Other Function uPs,uCs & Peripheral ICs

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	ROM Words	RAM Words	Width	Additional Features	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Nominal Supply Voltage	Sub-Category	ROM Programmability	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code	No. of I/O Lines
5CSEBA5U23C8N	Intel	SoC
A2F200M3F-FGG256I	Microchip Technology	SoC FPGA		BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	1.575 V				GRID ARRAY, LOW PROFILE		1.425 V	100 Cel		-40 Cel	MATTE TIN	BOTTOM									30	250			CMOS	1.5 V					S-PBGA-B256	3
AM5718AABCXEQ1	Texas Instruments	SYSTEM ON CHIP	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100			GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm			23 mm					30	250	23 mm		CMOS	1.15 V				.8 mm	S-PBGA-B760	3		1500 rpm	e1
AM6251AKGGHHALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	95 Cel		0 Cel		BOTTOM	.89 mm			13 mm							13 mm		CMOS	.75 V				.5 mm	S-PBGA-B425
AM6254ASGGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel		-40 Cel		BOTTOM	.89 mm			13 mm							13 mm		CMOS	.75 V				.5 mm	S-PBGA-B425
ATECC608A-MAHK2-S	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2 V	85 Cel		-40 Cel		DUAL	.6 mm			2 mm							3 mm		CMOS					.5 mm	R-PDSO-N8
ATECC608B-TNGTLSU-B	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2 V	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	.6 mm			2 mm			0	1 MHz			3 mm		CMOS					.5 mm	R-PDSO-N8				e4
BCM53115MIPBG	Broadcom
DA14683-00000U22	Renesas Electronics	SoC																																							1
DM365ZCES	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm			13 mm			32		30	260	13 mm		CMOS	1.35 V			I2C; SPI; UART; USB	.65 mm	S-PBGA-B338	3			e1
DM365ZCEW	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm			13 mm			32		30	260	13 mm		CMOS	1.35 V			I2C; SPI; UART; USB	.65 mm	S-PBGA-B338	3			e1
DS28CM00R-A00+U	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	5	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V				SMALL OUTLINE		1.62 V	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL					ALSO AVAILABLE IN 5V				30	260			CMOS	1.8 V					R-PDSO-G5	1			e3
EFR32MG24A010F1024IM40-B	Silicon Labs	SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	1.71 V	125 Cel		-40 Cel		QUAD	.9 mm			5 mm							5 mm		CMOS	3 V				.4 mm	S-XQCC-N40
MC68302EH16CR2	NXP Semiconductors	MICROPROCESSOR CIRCUIT	COMMERCIAL	UNSPECIFIED			UNSPECIFIED	UNSPECIFIED		5.5 V						4.5 V	70 Cel		0 Cel	TIN	UNSPECIFIED									40	260			CMOS	5 V						3			e3
MCIMX257DJM4AR2	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.52 V			1.2/1.5,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.38 V	70 Cel		-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm			17 mm	ALSO REQUIRES 3.3 V I/O SUPPLY				40	260	17 mm		CMOS	1.45 V	Microprocessors			.8 mm	S-PBGA-B400	3	Not Qualified		e1
MCIMX6X4CVM08AC	NXP Semiconductors	SoC	INDUSTRIAL	BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.275 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.52 mm			19 mm					40	260	19 mm		CMOS					.8 mm	S-PBGA-B529	3			e1
MCIMX7D3DVK10SD	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	488	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.25 V				GRID ARRAY, THIN PROFILE, FINE PITCH	BGA488,28X28,16	1.2 V	95 Cel		0 Cel		BOTTOM	1.1 mm			12 mm					40	260	12 mm		CMOS	1.225 V				.4 mm	S-PBGA-B488	3
MCIMX7D7DVM10SD	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	541	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.25 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA541,25X25,29	1.2 V	95 Cel		0 Cel		BOTTOM	1.42 mm			19 mm					40	260	19 mm		CMOS	1.225 V				.75 mm	S-PBGA-B541	3
MTFC4GMVEA-4MIT	Micron Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.95 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.65 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	.8 mm			11.5 mm	IT ALSO OPERATES AT 3.3 VOLTS						13 mm		CMOS	1.8 V				.5 mm	R-PBGA-B153				e1
OMAPL132EZWTA2R	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm			16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY				30	260	16 mm		CMOS	1.2 V				.8 mm	S-PBGA-B361	3		200 rpm	e1
OMAPL138EZWT4	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm			16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY		32	50 MHz	30	260	16 mm		CMOS	1.3 V			I2C; SPI; UART; USB	.8 mm	S-PBGA-B361	3		456 rpm	e1
STV0991FAH	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	201	TFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100			GRID ARRAY, THIN PROFILE, FINE PITCH			105 Cel		-40 Cel		BOTTOM	1.12 mm			10 mm					NOT SPECIFIED	NOT SPECIFIED	10 mm		CMOS	1.1 V				.65 mm	S-PBGA-B201
STV0991FAH/TR	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	201	TFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100			GRID ARRAY, THIN PROFILE, FINE PITCH			105 Cel		-40 Cel		BOTTOM	1.12 mm			10 mm					NOT SPECIFIED	NOT SPECIFIED	10 mm		CMOS	1.1 V				.65 mm	S-PBGA-B201
TCI6630K2LXCMSA2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.997 V				GRID ARRAY		.902 V				TIN SILVER COPPER	BOTTOM									30	245			CMOS	.95 V					S-PBGA-B900	4			e1
XA7Z030-1FBV484Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100			GRID ARRAY			125 Cel		-40 Cel		BOTTOM													CMOS						S-PBGA-B484
XAZU4EV-1SFVC784Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES					GRID ARRAY, FINE PITCH			125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm			23 mm					30	250	23 mm		CMOS	.85 V				.8 mm	S-PBGA-B784	4			e1
XC7Z030-2FFG676E	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel		0 Cel		BOTTOM	3.24 mm			27 mm							27 mm		CMOS	1 V				1 mm	S-PBGA-B676
XCZU17EG-1FFVD1760I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM									30	245			CMOS	.85 V					R-PBGA-B1760	4			e1
XCZU19EG-L2FFVD1760E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V				GRID ARRAY		.698 V	110 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM					ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY				30	245			CMOS	.72 V					R-PBGA-B1760	4			e1
XCZU1CG-2SBVA484I	Xilinx	MICROPROCESSOR CIRCUIT																		Tin/Silver/Copper (Sn/Ag/Cu)										30	250										4			e1
XCZU1CG-2SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT																		Tin/Silver/Copper (Sn/Ag/Cu)										30	250										4			e1
XCZU1EG-1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT																		Tin/Silver/Copper (Sn/Ag/Cu)										30	250										4			e1
XCZU1EG-L1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT																		Tin/Silver/Copper (Sn/Ag/Cu)										30	250										4			e1
XCZU1EG-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT																		Tin/Silver/Copper (Sn/Ag/Cu)										30	250										4			e1
XCZU1EG-L2SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT																		Tin/Silver/Copper (Sn/Ag/Cu)										30	250										4			e1
XCZU1EG-L2UBVA494E	Xilinx	MICROPROCESSOR CIRCUIT																		TIN SILVER BISMUTH COPPER NICKEL										30	245										4
XCZU5EG-2FBVB900I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY	BGA900,30X30,40	.825 V	100 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.88 mm			31 mm					30	245	31 mm		CMOS	.85 V				1 mm	R-PBGA-B900	4			e1
XCZU5EV-3SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES					GRID ARRAY			100 Cel		0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM									30	250			CMOS	.9 V					S-PBGA-B784	4			e1
XCZU5EV-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V				GRID ARRAY		.698 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM					ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY				30	250			CMOS	.72 V					R-PBGA-B784	4			e1
XCZU6EG-1FFVB1156E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM									30	245			CMOS	.85 V					R-PBGA-B1156	4			e1
XCZU7CG-2FFVF1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.51 mm			40 mm					30	245	40 mm		CMOS	.85 V				1 mm	R-PBGA-B1517	4			e1
XTDA4AHXXXGAALY	Texas Instruments	SoC		BALL	1414	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V				GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA1414,38X38,32	.76 V	70 Cel		0 Cel		BOTTOM	3.341 mm			31 mm							31 mm		CMOS	.8 V				.8 mm	S-PBGA-B1414
XTDA4APXXXGAALY	Texas Instruments	SoC		BALL	1414	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V				GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA1414,38X38,32	.76 V	70 Cel		0 Cel		BOTTOM	3.341 mm			31 mm							31 mm		CMOS	.8 V				.8 mm	S-PBGA-B1414
9LPRS511EGLFT	Integrated Device Technology	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	64	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES				3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP64,.32,20		70 Cel		0 Cel	TIN	DUAL										260			CMOS	3.3 V	Clock Generators			.5 mm	R-PDSO-G64	1	Not Qualified		e3
AM5718AABCXQ1	Texas Instruments	SYSTEM ON CHIP	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100			GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm			23 mm					30	250	23 mm		CMOS	1.15 V				.8 mm	S-PBGA-B760	3		1500 rpm	e1
AM6252ATGGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel		-40 Cel		BOTTOM	.89 mm			13 mm							13 mm		CMOS	.75 V				.5 mm	S-PBGA-B425
ATSAM4C8CB-AUR	Microchip Technology	SoC	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.32 V				FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.08 V	85 Cel		-40 Cel	MATTE TIN	QUAD	1.6 mm			14 mm					40	260	14 mm		CMOS	1.2 V				.5 mm	S-PQFP-G100	3			e3
CC430F5145IRGZT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		16	2/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1 mm	16384	2	7 mm	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY	TIMER	0	20 MHz	30	260	7 mm	2048	CMOS	3.3 V	Microcontrollers	FLASH	I2C; SPI; UART; USB	.5 mm	S-PQCC-N48	3	Not Qualified	20 rpm	e4	30

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.