Other Function uPs,uCs & Peripheral ICs

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	DAC Channels	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	DMA Channels	Maximum Seated Height	RAM Words	Width	Data EEPROM Size	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Analog To Digital Convertors	Maximum Supply Current	Nominal Supply Voltage	PWM Channels	Sub-Category	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code	No. of I/O Lines
MCIMX6Q6AVT10AC	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V					GRID ARRAY, FINE PITCH		1.35 V	125 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		2.16 mm		21 mm		24MHZ NOMINAL EXTERNAL FREQUENCY AVAILABLE			40	260	21 mm		CMOS							.8 mm		S-PBGA-B624	3			e1
DS2408S/TR	Dallas Semiconductor
XC7Z015-L1CLG485I	Xilinx	SYSTEM ON CHIP		BALL	485	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA485,22X22,32	.95 V	100 Cel		-40 Cel			BOTTOM		1.6 mm		19 mm							19 mm		CMOS			1 V				.8 mm		S-PBGA-B485
ATSHA204A-SSHDA-T	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949				SMALL OUTLINE	SOP8,.25	2 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		DUAL		1.75 mm		3.9 mm					40	260	4.9 mm		CMOS			3.3 V				1.27 mm		R-PDSO-G8	3
MCP2221-I/P	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.5 V	TS 16949			3.3/5	IN-LINE	DIP14,.3	3 V	85 Cel		-40 Cel	MATTE TIN		DUAL		5.334 mm		7.62 mm							19.05 mm		CMOS		15 mA	3.3 V		Serial IO/Communication Controllers		2.54 mm		R-PDIP-T14		Not Qualified		e3
NRF52805-CAAA-B-R7	Nordic Semiconductor Asa	SoC		BALL	28	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V					GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA28,6X7,16	1.7 V	85 Cel		-40 Cel			BOTTOM		.535 mm		2.464 mm							2.482 mm		CMOS			3 V				.4 mm		R-PBGA-B28
XC7Z035-2FFG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V					GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel		-40 Cel			BOTTOM		3.24 mm		27 mm							27 mm		CMOS			1 V				1 mm		S-PBGA-B676
AM4376BZDND100	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.378 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.272 V	90 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm		17 mm					30	260	17 mm		CMOS			1.325 V				.65 mm		S-PBGA-B491	3			e1
CC1310F128RGZR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD		1 mm		7 mm					30	260	7 mm	28672	CMOS			3.3 V				.5 mm		S-PQCC-N48	3			e4
CY8C5268LTI-LP030	Infineon Technologies	PSoC	INDUSTRIAL																		NICKEL PALLADIUM GOLD											30	260													3	Not Qualified		e4
MC-10105F1-821-FNA-M1-A	Renesas Electronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V				1,3.3	GRID ARRAY	BGA196,14X14,40	.9 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.71 mm		15 mm		ALSO OPERATES AT 3.3 V					15 mm		CMOS			1 V		Other uPs/uCs/Peripheral ICs		1 mm		S-PBGA-B196		Not Qualified		e1
NRF52811-QFAA-R7	Nordic Semiconductor Asa	MICROPROCESSOR CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.7 V	85 Cel		-40 Cel			QUAD		.9 mm		6 mm							6 mm		CMOS			3 V				.4 mm		S-XQCC-N48
P82B715DG4	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	12 V					SMALL OUTLINE		4.5 V	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		DUAL		1.75 mm		3.9 mm		VCCB(Min)(V) is 3, VCCB(Max)(V) is 12	0	.4 MHz	NOT SPECIFIED	260	4.9 mm		BIPOLAR			5 V			I2C	1.27 mm		R-PDSO-G8	1	Not Qualified		e4
XC7Z007S-2CLG225I	Xilinx	SYSTEM ON CHIP		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	.95 V	100 Cel		-40 Cel			BOTTOM		1.5 mm		13 mm							13 mm		CMOS			1 V				.8 mm		S-PBGA-B225
NRF52811-CAAA-R7	Nordic Semiconductor Asa	MICROPROCESSOR CIRCUIT		BALL	33	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V					GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA33,6X6,16	1.7 V	85 Cel		-40 Cel			BOTTOM		.535 mm		2.464 mm							2.482 mm		CMOS			3 V				.4 mm		R-PBGA-B33
BGM220PC22WGA2	Silicon Labs	SoC
DS2413P	Maxim Integrated	MICROPROCESSOR CIRCUIT	COMMERCIAL	C BEND	6	SOC	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V					SMALL OUTLINE		2.8 V	70 Cel		0 Cel	TIN LEAD		DUAL		1.5 mm		3.76 mm						245	3.94 mm		CMOS			3.3 V				1.27 mm		R-PDSO-C6	1	Not Qualified		e0
CY8C21434-24LTXI	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	5.25 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	4.75 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD		1 mm		5 mm		ALSO OPERATES AT 2.7V AND 3.3V SUPPLY			40	260	5 mm		CMOS			5 V				.5 mm		S-XQCC-N32	3	Not Qualified		e4
MCIMX6U7CVM08AC	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V					GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.6 mm		21 mm		24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE			40	260	21 mm		CMOS							.8 mm		S-PBGA-B624	3			e1
MCIMX6S7CVM08ACR	NXP Semiconductors	SYSTEM ON CHIP		BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V					GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.6 mm		21 mm		24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE			40	260	21 mm		CMOS							.8 mm		S-PBGA-B624	3			e1
XC7Z035-L2FBG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V					GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel		-40 Cel			BOTTOM		2.54 mm		27 mm							27 mm		CMOS			1 V				1 mm		S-PBGA-B676
MIMXRT1175CVM8A	NXP Semiconductors	SoC		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.1 V	105 Cel		-40 Cel			BOTTOM		1.52 mm		14 mm					40	260	14 mm		CMOS							.8 mm		S-PBGA-B289	3
NRF9160-SIBA-R	Nordic Semiconductor Asa	MICROCONTROLLER, CISC	INDUSTRIAL	NO LEAD	127	LGA	RECTANGULAR	UNSPECIFIED	YES	5.5 V					GRID ARRAY	LGA127,21X30,20	3 V	85 Cel		-40 Cel			BOTTOM		1.1 mm		10.5 mm							16 mm		CMOS			3.8 V				.5 mm		R-XBGA-N127
CY8C21434-24LTXIT	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	5.25 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	4.75 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD		1 mm		5 mm		ALSO OPERATES AT 2.7V AND 3.3V SUPPLY			40	260	5 mm		CMOS			5 V				.5 mm		S-XQCC-N32	3			e4
SLS32AIA010MSUSON10XTMA2	Infineon Technologies	CRYPTOGRAPHIC AUTHENTICATOR	OTHER	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	5.5 V					SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC10,.12,20	1.62 V	85 Cel		-25 Cel			DUAL		.6 mm		3 mm							3 mm		CMOS			3.3 V				.5 mm		S-PDSO-N10	1
AM6442BSEFHAALV	Texas Instruments	SYSTEM ON CHIP		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V					GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel		-40 Cel			BOTTOM		2.652 mm		17.2 mm		ALSO OPERATES AT 0.85V NOMINAL SUPPLY			30	250	17.2 mm		CMOS			.75 V				.8 mm		S-PBGA-B441	3		1000 rpm
XC7Z100-2FFG900I	Xilinx	SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V					GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel		-40 Cel			BOTTOM		3.24 mm		27 mm							27 mm		CMOS			1 V				1 mm		S-PBGA-B900
AM4376BZDNA100	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.378 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.272 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm		17 mm					30	260	17 mm		CMOS			1.325 V				.65 mm		S-PBGA-B491	3			e1
CC3200MODR1M2AMOBR	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	BUTT	63	BCC	RECTANGULAR	UNSPECIFIED	YES	3.6 V		NO			CHIP CARRIER		2.3 V	70 Cel		-20 Cel	NICKEL GOLD	YES	BOTTOM	NO	2.45 mm		17.5 mm	0		0		30	260	20.5 mm		CMOS	4-Ch 12-Bit		3.3 V	NO		I2C; SPI; UART	1.27 mm		R-XBCC-B63	3			e4	25
OSD3358-1G-ISM	Octavo Systems	SoC		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES						GRID ARRAY	BGA256,16X16,50		85 Cel		-40 Cel			BOTTOM		2.58 mm		21 mm							21 mm		CMOS			1.1 V				1.27 mm		S-PBGA-B256
STSPIN32F0ATR	STMicroelectronics	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	48	HQCCN	SQUARE	UNSPECIFIED	YES	45 V					CHIP CARRIER, HEAT SINK/SLUG		6.7 V	125 Cel		-40 Cel			QUAD				7 mm					NOT SPECIFIED	NOT SPECIFIED	7 mm		CMOS			8 V				.5 mm		S-XQCC-N48
DS2413P/T&R	Maxim Integrated	MICROPROCESSOR CIRCUIT	COMMERCIAL	C BEND	6	SOC	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V					SMALL OUTLINE		2.8 V	70 Cel		0 Cel	TIN LEAD		DUAL		1.5 mm		3.76 mm							3.94 mm		CMOS			3.3 V				1.27 mm		R-PDSO-C6	1	Not Qualified		e0
CY8C4146LQI-S422T	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL																		PURE TIN																									3
FT245RQ	FTDI	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	5.25 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	3.3 V	85 Cel		-40 Cel			QUAD		1 mm		5 mm			8	12.02 MHz	40	260	5 mm		CMOS			5 V			USB	.5 mm		S-XQCC-N32	3
SAM9X60D1G-I/LZB	Microchip Technology	MICROPROCESSOR CIRCUIT		NO LEAD	152	QMA	SQUARE	UNSPECIFIED	YES	5.5 V					MICROELECTRONIC ASSEMBLY		3 V	85 Cel		-40 Cel			QUAD		2.45 mm		28 mm							28 mm		CMOS			3.3 V				.65 mm		S-XQMA-N152
FT245BL-T/R	FTDI	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	5.25 V					FLATPACK, LOW PROFILE		4.35 V	70 Cel		0 Cel	MATTE TIN		QUAD		1.6 mm		7 mm					30	260	7 mm		CMOS			5 V				.8 mm		S-PQFP-G32	3			e3
XC7Z035-1FFG900C	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V					GRID ARRAY	BGA900,30X30,40	.95 V	85 Cel		0 Cel			BOTTOM		3.35 mm		31 mm							31 mm		CMOS			1 V				1 mm		S-PBGA-B900
MCIMX6G2CVM05AB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V					GRID ARRAY, LOW PROFILE, FINE PITCH		1.15 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.32 mm		14 mm					40	260	14 mm		CMOS							.8 mm		S-PBGA-B289	3			e1
LS1021AXN7KQB	NXP Semiconductors	MICROPROCESSOR CIRCUIT		BALL	525	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V					GRID ARRAY, HEAT SINK/SLUG		.97 V				TIN SILVER COPPER		BOTTOM		2.07 mm		19 mm					40	260	19 mm		CMOS			1 V				.8 mm		S-PBGA-B525	3			e1
OMAPL138EZWTD4E	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V					GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.4 mm		16 mm		IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY	32	50 MHz	30	260	16 mm		CMOS			1.3 V			I2C; SPI; UART; USB	.8 mm		S-PBGA-B361	3		456 rpm	e1
XC7Z030-1FFG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V					GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel		-40 Cel			BOTTOM		3.24 mm		27 mm							27 mm		CMOS			1 V				1 mm		S-PBGA-B676
ATECC508A-MAHDA-T	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	8	HVSON	RECTANGULAR	UNSPECIFIED	YES	5.5 V	TS 16949				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		DUAL		.6 mm		2 mm					40	260	3 mm		CMOS							.5 mm		R-PDSO-N8	1
MIMXRT106FCVL5B	NXP Semiconductors	SoC		BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.15 V	105 Cel		-40 Cel			BOTTOM		1.43 mm		10 mm					40	260	10 mm		CMOS							.65 mm		S-PBGA-B196	3
PN7150B0HN/C11002E	NXP Semiconductors	NFC CONTROLLER		NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.95 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.65 V	85 Cel		-30 Cel	NICKEL PALLADIUM GOLD		QUAD		1 mm		6 mm					30	260	6 mm		CMOS			1.8 V				.5 mm		S-XQCC-N40	3			e4
ATWINC1500-MR210PB1961	Microchip Technology	NETWORK CONTROLLER	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	3.6 V					MICROELECTRONIC ASSEMBLY	MODULE28(UNSPEC)	2.7 V	85 Cel		-40 Cel			UNSPECIFIED		2.113 mm		14.73 mm					NOT SPECIFIED	NOT SPECIFIED	21.72 mm		CMOS			3.3 V				1.016 mm		R-XXMA-N28
MCIMX6G2CVK05AB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	272	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V					GRID ARRAY, LOW PROFILE, FINE PITCH		1.15 V	105 Cel		-40 Cel			BOTTOM		1.23 mm		9 mm					40	260	9 mm		CMOS							.5 mm		S-PBGA-B272	3
MCIMX257CJM4A	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.52 V				1.2/1.5,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.38 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.6 mm		17 mm		ALSO REQUIRES 3.3 V I/O SUPPLY			40	260	17 mm		CMOS			1.45 V		Microprocessors		.8 mm		S-PBGA-B400	3	Not Qualified		e1
TMS320DM368ZCE	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V			32	1.35,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25	1.28 V	85 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm	8192	13 mm			32		30	260	13 mm		CMOS			1.35 V		Digital Signal Processors	I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B338	3	Not Qualified		e1

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.