Other Function uPs,uCs & Peripheral ICs

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	Maximum Seated Height	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Nominal Supply Voltage	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code	No. of I/O Lines
BGM13P32F512GA-V2	Silicon Labs	SoC
CY8C6247BZI-D34	Infineon Technologies	PROGRAMMABLE SoC		BALL	124	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA124,13X13,25	1.7 V	85 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1 mm	9 mm						9 mm		CMOS	1.8 V		.65 mm	S-PBGA-B124	3			e1
XC7Z007S-2CLG225E	Xilinx	SYSTEM ON CHIP		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	.95 V	100 Cel	0 Cel			BOTTOM	1.5 mm	13 mm						13 mm		CMOS	1 V		.8 mm	S-PBGA-B225
ESP32-WROOM-32E(M113EH2800PH3Q0)	Espressif Systems (Shanghai)	SoC		NO LEAD	38	XMA	RECTANGULAR	UNSPECIFIED	YES			MICROELECTRONIC ASSEMBLY							UNSPECIFIED	3.35 mm	18 mm						25.5 mm		CMOS			1.27 mm	R-XXMA-N38
XCZU7EV-L2FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V		GRID ARRAY		.698 V	110 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	245			CMOS	.72 V			R-PBGA-B900	4			e1
XCZU7EV-L2FFVF1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V		GRID ARRAY		.698 V	110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	245			CMOS	.72 V			R-PBGA-B1517	4			e1
ATSHA204A-STUCZ-T	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR		GULL WING	8	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TO-236	2 V	85 Cel	-40 Cel	MATTE TIN		DUAL	1.12 mm	1.3 mm				40	260	2.9 mm		CMOS	3.3 V		.95 mm	R-PDSO-G3	1			e3
UCD3138128PFC	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	80	TFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		FLATPACK, THIN PROFILE, FINE PITCH		3 V	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	1.2 mm	12 mm				30	260	12 mm		CMOS	3.3 V		.5 mm	S-PQFP-G80	3			e4
XC7Z007S-2CLG400E	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel	0 Cel			BOTTOM	1.6 mm	17 mm						17 mm		CMOS	1 V		.8 mm	S-PBGA-B400
AM6234ATCGGAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel			BOTTOM	.89 mm	13 mm					250	13 mm		CMOS	.75 V		.5 mm	S-PBGA-B425	3		1400 rpm
BGM13S32F512GA-V3R	Silicon Labs	SoC
XC7Z035-2FFG900I	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel	-40 Cel			BOTTOM	3.35 mm	31 mm						31 mm		CMOS	1 V		1 mm	S-PBGA-B900
MIMX8MN1DVTJZAA	NXP Semiconductors	SoC	OTHER	BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.95 V	95 Cel	0 Cel	TIN SILVER		BOTTOM	1.25 mm	14 mm				40	260	14 mm		CMOS	1 V		.5 mm	S-PBGA-B486	3			e2
NT3H2211W0FHKH	NXP Semiconductors	MICROPROCESSOR CIRCUIT																							NOT SPECIFIED	260								1
XCZU4EV-3FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.927 V		GRID ARRAY		.873 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM						30	245			CMOS	.9 V			R-PBGA-B900	4			e1
MCIMX286CVM4B	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	85 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.37 mm	14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V			40	260	14 mm		CMOS	1.45 V		.8 mm	S-PBGA-B289	3	Not Qualified		e1
XCZU7EV-L2FFVC1156E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V		GRID ARRAY		.698 V	110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	245			CMOS	.72 V			R-PBGA-B1156	4			e1
CY8C4146LQI-S432T	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL														PURE TIN																	3
RN2903A-I/RMSA103	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	47		RECTANGULAR	UNSPECIFIED	YES	3.6 V		MICROELECTRONIC ASSEMBLY		2.1 V	85 Cel	-40 Cel	NICKEL GOLD		UNSPECIFIED	3.34 mm	17.78 mm	SEATED HGT-CALCULATED				250	26.67 mm		CMOS	3.3 V		1.27 mm	R-XXMA-N47				e4
XC7Z045-2FBG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel			BOTTOM	2.54 mm	27 mm						27 mm		CMOS	1 V		1 mm	S-PBGA-B676
XCZU4EV-1FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM						30	245			CMOS	.85 V			R-PBGA-B900	4			e1
XCZU7EV-2FFVF1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	3.51 mm	40 mm				30	245	40 mm		CMOS	.85 V		1 mm	R-PBGA-B1517	4			e1
XCZU7EV-1FFVC1156E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM						30	245			CMOS	.85 V			R-PBGA-B1156	4			e1
XCZU4EV-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V		GRID ARRAY		.698 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	250			CMOS	.72 V			R-PBGA-B784	4			e1
P82B715P	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	12 V		IN-LINE		4.5 V	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		DUAL	5.08 mm	7.62 mm	VCCB(Min)(V) is 3, VCCB(Max)(V) is 12	0	.4 MHz	NOT SPECIFIED	NOT SPECIFIED	9.81 mm		BIPOLAR	5 V	I2C	2.54 mm	R-PDIP-T8		Not Qualified		e4
AX88772BLI	Asix Electronics
EFR32MG21A020F1024IM32-B	Silicon Labs	SYSTEM ON CHIP	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.16SQ,16	1.71 V	125 Cel	-40 Cel	MATTE TIN		QUAD	.9 mm	4 mm				40	260	4 mm		CMOS	3 V		.4 mm	S-XQCC-N32	2			e3
MIMX8MN1CVTIZAA	NXP Semiconductors	SYSTEM ON CHIP															TIN SILVER								40	260								3			e2
OMAPL138EZWTD4	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V		GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm	16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY	32	50 MHz	30	260	16 mm		CMOS	1.3 V	I2C; SPI; UART; USB	.8 mm	S-PBGA-B361	3		456 rpm	e1
XC7Z014S-2CLG400I	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel	-40 Cel			BOTTOM	1.6 mm	17 mm						17 mm		CMOS	1 V		.8 mm	S-PBGA-B400
XCZU7EV-2FFVC1156E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	3.51 mm	35 mm				30	245	35 mm		CMOS	.85 V		1 mm	R-PBGA-B1156	4			e1
EFR32MG21A020F512IM32-B	Silicon Labs	SYSTEM ON CHIP	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.16SQ,16	1.71 V	125 Cel	-40 Cel	MATTE TIN		QUAD	.9 mm	4 mm				40	260	4 mm		CMOS	3 V		.4 mm	S-XQCC-N32	2			e3
MCIMX283CVM4B	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	85 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.37 mm	14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V			40	260	14 mm		CMOS	1.45 V		.8 mm	S-PBGA-B289	3	Not Qualified		e1
XC7Z030-1FBG484I	Xilinx	SYSTEM ON CHIP		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA484,22X22,40	.95 V	100 Cel	-40 Cel			BOTTOM	2.54 mm	23 mm						23 mm		CMOS	1 V		1 mm	S-PBGA-B484
XCZU4CG-1SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY			100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM						30	250			CMOS	.85 V			S-PBGA-B784	4			e1
XCZU7EV-2FFVF1517I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM						30	245			CMOS	.85 V			R-PBGA-B1517	4			e1
AM5716AABCXEA	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V		GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	2.96 mm	23 mm				30	250	23 mm		CMOS	1.15 V		.8 mm	S-PBGA-B760	3			e1
D2-92633-LR	Renesas Electronics	SoC	OTHER	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.9 V		FLATPACK, LOW PROFILE, FINE PITCH		1.7 V	85 Cel	-10 Cel	MATTE TIN		QUAD	1.6 mm	14 mm				30	260	14 mm		CMOS	1.8 V		.4 mm	S-PQFP-G128	3			e3
MCIMX6Y2DVM05AA	NXP Semiconductors	SoC	OTHER	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.275 V	95 Cel	0 Cel			BOTTOM	1.32 mm	14 mm				40	260	14 mm		CMOS			.8 mm	S-PBGA-B289	3
163PC01D36	Honeywell Sensing And Control
STSPIN32F0B	STMicroelectronics	MICROPROCESSOR CIRCUIT																							NOT SPECIFIED	NOT SPECIFIED
MCIMX6Q6AVT10ACR	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	2.16 mm	21 mm				40	260	21 mm		CMOS			.8 mm	S-PBGA-B624	3			e1
SLB9670XQ20FW763XUMA1	Infineon Technologies	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.95 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.65 V	85 Cel	-40 Cel			BOTTOM	.9 mm	5 mm	ALSO AVAILABLE WITH 3.3V NOM SUPPLY					5 mm		CMOS	1.8 V		.5 mm	S-PQCC-N32
CC1312R1F3RGZT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1 mm	7 mm	DIMENSION CONSIDER BASED ON LINKHTTP://WWW.TI.COM/LIT/DS/SYMLINK/CC1312R.PDF			30	260	7 mm	81920	CMOS	3 V		.5 mm	S-PQCC-N48	3			e4	30
XC7Z030-2FBG676E	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	0 Cel			BOTTOM	2.54 mm	27 mm						27 mm		CMOS	1 V		1 mm	S-PBGA-B676
XCZU4CG-1FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM						30	245			CMOS	.85 V			R-PBGA-B900	4			e1
ATECC608A-MAHCZ-S	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2 V	85 Cel	-40 Cel			DUAL	.6 mm	2 mm						3 mm		CMOS			.5 mm	R-PDSO-N8
ATWINC1500-MR210PB1172	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	3.6 V		MICROELECTRONIC ASSEMBLY		2.7 V	85 Cel	-40 Cel			UNSPECIFIED	2.113 mm	14.73 mm						21.72 mm		CMOS	3.3 V			R-XXMA-N28

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.