Other Function uPs,uCs & Peripheral ICs

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	No. of Bits	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code
ATSHA204A-MAHCZ-T	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	8	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.08,20	2 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	.6 mm	2 mm				40	260	3 mm		CMOS		3.3 V			.5 mm	R-PQCC-N8	1
ATWINC1500B-MU-T	Microchip Technology	NETWORK CONTROLLER	INDUSTRIAL	NO LEAD	40	HQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	2.7 V	85 Cel		-40 Cel	MATTE TIN	QUAD	1 mm	5 mm			48 MHz			5 mm		CMOS		3.3 V			.4 mm	S-PQCC-N40				e3
CY8C4045AZI-S413	Infineon Technologies	PSoC	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.89 V				FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	1.71 V	85 Cel		-40 Cel	PURE TIN	QUAD	1.6 mm	7 mm						7 mm		CMOS		1.8 V			.5 mm	S-PQFP-G48	3
EFR32MG12P432F1024GM48-C	Silicon Labs	SYSTEM ON CHIP
MIMXRT1041XJM5B	NXP Semiconductors	SYSTEM ON CHIP
XCZU3EG-1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM						30	250			CMOS		.85 V				R-PBGA-B784	4			e1
XCZU48DR-2FFVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM						30	245			CMOS		.85 V				R-PBGA-B1156	4			e1
5CSEMA5F31I7N	Intel	SoC
AM6412BSCGHAALV	Texas Instruments	SYSTEM ON CHIP		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V				GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel		-40 Cel		BOTTOM	2.652 mm	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY				250	17.2 mm		CMOS		.75 V			.8 mm	S-PBGA-B441	3
CY8C6137BZI-F34	Infineon Technologies	PROGRAMMABLE SoC		BALL	124	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA124,13X13,25	1.7 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1 mm	9 mm						9 mm		CMOS		1.8 V			.65 mm	S-PBGA-B124	3			e1
CY8C624ABZI-S2D44	Infineon Technologies	PROGRAMMABLE SoC																		TIN SILVER COPPER																		3			e1
MCP25050T-E/SL	Microchip Technology	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949	8	5	SMALL OUTLINE	SOP14,.24	4.5 V	125 Cel		-40 Cel	Matte Tin (Sn)	DUAL	1.75 mm	3.9 mm						8.65 mm		CMOS		5 V	Parallel IO Port		1.27 mm	R-PDSO-G14	1	Not Qualified		e3
MKW41Z512VHT4	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	QCCN	SQUARE	UNSPECIFIED	YES	3.6 V				CHIP CARRIER		1.71 V	105 Cel		-40 Cel	NICKEL GOLD	QUAD						40	260			CMOS		3.3 V				S-XQCC-N48	3			e4
MPC8248CVRTIEA	NXP Semiconductors	SoC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	1.575 V			1.5,3.3	GRID ARRAY	BGA516,26X26,40	1.425 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	2.55 mm	27 mm				30	245	27 mm		CMOS		1.5 V	Other uPs/uCs/Peripheral ICs		1 mm	S-PBGA-B516	3	Not Qualified		e2
MPFS250TS-1FCVG484I	Microchip Technology	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V				GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel		-40 Cel		BOTTOM	2.92 mm	19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY					19 mm		CMOS		1 V			.8 mm	S-PBGA-B484
XC7Z030-1FBG484C	Xilinx	SYSTEM ON CHIP		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA484,22X22,40	.95 V	85 Cel		0 Cel		BOTTOM	2.54 mm	23 mm						23 mm		CMOS		1 V			1 mm	S-PBGA-B484
XCZU25DR-1FSVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM						30	240			CMOS		.85 V				R-PBGA-B1517	4			e1
XCZU25DR-L2FFVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V				GRID ARRAY		.698 V	110 Cel		0 Cel	TIN SILVER COPPER	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	245			CMOS		.72 V				R-PBGA-B1517	4			e1
XCZU2CG-1SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES					GRID ARRAY			100 Cel		0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM						30	250			CMOS		.85 V				S-PBGA-B784	4			e1
XCZU3EG-1SBVA484I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM										CMOS		.85 V				R-PBGA-B484	4			e1
XCZU4EG-1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM						30	250			CMOS		.85 V				R-PBGA-B784	4			e1
XCZU5CG-2FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM						30	245			CMOS		.85 V				R-PBGA-B900	4			e1
5CSEBA2U23A7N	Intel	SoC
5CSEBA5U19I7N	Intel	SoC
AM4372BZDNA60	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.144 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.056 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	17 mm				30	260	17 mm		CMOS		1.1 V			.65 mm	S-PBGA-B491	3			e1
ATWINC1510-MR210PB1961	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	4.2 V				MICROELECTRONIC ASSEMBLY		3 V	85 Cel		-40 Cel		UNSPECIFIED	2.113 mm	14.73 mm	SEATED HGT-NOM					21.72 mm		CMOS		3.6 V				R-XXMA-N28
CC1310F64RHBR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	1 mm	5 mm				NOT SPECIFIED	260	5 mm	28672	CMOS		3.3 V			.5 mm	S-PQCC-N32	3			e4
FXLC95000CLR1	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BUTT	24	TFLGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.89 V				GRID ARRAY, THIN PROFILE, FINE PITCH		1.71 V	85 Cel		-40 Cel		BOTTOM	1.1 mm	3 mm				40	260	5 mm		CMOS		1.8 V			.5 mm	R-PBGA-B24	3
MTFC8GLVEA-4MIT	Micron Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.95 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.65 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	.8 mm	11.5 mm	IT ALSO OPERATES AT 3.3 VOLTS					13 mm		CMOS		1.8 V			.5 mm	R-PBGA-B153				e1
OMAPL138EZWTA3E	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY	32	50 MHz	30	260	16 mm		CMOS		1.3 V		I2C; SPI; UART; USB	.8 mm	S-PBGA-B361	3		456 rpm	e1
PN7120A0EV/C10801E	NXP Semiconductors		OTHER	BALL	49	FBGA	SQUARE	PLASTIC/EPOXY	YES				1.8	GRID ARRAY, FINE PITCH	BGA49,7X7,20		85 Cel		-30 Cel	TIN SILVER COPPER	BOTTOM						30	260					1.8 V	Other uPs/uCs/Peripheral ICs		.5 mm	S-PBGA-B49	3	Not Qualified		e1
THGBM5G5A1JBAIRH2H	Toshiba	MICROPROCESSOR CIRCUIT	OTHER	BALL	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.7 V	85 Cel		-25 Cel		BOTTOM	1 mm	11.5 mm						13 mm		CMOS		3.3 V			.5 mm	R-PBGA-B153
XC7Z014S-1CLG484I	Xilinx	SYSTEM ON CHIP		BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32	.95 V	100 Cel		-40 Cel		BOTTOM	1.6 mm	19 mm						19 mm		CMOS		1 V			.8 mm	S-PBGA-B484
XCZU7EG-2FFVF1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.51 mm	40 mm				30	245	40 mm		CMOS		.85 V			1 mm	R-PBGA-B1517	4			e1
XCZU7EG-3FFVF1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.927 V				GRID ARRAY		.873 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM						30	245			CMOS		.9 V				R-PBGA-B1517	4			e1
XCZU7EG-L1FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V				GRID ARRAY		.698 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	245			CMOS		.72 V				R-PBGA-B900	4			e1
ATSAM4C8CB-AU	Microchip Technology	SoC	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.32 V				FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.08 V	85 Cel		-40 Cel	MATTE TIN	QUAD	1.6 mm	14 mm				40	260	14 mm		CMOS		1.2 V			.5 mm	S-PQFP-G100	3			e3
AX8052F131-2-TB05	Onsemi	SYSTEM ON CHIP	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V				CHIP CARRIER, VERY THIN PROFILE, HEAT SINK/SLUG	LCC28,.35X.55	2.2 V	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	1 mm	5 mm					260	7 mm		CMOS		3 V			.5 mm	S-PQCC-N28	1			e4
CC1310F128RGZ	Texas Instruments	MICROPROCESSOR CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V					QUAD	1 mm	7 mm						7 mm		CMOS					.5 mm	S-PQCC-N48
CY8C4025AZI-S413	Infineon Technologies	PSoC	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.89 V				FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	1.71 V	85 Cel		-40 Cel	PURE TIN	QUAD	1.6 mm	7 mm					260	7 mm		CMOS		1.8 V			.5 mm	S-PQFP-G48	3
CY8C4245PVI-DS402	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V				SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	1.8 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2 mm	5.3 mm						10.2 mm		CMOS		3 V			.65 mm	R-PDSO-G28	3			e4
ESP32-WROOM-32UE-H4	Espressif Systems (Shanghai)	SoC		NO LEAD	38	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V				MICROELECTRONIC ASSEMBLY		3 V	105 Cel		-40 Cel		UNSPECIFIED	3.35 mm	18 mm				30	250	19.2 mm		CMOS		3.3 V			1.27 mm	R-XXMA-N38	3
MCIMX356AJQ5C	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V	AEC-Q100			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.33 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	17 mm				40	260	17 mm		CMOS		1.8 V			.8 mm	S-PBGA-B400	3	Not Qualified		e1
MCP2221T-I/ST	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949		3.3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP14,.25	3 V	85 Cel		-40 Cel	MATTE TIN	DUAL	1.2 mm	4.4 mm						5 mm		CMOS	15 mA	3.3 V	Serial IO/Communication Controllers		.65 mm	R-PDSO-G14		Not Qualified		e3
MTFC8GLDEA-4MIT	Micron Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.95 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.65 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	.8 mm	11.5 mm	IT ALSO OPERATES AT 3.3 VOLTS					13 mm		CMOS		1.8 V			.5 mm	R-PBGA-B153				e1
S32G234MABK0VUCR	NXP Semiconductors	SoC	INDUSTRIAL																								40	260										3
SLB9670VQ12FW643XUMA2	Infineon Technologies	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.95 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.65 V	85 Cel		-20 Cel	NICKEL GOLD PALLADIUM SILVER	QUAD	.9 mm	5 mm	ALSO OPERATES WITH 3.3V NOM SUPPLY					5 mm		CMOS		1.8 V			.5 mm	S-PQCC-N32	3
SSD1926QL9	Solomon Systech	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.98 V				FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63SQ,16	1.62 V	85 Cel		-30 Cel		QUAD	1.6 mm	14 mm						14 mm		CMOS		1.8 V			.4 mm	S-PQFP-G128

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.