Other Function uPs,uCs & Peripheral ICs

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	DAC Channels	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	DMA Channels	Maximum Seated Height	ROM Words	RAM Words	Width	Data EEPROM Size	Additional Features	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	PWM Channels	Sub-Category	ROM Programmability	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code	On Chip Program ROM Width	No. of I/O Lines
MCIMX233CAG4C	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.55 V					FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63SQ,16	1 V	85 Cel		-40 Cel	TIN		QUAD		1.6 mm			14 mm						40	260	14 mm		CMOS		1.35 V					.4 mm		S-PQFP-G128	3			e3
MGM210PB32JIA2R	Silicon Labs	SYSTEM ON CHIP
SCANSTA111MTX/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	48	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V				3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP48,.3,20	3 V	85 Cel		-40 Cel	MATTE TIN		DUAL		1.2 mm			6.1 mm						30	260	12.5 mm		CMOS		3.3 V		Other Microprocessor ICs			.5 mm		R-PDSO-G48	2	Not Qualified		e3
ST33HTPH2032AAF3	STMicroelectronics	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		105 Cel		-40 Cel			QUAD		1 mm			5 mm		ALSO OPERATES AT 3.3V NOMINAL VOLATGE				NOT SPECIFIED	NOT SPECIFIED	5 mm		CMOS		1.8 V					.5 mm		S-XQCC-N32
XC7Z100-L2FFG900I	Xilinx	SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V					GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel		-40 Cel			BOTTOM		3.24 mm			27 mm								27 mm		CMOS		1 V					1 mm		S-PBGA-B900
XCZU7EV-3FFVC1156E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.927 V					GRID ARRAY		.873 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM											30	245			CMOS		.9 V							R-PBGA-B1156	4			e1
XCZU7EV-3FFVC1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES						GRID ARRAY			100 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		3.51 mm			35 mm								35 mm		CMOS		.9 V					1 mm		S-PBGA-B1156	4			e1
453-00068R	Laird Technologies	SoC
5CSXFC6C6U23I7N	Intel	SoC
AM6422BSDGHAALV	Texas Instruments	SYSTEM ON CHIP		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V					GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel		-40 Cel			BOTTOM		2.652 mm			17.2 mm		ALSO OPERATES AT 0.85V NOMINAL SUPPLY				30	250	17.2 mm		CMOS		.75 V					.8 mm		S-PBGA-B441	3		1000 rpm
CY8C4025LQI-S412	Infineon Technologies	PSoC	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1.89 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.71 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD		.6 mm			5 mm								5 mm		CMOS		1.8 V					.5 mm		S-XQCC-N32	3			e4
M82820G-15	M/a-com Technology Solutions
MCIMX280DVM4B	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	70 Cel		-20 Cel	TIN SILVER COPPER		BOTTOM		1.37 mm			14 mm		IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V				40	260	14 mm		CMOS		1.45 V					.8 mm		S-PBGA-B289	3	Not Qualified		e1
MCIMX286CVM4BR2	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V				1.4,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.37 mm			14 mm		IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V				40	260	14 mm		CMOS		1.45 V		Microprocessors			.8 mm		S-PBGA-B289	3	Not Qualified		e1
MCIMX351AJQ5C	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V	AEC-Q100				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,25	1.33 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.6 mm			17 mm						40	260	17 mm		CMOS							.8 mm		S-PBGA-B400	3	Not Qualified		e1
MIMXRT1064CVJ5A	NXP Semiconductors	SoC	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,31	1.15 V	105 Cel		-40 Cel			BOTTOM		1.52 mm			12 mm						40	260	12 mm		CMOS							.8 mm		S-PBGA-B196	3
MPFS250T-FCG1152E	Microchip Technology	PROGRAMMABLE SoC		BALL	1152	BGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V					GRID ARRAY	BGA1152,34X34,40	.97 V	100 Cel		0 Cel			BOTTOM		2.99 mm			35 mm		ALSO OPERATES AT 1.05V NOMINAL SUPPLY						35 mm		CMOS		1 V					1 mm		S-PBGA-B1152
MPFS250T-FCG1152I	Microchip Technology	PROGRAMMABLE SoC		BALL	1152	BGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V					GRID ARRAY	BGA1152,34X34,40	.97 V	100 Cel		-40 Cel			BOTTOM		2.99 mm			35 mm		ALSO OPERATES AT 1.05V NOMINAL SUPPLY						35 mm		CMOS		1 V					1 mm		S-PBGA-B1152
MTFC4GMDEA-4MIT/TR	Micron Technology	MICROPROCESSOR CIRCUIT																			TIN SILVER COPPER
TMS320DM365ZCE30	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V			32	1.35,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25	1.28 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm		8192	13 mm				32		30	260	13 mm		CMOS		1.35 V		Digital Signal Processors		I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B338	3	Not Qualified		e1
AM6442BSEGHAALV	Texas Instruments	SYSTEM ON CHIP		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V					GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel		-40 Cel			BOTTOM		2.652 mm			17.2 mm		ALSO OPERATES AT 0.85V NOMINAL SUPPLY						17.2 mm		CMOS		.75 V					.8 mm		S-PBGA-B441			1000 rpm
AS5134-ZSSM	Ams Ag	SYSTEM ON CHIP																			MATTE TIN																											3			e3
MCIMX6X3EVN10AB	NXP Semiconductors	SoC	COMMERCIAL EXTENDED	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.35 V	105 Cel		-20 Cel	TIN SILVER COPPER		BOTTOM		1.53 mm			17 mm						40	260	17 mm		CMOS							.8 mm		S-PBGA-B400	3			e1
OMAPL138EZCEA3R	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V					GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm			13 mm		IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY		32	50 MHz	30	260	13 mm		CMOS		1.3 V				I2C; SPI; UART; USB	.65 mm		S-PBGA-B361	3		456 rpm	e1
OMAPL138EZWTA3	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V					GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.4 mm			16 mm		IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY		32	50 MHz	30	260	16 mm		CMOS		1.3 V				I2C; SPI; UART; USB	.8 mm		S-PBGA-B361	3		456 rpm	e1
XCZU11EG-2FFVB1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V					GRID ARRAY		.825 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM		3.51 mm			40 mm						30	245	40 mm		CMOS		.85 V					1 mm		R-PBGA-B1517	4			e1
XCZU15EG-2FFVB1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V					GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM											30	245			CMOS		.85 V							R-PBGA-B1156	4			e1
10AS066N3F40E2LG	Intel	SoC		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V					GRID ARRAY	BGA1517,39X39,40	.87 V	100 Cel		0 Cel			BOTTOM		3.35 mm			40 mm		ALSO OPERATES AT 0.95V NOMINAL SUPPLY						40 mm		TSMC		.9 V					1 mm		S-PBGA-B1517
A2F200M3F-CSG288I	Microchip Technology	SoC FPGA		BALL	288	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.575 V					GRID ARRAY, THIN PROFILE, FINE PITCH	BGA288,21X21,20	1.425 V	100 Cel		-40 Cel			BOTTOM		1.05 mm			11 mm								11 mm		CMOS		1.5 V					.5 mm		S-PBGA-B288	3
AM5718AABCX	Texas Instruments	SYSTEM ON CHIP	OTHER	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V					GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	90 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		2.96 mm			23 mm						30	250	23 mm		CMOS		1.15 V					.8 mm		S-PBGA-B760	3		1500 rpm	e1
AM5718AABCXA	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V					GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		2.96 mm			23 mm						30	250	23 mm		CMOS		1.15 V					.8 mm		S-PBGA-B760	3		1500 rpm	e1
AM6232ASGGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V					GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel		-40 Cel			BOTTOM		.89 mm			13 mm								13 mm		CMOS		.75 V					.5 mm		S-PBGA-B425
ATECC608A-SSHCZ-T	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949				SMALL OUTLINE	SOP8,.23	2 V	85 Cel		-40 Cel			DUAL		1.75 mm			3.9 mm								4.9 mm		CMOS							1.27 mm		R-PDSO-G8
C8051F064-GQ	Silicon Labs	SoC	INDUSTRIAL											3							MATTE TIN														260							Microcontrollers						3	Not Qualified		e3
MCIMX6S6AVM08ACR	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V					GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	125 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.6 mm			21 mm		24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE;EACH GPIO MODULE SUPPORTS 32 BITS OF I/O				40	260	21 mm		CMOS							.8 mm		S-PBGA-B624	3			e1
MSP430F6748IPEUR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V			16	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63X.87,20	1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD		QUAD		1.6 mm	524288		14 mm				0	25 MHz	30	260	20 mm	16384	CMOS	11.75 mA	3.3 V		Microcontrollers	FLASH	I2C; SPI; UART	.5 mm		R-PQFP-G128	3	Not Qualified	25 rpm	e4
QCA7000-AL3C	Qualcomm	MICROPROCESSOR CIRCUIT
SCANSTA112SM/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	100	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V				3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA100,10X10,32	3 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.5 mm			10 mm				0		30	260	10 mm		CMOS		3.3 V		Other Microprocessor ICs			.8 mm		S-PBGA-B100	4	Not Qualified		e1
XCZU11EG-1FFVC1760E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V					GRID ARRAY		.825 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM											30	245			CMOS		.85 V							R-PBGA-B1760	4			e1
XCZU5CG-L2FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V					GRID ARRAY		.698 V	110 Cel		0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM							ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY				30	245			CMOS		.72 V							R-PBGA-B900	4			e1
AM6231AGGGGHALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V					GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	95 Cel		0 Cel			BOTTOM		.89 mm			13 mm								13 mm		CMOS		.75 V					.5 mm		S-PBGA-B425
CC1310F64RSMT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD		1 mm			4 mm						NOT SPECIFIED	260	4 mm	28672	CMOS		3.3 V					.4 mm		S-PQCC-N32	3			e4
EFR32MG22C224F512IM40-C	Silicon Labs	SYSTEM ON CHIP																			MATTE TIN													40	260													2			e3
MC13213R2	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BUTT	71	VFLGA	SQUARE	PLASTIC/EPOXY	YES	3.4 V					GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2 V	85 Cel		-40 Cel	NICKEL GOLD		BOTTOM		1 mm			9 mm						30	250	9 mm		CMOS		2.7 V					.5 mm		S-PBGA-B71	3	Not Qualified		e4
NT3H2211W0FTTJ	NXP Semiconductors	MICROPROCESSOR CIRCUIT																			NICKEL PALLADIUM GOLD													30	260													1			e4
UCD3138A64PFC	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	80	TFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		NO			FLATPACK, THIN PROFILE, FINE PITCH		3 V	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	NO	1.2 mm	65536		12 mm	2K		COMPARATOR(7)	0	2 MHz	30	260	12 mm		CMOS		3.3 V	NO			I2C; SPI; UART	.5 mm		S-PQFP-G80	3			e4	8	43
10AS032E4F29I3SG	Intel	SoC		BALL	780	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V					GRID ARRAY	BGA780,28X28,40	.87 V	100 Cel		-40 Cel			BOTTOM		3.35 mm			29 mm								29 mm		TSMC		.9 V					1 mm		S-PBGA-B780
AM5716AABCXEQ1	Texas Instruments	SYSTEM ON CHIP	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100				GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	125 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		2.96 mm			23 mm						30	250	23 mm		CMOS		1.15 V					.8 mm		S-PBGA-B760	3			e1

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.