Other Function uPs,uCs & Peripheral ICs

Reset All

Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	No. of Bits	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code	No. of I/O Lines
XC7Z020-3CLG484E	Xilinx	SYSTEM ON CHIP		BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32	.95 V	100 Cel	0 Cel		BOTTOM	1.6 mm		19 mm							19 mm		CMOS		1 V			.8 mm	S-PBGA-B484
ATSHA204A-SSHDA-B	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949			SMALL OUTLINE	SOP8,.25	2 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	1.75 mm		3.9 mm							4.9 mm		CMOS		3.3 V			1.27 mm	R-PDSO-G8	3
MIMX8MN5DVTJZAA	NXP Semiconductors	SoC	OTHER	BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.95 V	95 Cel	0 Cel	TIN SILVER	BOTTOM	1.25 mm		14 mm					40	260	14 mm		CMOS		1 V			.5 mm	S-PBGA-B486	3		e2
MIMXRT1061CVJ5A	NXP Semiconductors	SoC	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32	1.15 V	105 Cel	-40 Cel	TIN SILVER	BOTTOM	1.52 mm		12 mm					40	260	12 mm		CMOS					.8 mm	S-PBGA-B196	3		e2
NHS3100/A1Z	NXP Semiconductors	MICROPROCESSOR CIRCUIT																											260										3
XC7Z100-2FFG1156I	Xilinx	SYSTEM ON CHIP		BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA1156,34X34,40	.95 V	100 Cel	-40 Cel		BOTTOM	3.1 mm		35 mm							35 mm		CMOS		1 V			1 mm	S-PBGA-B1156
CY8C6136BZI-F34	Infineon Technologies	PROGRAMMABLE SoC		BALL	124	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA124,13X13,25	1.7 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1 mm		9 mm							9 mm		CMOS		1.8 V			.65 mm	S-PBGA-B124	3		e1
DA14682-00F08A92	Renesas Electronics	SoC																											255										3
ST33HTPH2X32AHD8	STMicroelectronics	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		105 Cel	-40 Cel		QUAD	1 mm		5 mm	ALSO OPERATES AT 3.3V NOMINAL VOLATGE				NOT SPECIFIED	NOT SPECIFIED	5 mm		CMOS		1.8 V			.5 mm	S-XQCC-N32
MCIMX6U5DVM10AC	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm					40	260	21 mm		CMOS					.8 mm	S-PBGA-B624	3		e1
MFRC52201HN1,118	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES				3/3.3	CHIP CARRIER	LCC32,.2SQ,20		85 Cel	-25 Cel		QUAD								30	260				100 mA		Other Microprocessor ICs		.5 mm	S-PQCC-N32	1	Not Qualified
MIMXRT1061CVJ5B	NXP Semiconductors	SoC		BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32	1.15 V	105 Cel	-40 Cel	TIN SILVER	BOTTOM	1.52 mm		12 mm					40	260	12 mm		CMOS					.8 mm	S-PBGA-B196	3		e2
MCIMX7D2DVM12SD	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	541	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.25 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA541,25X25,29	1.2 V	85 Cel	0 Cel		BOTTOM	1.42 mm		19 mm					40	260	19 mm		CMOS		1.225 V			.75 mm	S-PBGA-B541	3
MCP25020-I/P	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.5 V	TS 16949	8	3/5	IN-LINE	DIP14,.3	2.7 V	85 Cel	-40 Cel	MATTE TIN	DUAL	4.318 mm		7.62 mm							19.05 mm		CMOS		5 V	Parallel IO Port		2.54 mm	R-PDIP-T14		Not Qualified	e3
XCZU4EV-2FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	2.88 mm		31 mm					30	245	31 mm		CMOS		.85 V			1 mm	R-PBGA-B900	4		e1
MCIMX6Y2DVM05AB	NXP Semiconductors	SoC		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.275 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.32 mm		14 mm					40	260	14 mm		CMOS					.8 mm	S-PBGA-B289	3		e1
USB4640-HZH-03	Microchip Technology	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.3 V	TS 16949		1.2,3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.28SQ,20	1.1 V	70 Cel	0 Cel	MATTE TIN	QUAD	1 mm		7 mm			0	24 MHz			7 mm		CMOS	60 mA	1.2 V	Bus Controllers		.5 mm	S-PQCC-N48		Not Qualified	e3
CY8C4024AZI-S413	Infineon Technologies	PSoC	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.89 V				FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	1.71 V	85 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm		7 mm							7 mm		CMOS		1.8 V			.5 mm	S-PQFP-G48	3
5CSEBA6U19I7N	Intel	SoC
BM83SM1-00AB	Microchip Technology	PROGRAMMABLE RFSoC		NO LEAD	50	XMA	RECTANGULAR	UNSPECIFIED	YES	4.2 V				MICROELECTRONIC ASSEMBLY		3.2 V	85 Cel	-40 Cel	GOLD OVER NICKEL	UNSPECIFIED	2.5 mm		15 mm						260	32 mm		CMOS		3.8 V			1 mm	R-XXMA-N50	1
MCIMX6U5DVM10ACR	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.35 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm					40	260	21 mm		CMOS		1.4 V			.8 mm	S-PBGA-B624	3		e1
MCIMX6Q5EYM10AC	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm	24MHZ NOMINAL FREQ AVAILABLE				40	260	21 mm		CMOS					.8 mm	S-PBGA-B624	3		e1
XCZU9EG-2FFVB1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM								30	245			CMOS		.85 V				R-PBGA-B1156	4		e1
MCIMX6G3CVM05AB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.15 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.32 mm		14 mm					40	260	14 mm		CMOS					.8 mm	S-PBGA-B289	3		e1
TDA8035HN/C1,118	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	5.5 V			3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	2.7 V	85 Cel	-25 Cel	NICKEL PALLADIUM GOLD	QUAD	1 mm		5 mm					30	260	5 mm		CMOS	220 mA	3.3 V	Other Microprocessor ICs		.5 mm	S-PQCC-N32	1	Not Qualified	e4
XC7Z035-1FFG900I	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel	-40 Cel		BOTTOM	3.35 mm		31 mm							31 mm		CMOS		1 V			1 mm	S-PBGA-B900
XC7Z015-1CLG485I	Xilinx	SYSTEM ON CHIP		BALL	485	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA485,22X22,32	.95 V	100 Cel	-40 Cel		BOTTOM	1.6 mm		19 mm							19 mm		CMOS		1 V			.8 mm	S-PBGA-B485
XC7Z035-1FBG676C	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA676,26X26,40	.95 V	85 Cel	0 Cel		BOTTOM	2.54 mm		27 mm							27 mm		CMOS		1 V			1 mm	S-PBGA-B676
PN7150B0HN/C11006E	NXP Semiconductors	NFC CONTROLLER		NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.95 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.65 V	85 Cel	-30 Cel		QUAD	1 mm		6 mm						260	6 mm		CMOS		1.8 V			.5 mm	S-XQCC-N40	3
XC7Z014S-1CLG400C	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	85 Cel	0 Cel		BOTTOM	1.6 mm		17 mm							17 mm		CMOS		1 V			.8 mm	S-PBGA-B400
MCIMX6Q7CVT08AC	NXP Semiconductors	SoC	INDUSTRIAL	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm		21 mm	EACH GPIO MODULE SUPPORTS 32 BITS OF I/O				40	260	21 mm		CMOS		1.4 V			.8 mm	S-PBGA-B624	3		e1
MIMXRT1042XJM5B	NXP Semiconductors	SYSTEM ON CHIP
PN7120A0EV/C10801Y	NXP Semiconductors		OTHER	BALL	49	FBGA	SQUARE	PLASTIC/EPOXY	YES				1.8	GRID ARRAY, FINE PITCH	BGA49,7X7,20		85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM								30	260					1.8 V	Other uPs/uCs/Peripheral ICs		.5 mm	S-PBGA-B49	3	Not Qualified	e1
STSPIN32F0TR	STMicroelectronics	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	45 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		8 V	125 Cel	-40 Cel		QUAD	1 mm		7 mm					NOT SPECIFIED	NOT SPECIFIED	7 mm		CMOS					.5 mm	S-XQCC-N48
CY8C4248LQI-BL573	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL																PURE TIN																				3
MPFS250TFCVG484I	Microchip Technology	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V				GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel	-40 Cel		BOTTOM	2.92 mm		19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY						19 mm		CMOS		1 V			.8 mm	S-PBGA-B484
NT3H2111W0FTTJ	NXP Semiconductors	MICROPROCESSOR CIRCUIT																	NICKEL PALLADIUM GOLD									30	260										1		e4
CC2541F256RHAT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V			3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	2 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1 mm	8	6 mm		TIMER(4)	0		30	260	6 mm	8192	CMOS		3 V	Other uPs/uCs/Peripheral ICs	I2C; SPI; USART; USB	.5 mm	S-PQCC-N40	3	Not Qualified	e4	23
SLB9670XQ20FW740XUMA2	Infineon Technologies	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.95 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.65 V	85 Cel	-40 Cel		BOTTOM	.9 mm		5 mm	ALSO AVAILABLE WITH 3.3V NOM SUPPLY						5 mm		CMOS		1.8 V			.5 mm	S-PQCC-N32
XCZU2CG-1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES					GRID ARRAY			100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM								30	250			CMOS		.85 V				S-PBGA-B784	4		e1
XCZU3EG-1SFVA625E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	625	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM								30	250			CMOS		.85 V				R-PBGA-B625	4		e1
AM6231AKGGHHALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	95 Cel	0 Cel		BOTTOM	.89 mm		13 mm							13 mm		CMOS		.75 V			.5 mm	S-PBGA-B425
FT220XS-T	FTDI	MICROPROCESSOR CIRCUIT																														CMOS
W5300	Wiznet	MICROPROCESSOR CIRCUIT	COMMERCIAL EXTENDED	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V				FLATPACK, LOW PROFILE, FINE PITCH		3 V	80 Cel	0 Cel		QUAD	1.6 mm		14 mm					40	260	14 mm		CMOS		3.3 V			.5 mm	S-PQFP-G100	3
MCIMX6U8DVM10AC	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm					40	260	21 mm		CMOS					.8 mm	S-PBGA-B624	3		e1
MCIMX6Y2CVM05ABR	NXP Semiconductors	SoC	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.32 mm		14 mm					40	260	14 mm		CMOS					.8 mm	S-PBGA-B289	3		e1
AM4378BZDND100	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.378 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.272 V	90 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		17 mm					30	260	17 mm		CMOS		1.325 V			.65 mm	S-PBGA-B491	3		e1
ATSAM4C16CB-AUR	Microchip Technology	SoC	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.32 V				FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.08 V	85 Cel	-40 Cel	MATTE TIN	QUAD	1.6 mm		14 mm					40	260	14 mm		CMOS		1.2 V			.5 mm	S-PQFP-G100	3		e3

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.