		1.8 V						.4 mm	S-PQCC-N20	1			e4
XC7Z030-1FFG676C	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V							GRID ARRAY	BGA676,26X26,40	.95 V	85 Cel		0 Cel			BOTTOM		3.24 mm			27 mm								27 mm		CMOS		1 V						1 mm	S-PBGA-B676
MIMXRT1172CVM8A	NXP Semiconductors	SoC		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V							GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.1 V	105 Cel		-40 Cel			BOTTOM		1.52 mm			14 mm						40	260	14 mm		CMOS								.8 mm	S-PBGA-B289	3
XC7Z007S-2CLG400I	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V							GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel		-40 Cel			BOTTOM		1.6 mm			17 mm								17 mm		CMOS		1 V						.8 mm	S-PBGA-B400
XCZU5CG-L2SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES								GRID ARRAY						Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM							IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)				30	250			CMOS		.72 V							S-PBGA-B784	4			e1
NRF52811-QFAA-R	Nordic Semiconductor Asa	MICROPROCESSOR CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.7 V	85 Cel		-40 Cel			QUAD		.9 mm			6 mm								6 mm		CMOS		3 V						.4 mm	S-XQCC-N48
XC7Z020-2CLG484E	Xilinx	SYSTEM ON CHIP		BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V							GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32	.95 V	100 Cel		0 Cel			BOTTOM		1.6 mm			19 mm								19 mm		CMOS		1 V						.8 mm	S-PBGA-B484
453-00076R	Laird Technologies	SoC
MSP430F6779AIPEUR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		0		NO	16		FLATPACK, LOW PROFILE, FINE PITCH		2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	YES	1.6 mm	524288	32	14 mm	0	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY	BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT	0	.032768 MHz	30	260	20 mm	32768	CMOS	6-Ch 10-Bit	3.3 V	YES		I2C(2), IRDA(4), SPI(6), UART(4)	FLASH	I2C; SPI; UART	.5 mm	R-PQFP-G128	3		25 rpm	e4	8	90
MCIMX6S7CVM08AD	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V							GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.6 mm			21 mm		24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE				40	260	21 mm		CMOS								.8 mm	S-PBGA-B624	3			e1
5CSXFC6D6F31I7N	Intel	SoC
CC1310F32RSMT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD		1 mm			4 mm						NOT SPECIFIED	260	4 mm	28672	CMOS		3.3 V						.4 mm	S-PQCC-N32	3			e4
XC7Z035-3FFG900E	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V							GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel		0 Cel			BOTTOM		3.35 mm			31 mm								31 mm		CMOS		1 V						1 mm	S-PBGA-B900
5CSXFC6D6F31C6N	Intel	SoC
SLB9665TT20FW563XUMA3	Infineon Technologies	CRYPTOGRAPHIC AUTHENTICATOR		GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V							SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	3 V	85 Cel		-20 Cel	TIN		DUAL		1.1 mm			4.4 mm								9.7 mm		CMOS		3.3 V						.65 mm	R-PDSO-G28	3			e3
ST4SI2M0007AKIFW	STMicroelectronics	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	8	HVSON	RECTANGULAR	UNSPECIFIED	YES								SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.25		105 Cel		-40 Cel			DUAL		1 mm			5 mm								6 mm		CMOS								1.27 mm	R-XDSO-N8
XC7Z015-2CLG485E	Xilinx	SYSTEM ON CHIP		BALL	485	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V							GRID ARRAY, LOW PROFILE, FINE PITCH	BGA485,22X22,32	.95 V	100 Cel		0 Cel			BOTTOM		1.6 mm			19 mm								19 mm		CMOS		1 V						.8 mm	S-PBGA-B485
XCZU4EV-2FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V							GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM											30	245			CMOS		.85 V							R-PBGA-B900	4			e1
CY8C4247AZS-M485	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.89 V	AEC-Q100						FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.71 V	105 Cel		-40 Cel			QUAD		1.6 mm			10 mm								10 mm		CMOS		1.8 V						.5 mm	S-PQFP-G64	3
CC1310F128RSMT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	NICKEL PALLADIUM GOLD SILVER		QUAD		1 mm			4 mm						30	260	4 mm	28672	CMOS		3.3 V						.4 mm	S-PQCC-N32	3			e4
CY8C6247BZI-D54	Infineon Technologies	PROGRAMMABLE SoC		BALL	124	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V							GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA124,13X13,25	1.7 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1 mm			9 mm								9 mm		CMOS		1.8 V						.65 mm	S-PBGA-B124	3			e1
XC7Z035-1FBG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V							GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel		-40 Cel			BOTTOM		2.54 mm			27 mm								27 mm		CMOS		1 V						1 mm	S-PBGA-B676
MIMX8MM3DVTLZAA	NXP Semiconductors	SoC	OTHER	BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V							GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.95 V	95 Cel		0 Cel	TIN SILVER		BOTTOM		1.25 mm			14 mm						40	260	14 mm		CMOS		1 V						.5 mm	S-PBGA-B486	3			e2
NRF52811-QFAA-T	Nordic Semiconductor Asa	MICROPROCESSOR CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.7 V	85 Cel		-40 Cel			QUAD		.9 mm			6 mm								6 mm		CMOS		3 V						.4 mm	S-XQCC-N48
XC7Z045-2FFG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V							GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel		-40 Cel			BOTTOM		3.24 mm			27 mm								27 mm		CMOS		1 V						1 mm	S-PBGA-B676
AM6254ATCGGAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V							GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel		-40 Cel			BOTTOM		.89 mm			13 mm							250	13 mm		CMOS		.75 V						.5 mm	S-PBGA-B425	3		1400 rpm
CC2541F128RHAR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V						3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	2 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD		1 mm		8	6 mm			TIMER(4)	0		30	260	6 mm	8192	CMOS		3 V		Other uPs/uCs/Peripheral ICs			I2C; SPI; USART; USB	.5 mm	S-PQCC-N40	3	Not Qualified		e4		23
CY8C4247LQI-BL483	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL																				NICKEL PALLADIUM GOLD													30	260													3			e4
XC7Z030-1FBG676C	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V							GRID ARRAY	BGA676,26X26,40	.95 V	85 Cel		0 Cel			BOTTOM		2.54 mm			27 mm								27 mm		CMOS		1 V						1 mm	S-PBGA-B676
AM6231ASGGGAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V							GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel		-40 Cel			BOTTOM		.89 mm			13 mm							250	13 mm		CMOS		.75 V						.5 mm	S-PBGA-B425	3		1400 rpm
FT800Q-R	FTDI	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.63 V							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2.97 V	85 Cel		-40 Cel			QUAD		1 mm			7 mm								7 mm		CMOS		3.3 V						.5 mm	S-XQCC-N48	3
MCP25050-I/SL	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949		8			3/5	SMALL OUTLINE	SOP14,.24	2.7 V	85 Cel		-40 Cel	Matte Tin (Sn)		DUAL		1.75 mm			3.9 mm								8.65 mm		CMOS		5 V		Parallel IO Port				1.27 mm	R-PDSO-G14	1	Not Qualified		e3
XCZU4EV-2SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V							GRID ARRAY		.825 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM		3.32 mm			23 mm						30	250	23 mm		CMOS		.85 V						.8 mm	R-PBGA-B784	4			e1
MIMX8MM3CVTKZAA	NXP Semiconductors	SoC		BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1 V							GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.9 V	105 Cel		-40 Cel	TIN SILVER		BOTTOM		1.25 mm			14 mm						40	260	14 mm		CMOS		.95 V						.5 mm	S-PBGA-B486	3			e2
CC2541F128RHAT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V						3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	2 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD		1 mm		8	6 mm			TIMER(4)	0		30	260	6 mm	8192	CMOS		3 V		Other uPs/uCs/Peripheral ICs			I2C; SPI; USART; USB	.5 mm	S-PQCC-N40	3	Not Qualified		e4		23
MTCH6102-I/MV	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V	TS 16949						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.16SQ,16	1.8 V	85 Cel		-40 Cel	MATTE TIN		QUAD		.55 mm			4 mm						40	260	4 mm		CMOS		3 V						.4 mm	S-PQCC-N28	1			e3
XC7Z045-2FF676E	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V							GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel		0 Cel			BOTTOM		2.54 mm			27 mm								27 mm		CMOS		1 V						1 mm	S-PBGA-B676
6AV2181-8XP00-0AX0	Siemens	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD		DIE	RECTANGULAR	UNSPECIFIED	YES								UNCASED CHIP			50 Cel		0 Cel			UPPER											NOT SPECIFIED	NOT SPECIFIED			CMOS		3.3 V							R-XUUC-N

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.