Other Function uPs,uCs & Peripheral ICs

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	DAC Channels	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	DMA Channels	Maximum Seated Height	ROM Words	RAM Words	Width	Data EEPROM Size	Additional Features	Boundary Scan	Peripherals	External Data Bus Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	No. of Timers	RAM Bytes	Technology	Analog To Digital Convertors	Nominal Supply Voltage	No. of DMA Channels	PWM Channels	No. of Serial I/Os	Sub-Category	Connectivity	ROM Programmability	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code	On Chip Program ROM Width	No. of I/O Lines
CC1310F64RSMR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.8 V							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD		1 mm			4 mm						NOT SPECIFIED	260	4 mm		28672	CMOS		3.3 V								.4 mm		S-PQCC-N32	3				e4
XC7Z010-L1CLG225I	Xilinx	SYSTEM ON CHIP		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V							GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	.95 V	100 Cel			-40 Cel			BOTTOM		1.5 mm			13 mm								13 mm			CMOS		1 V								.8 mm		S-PBGA-B225
AM6252ATCGGAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY		YES	.79 V							GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel			-40 Cel			BOTTOM		.89 mm			13 mm							250	13 mm			CMOS		.75 V								.5 mm		S-PBGA-B425	3		1400 rpm
ATWINC1500-MR210PB1961-T	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED		YES	4.2 V							MICROELECTRONIC ASSEMBLY		3 V	85 Cel			-40 Cel			UNSPECIFIED		2.113 mm			14.73 mm		SEATED HGT-NOM				NOT SPECIFIED	NOT SPECIFIED	21.72 mm			CMOS		3.6 V										R-XXMA-N28
MCIMX6Q5EYM12AD	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V							GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	105 Cel			-20 Cel	TIN SILVER COPPER		BOTTOM		1.6 mm			21 mm		24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE				40	260	21 mm			CMOS										.8 mm		S-PBGA-B624	3				e1
MCIMX6S5EVM10AC	NXP Semiconductors	SoC	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V							GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	105 Cel			-20 Cel	TIN SILVER COPPER		BOTTOM		1.6 mm			21 mm						40	260	21 mm			CMOS										.8 mm		S-PBGA-B624	3				e1
ST33HTPH2X32AHD5	STMicroelectronics	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED		YES								CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		105 Cel			-40 Cel			QUAD		1 mm			5 mm		ALSO AVAILABLE WITH 3.3V NOM SUPPLY				NOT SPECIFIED	NOT SPECIFIED	5 mm			CMOS		1.8 V								.5 mm		S-XQCC-N32
XC7Z014S-1CLG400I	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V							GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel			-40 Cel			BOTTOM		1.6 mm			17 mm								17 mm			CMOS		1 V								.8 mm		S-PBGA-B400
XCZU5EG-1SFVC784I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V							GRID ARRAY	BGA784,28X28,32	.825 V	100 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		3.32 mm			23 mm						30	250	23 mm			CMOS		.85 V								.8 mm		R-PBGA-B784	4				e1
AM6232ATCGGAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY		YES	.79 V							GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel			-40 Cel			BOTTOM		.89 mm			13 mm							250	13 mm			CMOS		.75 V								.5 mm		S-PBGA-B425	3		1400 rpm
XC7Z012S-2CLG485I	Xilinx	SYSTEM ON CHIP		BALL	485	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V							GRID ARRAY, LOW PROFILE, FINE PITCH	BGA485,22X22,32	.95 V	100 Cel			-40 Cel			BOTTOM		1.6 mm			19 mm								19 mm			CMOS		1 V								.8 mm		S-PBGA-B485
XC7Z030-2SBG485E	Xilinx	SYSTEM ON CHIP		BALL	485	BGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V							GRID ARRAY	BGA485,22X22,32	.95 V	100 Cel			0 Cel			BOTTOM		2.44 mm			19 mm								19 mm			CMOS		1 V								.8 mm		S-PBGA-B485
XCZU7EV-1FFVC1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V							GRID ARRAY		.825 V	100 Cel			-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM											30	245				CMOS		.85 V										R-PBGA-B1156	4				e1
XCZU7EV-2FFVC1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V							GRID ARRAY		.825 V	100 Cel			-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM											30	245				CMOS		.85 V										R-PBGA-B1156	4				e1
ATWINC1500-MR210PB	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED		YES	4.2 V							MICROELECTRONIC ASSEMBLY		3 V	85 Cel			-40 Cel			UNSPECIFIED		2.113 mm			14.73 mm		SEATED HGT-NOM				NOT SPECIFIED	NOT SPECIFIED	21.72 mm			CMOS		3.6 V										R-XXMA-N28
CC3220MODSF12MOBR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BUTT	63	BCC	RECTANGULAR	UNSPECIFIED	NO	YES	3.6 V	8		0	NO			CHIP CARRIER		2.3 V	85 Cel	CORTEX-M4	0	-40 Cel	NICKEL GOLD	YES	BOTTOM	NO	2.45 mm	1024000	256	17.5 mm	0		YES	TIMER(4), WDT	0	30	260	20.5 mm	4	262144	CMOS	4-Ch 12-Bit	3.3 V	2	NO	2		I2C, I2S, SD, SPI, UART	FLASH		1.27 mm	FIXED POINT	R-XBCC-B63	3		2400 rpm	YES	e4	8	25
CLRC66301HN,157	NXP Semiconductors
MCIMX6D7CVT08AD	NXP Semiconductors	SoC	INDUSTRIAL	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V							GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.275 V	105 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		2.16 mm			21 mm		EACH GPIO MODULE SUPPORTS 32 BITS OF I/O				40	260	21 mm			CMOS		1.4 V								.8 mm		S-PBGA-B624	3				e1
MCIMX6U5DVM10AB	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V							GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel			0 Cel	TIN SILVER COPPER		BOTTOM		1.6 mm			21 mm						40	260	21 mm			CMOS										.8 mm		S-PBGA-B624	3				e1
XC7Z030-L2FBG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V							GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel			-40 Cel			BOTTOM		2.54 mm			27 mm								27 mm			CMOS		1 V								1 mm		S-PBGA-B676
XCZU7EV-L1FFVC1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.742 V							GRID ARRAY		.698 V	100 Cel			-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM							ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY				30	245				CMOS		.72 V										R-PBGA-B1156	4				e1
CY8C21434-24LFXI	Cypress Semiconductor	PROGRAMMABLE SoC	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED		YES	5.25 V						2.5/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	4.75 V	85 Cel			-40 Cel	NICKEL PALLADIUM GOLD		QUAD		.93 mm			5 mm		ALSO OPERATES AT 2.7V AND 3.3V SUPPLY				40	260	5 mm			CMOS		5 V				Microcontrollers				.5 mm		S-XQCC-N32	3	Not Qualified			e4
CY8C6316BZI-BLF03	Infineon Technologies	PROGRAMMABLE SoC																							TIN SILVER COPPER																															3				e1
MCIMX6X4EVM10AC	NXP Semiconductors	SoC		BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V							GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.35 V	105 Cel			-20 Cel	TIN SILVER COPPER		BOTTOM		1.52 mm			19 mm						40	260	19 mm			CMOS										.8 mm		S-PBGA-B529	3				e1
MCIMX6Y1CVM05AB	NXP Semiconductors	SoC		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V							GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.275 V	105 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		1.32 mm			14 mm						40	260	14 mm			CMOS										.8 mm		S-PBGA-B289	3				e1
TMS320DM365ZCED30	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.42 V					32	1.35,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25	1.28 V	85 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm		8192	13 mm					32	30	260	13 mm			CMOS		1.35 V				Digital Signal Processors			I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B338	3	Not Qualified			e1
TMS320F28PLC84PNT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY		YES	3.63 V							FLATPACK, LOW PROFILE, FINE PITCH		2.97 V	105 Cel			-40 Cel	NICKEL PALLADIUM GOLD		QUAD		1.6 mm			12 mm						30	260	12 mm			CMOS		3.3 V								.5 mm		S-PQFP-G80	3				e4
BM83SM1-00AA	Microchip Technology	PROGRAMMABLE RFSoC		NO LEAD	50	XMA	RECTANGULAR	UNSPECIFIED		YES	4.2 V							MICROELECTRONIC ASSEMBLY		3.2 V	85 Cel			-40 Cel	GOLD OVER NICKEL		UNSPECIFIED		2.5 mm			15 mm							260	32 mm			CMOS		3.8 V								1 mm		R-XXMA-N50	1
TW8804-LC3-GRSH	Renesas Electronics																								MATTE TIN																															3				e3
XC7Z014S-2CLG484I	Xilinx	SYSTEM ON CHIP		BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V							GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32	.95 V	100 Cel			-40 Cel			BOTTOM		1.6 mm			19 mm								19 mm			CMOS		1 V								.8 mm		S-PBGA-B484
EFR32MG24B220F1536IM48-B	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED		YES	3.8 V							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	125 Cel			-40 Cel			QUAD		.9 mm			6 mm								6 mm			CMOS		3 V								.4 mm		S-XQCC-N48
MCIMX6Q6AVT10AER	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V							GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel			-40 Cel			BOTTOM		2.16 mm			21 mm						40	260	21 mm			CMOS		1.4 V								.8 mm		S-PBGA-B624	3
SCANSTA112VSX/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	TFQFP	SQUARE	PLASTIC/EPOXY		YES	3.6 V						3.3	FLATPACK, THIN PROFILE, FINE PITCH	TQFP100,.63SQ	3 V	85 Cel			-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD		1.2 mm			14 mm					0	NOT SPECIFIED	260	14 mm			CMOS		3.3 V				Other Microprocessor ICs				.5 mm		S-PQFP-G100	3	Not Qualified			e4
SLB9670XQ20FW762XUMA1	Infineon Technologies	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	1.95 V							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.65 V	85 Cel			-40 Cel			BOTTOM		.9 mm			5 mm		ALSO AVAILABLE WITH 3.3V NOM SUPPLY						5 mm			CMOS		1.8 V								.5 mm		S-PQCC-N32
XCZU2CG-1SBVA484E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V							GRID ARRAY		.825 V	100 Cel			0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM											30	250				CMOS		.85 V										R-PBGA-B484	4				e1
ATECC508A-MAHDA-S	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	8	HVSON	RECTANGULAR	UNSPECIFIED		YES	5.5 V		TS 16949					SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2 V	85 Cel			-40 Cel	NICKEL PALLADIUM GOLD		DUAL		.6 mm			2 mm						40	260	3 mm			CMOS										.5 mm		R-PDSO-N8	1
CY8C21434-24LFXIT	Cypress Semiconductor	PROGRAMMABLE SoC	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED		YES	5.25 V						2.5/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	4.75 V	85 Cel			-40 Cel	NICKEL PALLADIUM GOLD		QUAD		.93 mm			5 mm		ALSO OPERATES AT 2.7V AND 3.3V SUPPLY				40	260	5 mm			CMOS		5 V				Microcontrollers				.5 mm		S-XQCC-N32	3	Not Qualified			e4
EFR32MG21A020F768IM32-B	Silicon Labs	SYSTEM ON CHIP	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED		YES	3.8 V							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.16SQ,16	1.71 V	125 Cel			-40 Cel	MATTE TIN		QUAD		.9 mm			4 mm						40	260	4 mm			CMOS		3 V								.4 mm		S-XQCC-N32	2				e3
MIMXRT1042XFP5B	NXP Semiconductors	SYSTEM ON CHIP
TMS320DM368ZCEF	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.42 V					32	1.35,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25	1.28 V	85 Cel			0 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm		8192	13 mm					32	30	260	13 mm			CMOS		1.35 V				Digital Signal Processors			I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B338	3	Not Qualified			e1
XC7Z100-1FFG900I	Xilinx	SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V							GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel			-40 Cel			BOTTOM		3.24 mm			27 mm								27 mm			CMOS		1 V								1 mm		S-PBGA-B900
XCZU3CG-1SBVA484E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V							GRID ARRAY		.825 V	100 Cel			0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM											30	250				CMOS		.85 V										R-PBGA-B484	4				e1
ATECC608A-MAHCZ-T	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V		TS 16949					SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2 V	85 Cel			-40 Cel			DUAL		.6 mm			2 mm								3 mm			CMOS										.5 mm		R-PDSO-N8
CY8C21434-24LKXI	Cypress Semiconductor	PROGRAMMABLE SoC	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED		YES	5.25 V						2.5/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	4.75 V	85 Cel			-40 Cel	NICKEL PALLADIUM GOLD		QUAD		.6 mm			5 mm		ALSO OPERATES AT 2.7V AND 3.3V SUPPLY				40	260	5 mm			CMOS		5 V				Microcontrollers				.5 mm		S-XQCC-N32	3	Not Qualified			e4
CY8C21434-24LKXIT	Cypress Semiconductor	PROGRAMMABLE SoC	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED		YES	5.25 V						2.5/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	4.75 V	85 Cel			-40 Cel	NICKEL PALLADIUM GOLD		QUAD		.6 mm			5 mm		ALSO OPERATES AT 2.7V AND 3.3V SUPPLY				40	260	5 mm			CMOS		5 V				Microcontrollers				.5 mm		S-XQCC-N32	3	Not Qualified			e4
MCIMX6G1CVM05AB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.3 V							GRID ARRAY, LOW PROFILE, FINE PITCH		1.15 V	105 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		1.32 mm			14 mm						40	260	14 mm			CMOS										.8 mm		S-PBGA-B289	3				e1
ATWINC1500-MR210PB1976	Microchip Technology	MICROPROCESSOR CIRCUIT		NO LEAD	28	XMA	RECTANGULAR	UNSPECIFIED		YES	4.2 V							MICROELECTRONIC ASSEMBLY		3 V	85 Cel			-40 Cel			UNSPECIFIED		2.113 mm			14.73 mm								21.72 mm			CMOS		3.3 V										R-XXMA-N28
MIMXRT1061CVL5A	NXP Semiconductors	SoC	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V							GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.15 V	105 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		1.43 mm			10 mm						40	260	10 mm			CMOS										.65 mm		S-PBGA-B196	3				e1

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.