Other Function uPs,uCs & Peripheral ICs

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	No. of Bits	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code	No. of I/O Lines
ATECC608B-SSVDA-T	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V				SMALL OUTLINE	SOP8,.23	2 V	100 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	1.75 mm	3.9 mm				30	260	4.9 mm		CMOS				I2C	1.27 mm	R-PDSO-G8			e4
ATSHA204A-MAHDA-T	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	8	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.08,20	2 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	.6 mm	2 mm				40	260	3 mm		CMOS		3.3 V			.5 mm	R-PQCC-N8	1
CY8C4248LQI-BL583	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL																	PURE TIN																		3
XCZU2CG-1SBVA484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM						30	250			CMOS		.85 V				R-PBGA-B484	4		e1
MCIMX6S5DVM10AC	NXP Semiconductors	SoC	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm				40	260	21 mm		CMOS					.8 mm	S-PBGA-B624	3		e1
MIMX8MM1DVTLZAA	NXP Semiconductors	SoC	OTHER	BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.95 V	95 Cel		0 Cel	TIN SILVER	BOTTOM	1.25 mm	14 mm				40	260	14 mm		CMOS		1 V			.5 mm	S-PBGA-B486	3		e2
SE051C2HQ1/Z01XDZ	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.12SQ,16	1.62 V	105 Cel		-40 Cel		QUAD	.33 mm	3 mm					260	3 mm		CMOS		1.8 V			.4 mm	S-XQCC-N20	1
XCZU4EV-1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM						30	250			CMOS		.85 V				R-PBGA-B784	4		e1
MCP25050-I/P	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.5 V	TS 16949	8	3/5	IN-LINE	DIP14,.3	2.7 V	85 Cel		-40 Cel	MATTE TIN	DUAL	4.318 mm	7.62 mm					260	19.05 mm		CMOS		5 V	Parallel IO Port		2.54 mm	R-PDIP-T14		Not Qualified	e3
NRF52811-QCAA-T	Nordic Semiconductor Asa	MICROPROCESSOR CIRCUIT		NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.7 V	85 Cel		-40 Cel		QUAD	.9 mm	5 mm						5 mm		CMOS		3 V			.5 mm	S-XQCC-N32
XCZU3CG-1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES					GRID ARRAY			100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM						30	250			CMOS		.85 V				S-PBGA-B784	4		e1
ATECC608B-MAHCZ-T	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2 V	85 Cel		-40 Cel		DUAL	.6 mm	2 mm						3 mm		CMOS				1-WIRE	.5 mm	R-PDSO-N8
XC7Z035-2FFG900E	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel		0 Cel		BOTTOM	3.35 mm	31 mm						31 mm		CMOS		1 V			1 mm	S-PBGA-B900
MIMX8MN5DVPIZAA	NXP Semiconductors	SoC	OTHER	BALL	306	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1 V				GRID ARRAY, THIN PROFILE, FINE PITCH	BGA306,21X21,20	.9 V	95 Cel		0 Cel		BOTTOM	1.01 mm	11 mm				40	260	11 mm		CMOS		.95 V			.5 mm	S-PBGA-B306	3
XC7Z045-1FFG900I	Xilinx	SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel		-40 Cel		BOTTOM	3.24 mm	27 mm						27 mm		CMOS		1 V			1 mm	S-PBGA-B900
MCP25020-I/SL	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949	8	3/5	SMALL OUTLINE	SOP14,.24	2.7 V	85 Cel		-40 Cel	Matte Tin (Sn)	DUAL	1.75 mm	3.9 mm					260	8.65 mm		CMOS		5 V	Parallel IO Port		1.27 mm	R-PDSO-G14	1	Not Qualified	e3
NRF52811-CAAA-R	Nordic Semiconductor Asa	MICROPROCESSOR CIRCUIT		BALL	33	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA33,6X6,16	1.7 V	85 Cel		-40 Cel		BOTTOM	.535 mm	2.464 mm						2.482 mm		CMOS		3 V			.4 mm	R-PBGA-B33
XCZU11EG-2FFVF1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.51 mm	40 mm				30	245	40 mm		CMOS		.85 V			1 mm	R-PBGA-B1517	4		e1
MCIMX6S5DVM10AB	NXP Semiconductors	SoC	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm				40	260	21 mm		CMOS					.8 mm	S-PBGA-B624	3		e1
MCIMX6U5EVM10AC	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	105 Cel		-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm				40	260	21 mm		CMOS					.8 mm	S-PBGA-B624	3		e1
XCZU4EV-2SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM						30	250			CMOS		.85 V				R-PBGA-B784	4		e1
MCP2221-I/ML	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	5.5 V	TS 16949		3.3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,25	3 V	85 Cel		-40 Cel	MATTE TIN	QUAD	1 mm	4 mm						4 mm		CMOS	15 mA	3.3 V	Serial IO/Communication Controllers		.65 mm	S-PQCC-N16		Not Qualified	e3
XC7Z030-2SBG485I	Xilinx	SYSTEM ON CHIP		BALL	485	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA485,22X22,32	.95 V	100 Cel		-40 Cel		BOTTOM	2.44 mm	19 mm						19 mm		CMOS		1 V			.8 mm	S-PBGA-B485
XC7Z045-1FFG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel		-40 Cel		BOTTOM	3.24 mm	27 mm						27 mm		CMOS		1 V			1 mm	S-PBGA-B676
XC7Z030-2FBG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel		-40 Cel		BOTTOM	2.54 mm	27 mm						27 mm		CMOS		1 V			1 mm	S-PBGA-B676
XCZU3CG-1SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES					GRID ARRAY			100 Cel		0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM						30	250			CMOS		.85 V				S-PBGA-B784	4		e1
RN2903A-I/RM098	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	47		RECTANGULAR	UNSPECIFIED	YES	3.6 V	TS 16949			MICROELECTRONIC ASSEMBLY		2.1 V	85 Cel		-40 Cel	NICKEL GOLD	UNSPECIFIED	3.34 mm	17.78 mm					250	26.67 mm		CMOS		3.3 V			1.27 mm	R-XXMA-N47			e4
USB2660I-JZX-03	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V			3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	3 V	85 Cel		-40 Cel	MATTE TIN	QUAD	1 mm	9 mm						9 mm		CMOS	275 mA	3.3 V	Bus Controllers		.5 mm	S-PQCC-N64		Not Qualified	e3
XC7Z045-1FBG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel		-40 Cel		BOTTOM	2.54 mm	27 mm						27 mm		CMOS		1 V			1 mm	S-PBGA-B676
ATECC608B-RBHCZ-B	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	3	VBCC	RECTANGULAR	UNSPECIFIED	YES	5.5 V				CHIP CARRIER, VERY THIN PROFILE		2 V	85 Cel		-40 Cel		BOTTOM	.55 mm	2.5 mm						6.5 mm		CMOS				1-WIRE	2 mm	R-XBCC-N3
MIMXRT1052CVL5A	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32	1.15 V	105 Cel		-40 Cel		BOTTOM	1.52 mm	10 mm	24MHZ NOMINAL CRYSTAL FREQUENCY AVAILABLE					10 mm		CMOS					.65 mm	S-PBGA-B196
XCC1312R1F3RGZR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1 mm	7 mm	DIMENSION CONSIDER BASED ON LINK HTTP://WWW.TI.COM/LIT/DS/SYMLINK/CC1312R.PDF			30	260	7 mm		CMOS		3 V			.5 mm	S-PQCC-N48	3		e4
CY8C4248LQI-BL553	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL																	PURE TIN							30	260										3
XC7Z045-2FBG676E	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel		0 Cel		BOTTOM	2.54 mm	27 mm						27 mm		CMOS		1 V			1 mm	S-PBGA-B676
PGA460TPW	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	28 V				SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		6 V	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	1.2 mm	4.4 mm	ALSO OPERATES AT 6V-15V FOR TRANSFORMER TOPOLOGY	0		30	260	5 mm		CMOS		12 V		SPI; UART; USART	.65 mm	R-PDSO-G16	2		e4
MIMX8MM1CVTKZAA	NXP Semiconductors	SoC		BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.9 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	1.25 mm	14 mm				40	260	14 mm		CMOS		.95 V			.5 mm	S-PBGA-B486	3		e2
ATWINC1500-MR210PB1952	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	3.6 V	TS 16949			MICROELECTRONIC ASSEMBLY	MODULE28(UNSPEC)	2.7 V	80 Cel		-40 Cel		UNSPECIFIED	2.11 mm	14.73 mm			48 MHz	NOT SPECIFIED	NOT SPECIFIED	21.72 mm		CMOS		3.3 V				R-XXMA-N28
ATWINC1500-MR210PB1952-T	Microchip Technology	NETWORK CONTROLLER	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	3.6 V				MICROELECTRONIC ASSEMBLY	MODULE28(UNSPEC)	2.7 V	85 Cel		-40 Cel		UNSPECIFIED	2.113 mm	14.73 mm				NOT SPECIFIED	NOT SPECIFIED	21.72 mm		CMOS		3.3 V			1.016 mm	R-XXMA-N28
NT3H2111W0FHKH	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	8	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.67 V	105 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.5 mm	1.6 mm				30	260	1.6 mm		CMOS		1.8 V			.5 mm	S-PQCC-N8	1		e4
XC7Z007S-1CLG225I	Xilinx	SYSTEM ON CHIP		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	.95 V	100 Cel		-40 Cel		BOTTOM	1.5 mm	13 mm						13 mm		CMOS		1 V			.8 mm	S-PBGA-B225
ATWINC1500-MR210PB1944	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	3.6 V				MICROELECTRONIC ASSEMBLY		2.7 V	85 Cel		-40 Cel		UNSPECIFIED	2.113 mm	14.73 mm				NOT SPECIFIED	NOT SPECIFIED	21.72 mm		CMOS		3.3 V				R-XXMA-N28
CC1310F128RSMR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	1 mm	4 mm				30	260	4 mm	28672	CMOS		3.3 V			.4 mm	S-PQCC-N32	3		e4
CC1312R1F3RGZR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1 mm	7 mm	DIMENSION CONSIDER BASED ON LINKHTTP://WWW.TI.COM/LIT/DS/SYMLINK/CC1312R.PDF			30	260	7 mm	81920	CMOS		3 V			.5 mm	S-PQCC-N48	3		e4	30
XC7Z030-L2FFG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel		-40 Cel		BOTTOM	3.24 mm	27 mm						27 mm		CMOS		1 V			1 mm	S-PBGA-B676
FT245RQ-TRAY	FTDI	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	5.25 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3.3 V	85 Cel		-40 Cel		QUAD	1 mm	5 mm				40	260	5 mm		CMOS					.5 mm	S-XQCC-N32	3	Not Qualified
ST4SIM-200M	STMicroelectronics	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD			RECTANGULAR	UNSPECIFIED	YES					UNCASED CHIP	DIE OR CHIP		105 Cel		-40 Cel		UNSPECIFIED										CMOS						R-XUUC-N
CY8C6347BZI-BLD53	Infineon Technologies	PROGRAMMABLE SoC																		TIN SILVER COPPER																		3		e1
PN7150B0HN/C11006Y	NXP Semiconductors	NFC CONTROLLER		NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.95 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.65 V	85 Cel		-30 Cel		QUAD	1 mm	6 mm					260	6 mm		CMOS		1.8 V			.5 mm	S-XQCC-N40	3

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.