Other Function uPs,uCs & Peripheral ICs

Reset All

Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	DAC Channels	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	DMA Channels	Maximum Seated Height	ROM Words	RAM Words	Width	Data EEPROM Size	Additional Features	Boundary Scan	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	No. of Timers	RAM Bytes	Technology	Analog To Digital Convertors	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	PWM Channels	No. of Serial I/Os	Sub-Category	Connectivity	ROM Programmability	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code	On Chip Program ROM Width	No. of I/O Lines
AS5134-ZSST	Ams Ag	SYSTEM ON CHIP
CC3220MODASM2MONR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BUTT	63	BCC	RECTANGULAR	UNSPECIFIED		YES	3.6 V				NO			CHIP CARRIER		2.3 V	85 Cel			-40 Cel	NICKEL GOLD	YES	BOTTOM	NO	2.41 mm	1024000	256	20.5 mm	0			TIMER(4), WDT	0		30	260	25 mm		262144	CMOS	4-Ch 12-Bit		3.3 V		NO			I2C, I2S, SPI, UART	FLASH	I2C; I2S; SPI; UART	1.27 mm		R-XBCC-B63	3				e4	8	25
MPFS250T-1FCVG484E	Microchip Technology	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V							GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel			0 Cel			BOTTOM		2.92 mm			19 mm		ALSO OPERATES AT 1.05V NOMINAL SUPPLY							19 mm			CMOS			1 V								.8 mm		S-PBGA-B484
MSP430F67791IPZ	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	3.6 V					16	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.8 V	85 Cel	MSP430		-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD		1.6 mm	524288	32	14 mm					0		30	260	14 mm		32768	CMOS		11.75 mA	3.3 V				Microcontrollers		FLASH	I2C; SPI; UART	.5 mm		S-PQFP-G100	3	Not Qualified	25 rpm		e4
MSP430F6779AIPZR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	3.6 V			0	NO	16		FLATPACK, LOW PROFILE, FINE PITCH		2.4 V	85 Cel	MSP430		-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	YES	1.6 mm	524288	32	14 mm	0	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY		BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT	0	.032768 MHz	30	260	14 mm		32768	CMOS	6-Ch 10-Bit		3.3 V		YES			I2C(2), IRDA(4), SPI(6), UART(4)	FLASH	I2C; SPI; UART	.5 mm		S-PQFP-G100	3		25 rpm		e4	8	62
XCZU25DR-1FFVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V							GRID ARRAY		.825 V	100 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM												30	245				CMOS			.85 V										R-PBGA-B1156	4				e1
XCZU25DR-L1FFVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.742 V							GRID ARRAY		.698 V	100 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM							ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY					30	245				CMOS			.72 V										R-PBGA-B1156	4				e1
FCM8531QY	Onsemi	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V							FLATPACK, LOW PROFILE	QFP32,.35SQ,32	4.5 V	85 Cel			-40 Cel			QUAD		1.6 mm			7 mm							NOT SPECIFIED	NOT SPECIFIED	7 mm			CMOS			5 V							I2C; SPI; UART	.8 mm		S-PQFP-G32
LTC4263IDE#PBF	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V							SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		4.5 V	85 Cel			-40 Cel	MATTE TIN		DUAL		.8 mm			3 mm							30	260	4 mm			CMOS			5 V								.5 mm		R-PDSO-N14	1	Not Qualified			e3
MGM210PB32JIA2	Silicon Labs	SYSTEM ON CHIP
RF430FRL152HCRGER	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	24	VQCCN	SQUARE	PLASTIC/EPOXY		YES								CHIP CARRIER, VERY THIN PROFILE			70 Cel			0 Cel	NICKEL PALLADIUM GOLD		QUAD		1 mm			4 mm		IT REQUIRES 1.45V TO 1.65V LOW SUPPLY VOLTAGE			0		30	260	4 mm			CMOS										I2C; SPI	.5 mm		S-PQCC-N24	2				e4
SLI9670AQ20FW1311XUMA1	Infineon Technologies	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED		YES	1.95 V		AEC-Q100					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.65 V	105 Cel			-40 Cel	NICKEL GOLD PALLADIUM SILVER		QUAD		.9 mm			5 mm		ALSO AVAILABLE WITH 3.3V NOM SUPPLY							5 mm			CMOS			1.8 V								.5 mm		S-XQCC-N32	3
TMS320DM368ZCE48	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.42 V							GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	85 Cel			0 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm			13 mm							30	260	13 mm			CMOS			1.35 V								.65 mm		S-PBGA-B338	3				e1
XC7Z012S-1CLG485C	Xilinx	SYSTEM ON CHIP		BALL	485	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V							GRID ARRAY, LOW PROFILE, FINE PITCH	BGA485,22X22,32	.95 V	85 Cel			0 Cel			BOTTOM		1.6 mm			19 mm									19 mm			CMOS			1 V								.8 mm		S-PBGA-B485
CC2540F256RHAR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V						3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	2 V	85 Cel			-40 Cel	NICKEL PALLADIUM GOLD		QUAD		1 mm		8	6 mm				COMPARATORS, TIMER(4)			30	260	6 mm		8192	CMOS			3 V				Other uPs/uCs/Peripheral ICs			SPI; USART; USB	.5 mm		S-PQCC-N40	3	Not Qualified			e4		21
CC3220MODSM2MOBR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BUTT	63	BCC	RECTANGULAR	UNSPECIFIED	NO	YES	3.6 V	8		0	NO			CHIP CARRIER		2.3 V	85 Cel	CORTEX-M4	0	-40 Cel	NICKEL GOLD	YES	BOTTOM	NO	2.45 mm	1024000	256	17.5 mm	0		YES	TIMER(4), WDT	0		30	260	20.5 mm	4	262144	CMOS	4-Ch 12-Bit		3.3 V	2	NO	2		I2C, I2S, SD, SPI, UART	FLASH		1.27 mm	FIXED POINT	R-XBCC-B63	3		2400 rpm	YES	e4	8	25
MGM210PA32JIA2R	Silicon Labs	SYSTEM ON CHIP
MSP430F6779IPZ	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	3.6 V					16	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.8 V	85 Cel	MSP430		-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD		1.6 mm	524288	32	14 mm					0	25 MHz	30	260	14 mm		32768	CMOS		11.75 mA	3.3 V				Microcontrollers		FLASH	I2C; SPI; UART	.5 mm		S-PQFP-G100	3	Not Qualified	25 rpm		e4
NT3H2111W0FHK	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	8	QCCN	SQUARE	UNSPECIFIED		YES	3.6 V							CHIP CARRIER		1.67 V	105 Cel			-40 Cel			QUAD		.5 mm			1.6 mm									1.6 mm			CMOS			1.8 V										S-XQCC-N8
XAM6442ASFGGAALV	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	441	FBGA	SQUARE	PLASTIC/EPOXY		YES	.79 V							GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		2.652 mm			17.2 mm		ALSO OPERATES AT 0.85V NOMINAL SUPPLY						250	17.2 mm			CMOS			.75 V								.8 mm		S-PBGA-B441	3		1000 rpm		e1
XC7Z100-L2FFG1156I	Xilinx	SYSTEM ON CHIP		BALL	1156	BGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V							GRID ARRAY	BGA1156,34X34,40	.95 V	100 Cel			-40 Cel			BOTTOM		3.1 mm			35 mm									35 mm			CMOS			1 V								1 mm		S-PBGA-B1156
AM4378BZDN100	Texas Instruments	SYSTEM ON CHIP	OTHER	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.378 V							GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.272 V	90 Cel			0 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm			17 mm							30	260	17 mm			CMOS			1.325 V								.65 mm		S-PBGA-B491	3				e1
AM6231ATGGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY		YES	.79 V							GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel			-40 Cel			BOTTOM		.89 mm			13 mm									13 mm			CMOS			.75 V								.5 mm		S-PBGA-B425
EFR32MG24A010F1536IM48-B	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED		YES	3.8 V							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	125 Cel			-40 Cel			QUAD		.9 mm			6 mm									6 mm			CMOS			3 V								.4 mm		S-XQCC-N48
EFR32MG24B310F1536IM48-B	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED		YES	3.8 V							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	125 Cel			-40 Cel			QUAD		.9 mm			6 mm									6 mm			CMOS			3 V								.4 mm		S-XQCC-N48
M1A3P600L-1FGG484I	Microchip Technology	SoC																							TIN SILVER COPPER														30	250																		3
MCIMX283CVM4BR2	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.55 V						1.4,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	85 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		1.37 mm			14 mm		IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V					40	260	14 mm			CMOS			1.45 V				Microprocessors				.8 mm		S-PBGA-B289	3	Not Qualified			e1
MCIMX535DVV1B	Freescale Semiconductor	SYSTEM ON CHIP		BALL	529	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.3 V							GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.2 V	85 Cel			-20 Cel	Tin/Silver (Sn/Ag)		BOTTOM		1.85 mm			19 mm							40	260	19 mm			CMOS			1.25 V								.8 mm		S-PBGA-B529	3	Not Qualified			e2
SLB9670XQ20FW763XUMA2	Infineon Technologies	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	1.95 V							CHIP CARRIER	LCC32,.2SQ,20	1.65 V	85 Cel			-40 Cel			QUAD		.9 mm			5 mm									5 mm			CMOS			1.8 V								.5 mm		S-PQCC-N32
XCZU25DR-2FFVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V							GRID ARRAY		.825 V	100 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM												30	245				CMOS			.85 V										R-PBGA-B1156	4				e1
XCZU2CG-1SFVA625E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	625	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V							GRID ARRAY		.825 V	100 Cel			0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM												30	250				CMOS			.85 V										R-PBGA-B625	4				e1
MCIMX6QP5EYM1AA	NXP Semiconductors	SoC	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V							GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	105 Cel			-20 Cel	TIN SILVER COPPER		BOTTOM		1.6 mm			21 mm		EACH GPIO MODULE SUPPORTS 32 BITS OF I/O.					40	260	21 mm			CMOS			1.4 V								.8 mm		S-PBGA-B624	3				e1
MCIMX6Y2CVM05AA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V							GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.275 V	105 Cel			-40 Cel			BOTTOM		1.32 mm			14 mm							40	260	14 mm			CMOS											.8 mm		S-PBGA-B289
MCIMX6Y2DVM09AA	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V							GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.375 V	95 Cel			0 Cel			BOTTOM		1.32 mm			14 mm							40	260	14 mm			CMOS											.8 mm		S-PBGA-B289	3
MGM210PA22JIA2R	Silicon Labs	SYSTEM ON CHIP
ST33HTPH2032AHD1	STMicroelectronics	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED		YES								CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		105 Cel			-40 Cel	NICKEL PALLADIUM GOLD		QUAD		1 mm			5 mm		ALSO OPERATES AT 3.3V NOMINAL VOLATGE					30	260	5 mm			CMOS			1.8 V								.5 mm		S-XQCC-N32	1				e4
UCD3138ARJAT	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3 V	125 Cel			-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	YES	QUAD		1 mm			6 mm							30	260	6 mm			CMOS			3.3 V								.5 mm		S-PQCC-N40	2				e4
VS3674PITTA	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.42 V							GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	85 Cel			0 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm			13 mm							30	260	13 mm			CMOS			1.35 V								.65 mm		S-PBGA-B338	3				e1
VS3674UNION	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.42 V							GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	85 Cel			0 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm			13 mm							30	260	13 mm			CMOS			1.35 V								.65 mm		S-PBGA-B338	3				e1
XCZU3CG-1SFVA625E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	625	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V							GRID ARRAY		.825 V	100 Cel			0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM												30	250				CMOS			.85 V										R-PBGA-B625	4				e1
D2-45057-QR-T	Renesas Electronics	SYSTEM ON CHIP		NO LEAD	68	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	1.9 V							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.4SQ,20	1.7 V	85 Cel			-10 Cel	NICKEL PALLADIUM GOLD		QUAD		1 mm			10 mm									10 mm			CMOS			1.8 V								.5 mm		S-PQCC-N68	3				e4
MCIMX357CJQ5CR2	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.47 V							GRID ARRAY, LOW PROFILE, FINE PITCH		1.22 V	85 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		1.6 mm			17 mm							40	260	17 mm						1.8 V								.8 mm		S-PBGA-B400	3				e1
MIMX8MM4DVTLZAA	NXP Semiconductors	SoC	OTHER	BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V							GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.95 V	95 Cel			0 Cel	TIN SILVER		BOTTOM		1.25 mm			14 mm							40	260	14 mm			CMOS			1 V								.5 mm		S-PBGA-B486	3				e2
MIMXRT1051CVJ5BR	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V							GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32	1.15 V	105 Cel			-40 Cel			BOTTOM		1.52 mm			12 mm									12 mm			CMOS											.8 mm		S-PBGA-B196
5CSEBA5U23I7N	Intel	SoC
AM4376BZDN100	Texas Instruments	SYSTEM ON CHIP	OTHER	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.378 V							GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.272 V	90 Cel			0 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm			17 mm							30	260	17 mm			CMOS			1.325 V								.65 mm		S-PBGA-B491	3				e1
AM4376BZDNA80	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.326 V							GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.21 V	105 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm			17 mm							30	260	17 mm			CMOS			1.26 V								.65 mm		S-PBGA-B491	3				e1
EFR32MG24A010F1536IM40-B	Silicon Labs	SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED		YES	3.8 V							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	1.71 V	125 Cel			-40 Cel			QUAD		.9 mm			5 mm									5 mm			CMOS			3 V								.4 mm		S-XQCC-N40

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.