Other Function uPs,uCs & Peripheral ICs

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	Maximum Seated Height	ROM Words	RAM Words	Width	Additional Features	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	ROM Programmability	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code	No. of I/O Lines
MCIMX6X1EVK10AB	NXP Semiconductors	SoC	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,25	1.35 V	105 Cel		-20 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm			14 mm					40	260	14 mm		CMOS						.65 mm	S-PBGA-B400	3			e1
MPFS095TLS-FCSG325I	Microchip Technology	PROGRAMMABLE SoC		BALL	325		RECTANGULAR	PLASTIC/EPOXY	YES	1.03 V						.97 V	100 Cel		-40 Cel			BOTTOM					ALSO OPERATES AT 1.05V NOMINAL SUPPLY								CMOS		1 V					R-PBGA-B325
MSP430F67761IPZ	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		16	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	1.6 mm	262144	16	14 mm			0		30	260	14 mm	16384	CMOS	11.75 mA	3.3 V	Microcontrollers	FLASH	I2C; SPI; UART	.5 mm	S-PQFP-G100	3	Not Qualified	25 rpm	e4
RF430FRL153HCRGER	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	24	VQCCN	SQUARE	PLASTIC/EPOXY	YES					CHIP CARRIER, VERY THIN PROFILE			70 Cel		0 Cel	NICKEL PALLADIUM GOLD		QUAD	1 mm			4 mm	IT REQUIRES 1.45V TO 1.65V LOW SUPPLY VOLTAGE		0		30	260	4 mm		CMOS					I2C; SPI	.5 mm	S-PQCC-N24	2			e4
SA3229-E1-T	Onsemi	MICROPROCESSOR CIRCUIT	COMMERCIAL	BUTT	25	BCC	RECTANGULAR	PLASTIC/EPOXY	YES					CHIP CARRIER			40 Cel		0 Cel			BOTTOM	1.781 mm			3.18 mm					NOT SPECIFIED	NOT SPECIFIED	5.59 mm		CMOS		1.25 V					R-PBCC-B25
STSPIN32F0602	STMicroelectronics	MICROPROCESSOR CIRCUIT																													NOT SPECIFIED	NOT SPECIFIED
XC7Z100-1FFG1156C	Xilinx	SYSTEM ON CHIP		BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA1156,34X34,40	.95 V	85 Cel		0 Cel			BOTTOM	3.1 mm			35 mm							35 mm		CMOS		1 V				1 mm	S-PBGA-B1156
XCZU11EG-1FFVF1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM									30	245			CMOS		.85 V					R-PBGA-B1517	4			e1
XCZU1EG-2SBVA484I	Xilinx	MICROPROCESSOR CIRCUIT																		Tin/Silver/Copper (Sn/Ag/Cu)											30	250											4			e1
XCZU4EG-1SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM									30	250			CMOS		.85 V					R-PBGA-B784	4			e1
1SX165HU3F50I2VG	Intel	SoC FPGA
5CSEBA2U19C7N	Intel	SoC
5CSEMA4U23A7N	Intel	SoC
5CSEMA4U23C7N	Intel	SoC
5CSEMA4U23C8N	Intel	SoC
5CSXFC6C6U23C8N	Intel	SoC
AM6254ATGGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel		-40 Cel			BOTTOM	.89 mm			13 mm							13 mm		CMOS		.75 V				.5 mm	S-PBGA-B425
AM6441BSDGHAALV	Texas Instruments	SYSTEM ON CHIP		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V				GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel		-40 Cel			BOTTOM	2.652 mm			17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY						17.2 mm		CMOS		.75 V				.8 mm	S-PBGA-B441
AM6441BSFGHAALV	Texas Instruments	SYSTEM ON CHIP		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V				GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel		-40 Cel			BOTTOM	2.652 mm			17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY						17.2 mm		CMOS		.75 V				.8 mm	S-PBGA-B441
ATMXT1189TD-ABRI2CVAO	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.47 V	AEC-Q100			FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	3.14 V	105 Cel		-40 Cel			QUAD	1.6 mm			20 mm							20 mm		CMOS		3.3 V				.5 mm	S-PQFP-G144
ATWINC1500B-MU-T042	Microchip Technology	NETWORK CONTROLLER	INDUSTRIAL	NO LEAD	40	HQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	2.7 V	85 Cel		-40 Cel	MATTE TIN		QUAD	1 mm			5 mm				48 MHz			5 mm		CMOS		3.3 V				.4 mm	S-PQCC-N40				e3
ATWINC1500B-MU-Y042	Microchip Technology	NETWORK CONTROLLER	INDUSTRIAL	NO LEAD	40	HQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	2.7 V	85 Cel		-40 Cel	MATTE TIN		QUAD	1 mm			5 mm				48 MHz			5 mm		CMOS		3.3 V				.4 mm	S-PQCC-N40				e3
AX-SFUS-API-1-01-TB05	Onsemi	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	3.6 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel		-40 Cel	NICKEL GOLD PALLADIUM		QUAD	1 mm			5 mm					30	260	7 mm		CMOS		3 V				.5 mm	R-XQCC-N40	1
CC430F5123IRGZR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		16	2/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1 mm	8192	2	7 mm	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY	TIMER	0	20 MHz	30	260	7 mm	2048	CMOS		3.3 V	Microcontrollers	FLASH	I2C; SPI; UART; USB	.5 mm	S-PQCC-N48	3	Not Qualified	20 rpm	e4	30
CC430F5125IRGZR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		16	2/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1 mm	16384	2	7 mm	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY	TIMER	0	20 MHz	30	260	7 mm	2048	CMOS		3.3 V	Microcontrollers	FLASH	I2C; SPI; UART	.5 mm	S-PQCC-N48	3	Not Qualified	20 rpm	e4	30
CC430F5143IRGZR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		16	2/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1 mm	8192	2	7 mm	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY	TIMER	0	20 MHz	30	260	7 mm	2048	CMOS		3.3 V	Microcontrollers	FLASH	I2C; SPI; UART	.5 mm	S-PQCC-N48	3	Not Qualified	20 rpm	e4	30
CY8C4045LQS-S411	Infineon Technologies	PSoC																		NICKEL PALLADIUM GOLD																							3			e4
CY8C6137BZI-F54	Infineon Technologies	PROGRAMMABLE SoC		BALL	124	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA124,13X13,25	1.7 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1 mm			9 mm							9 mm		CMOS		1.8 V				.65 mm	S-PBGA-B124	3			e1
CY8C6336BZI-BLD13	Infineon Technologies	PROGRAMMABLE SoC																		TIN SILVER COPPER																							3			e1
DS28E36BQ+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	6	HVSON	RECTANGULAR	UNSPECIFIED	YES	3.63 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.11,37	2.97 V	85 Cel		-40 Cel	Matte Tin (Sn) - annealed		DUAL	.8 mm			3 mm					30	260	3 mm		CMOS		3.3 V				.95 mm	S-XDSO-N6	1			e3
DS8023-RJX+	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	6 V			3.3,5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	2.7 V	85 Cel		-40 Cel	Matte Tin (Sn) - annealed		DUAL	1.1 mm			4.4 mm					30	260	9.7 mm		CMOS	215 mA	3.3 V	Other Microprocessor ICs			.65 mm	R-PDSO-G28	1	Not Qualified		e3
DS8023-RJX+T&R	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	6 V				SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		2.7 V	85 Cel		-40 Cel	Matte Tin (Sn) - annealed		DUAL	1.1 mm			4.4 mm	ALSO AVAILABLE IN 5V				30	260	9.7 mm		CMOS		3.3 V				.65 mm	R-PDSO-G28	1			e3
DS8023-RRX+	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	6 V			3.3,5	SMALL OUTLINE	SOP28,.4	2.7 V	85 Cel		-40 Cel	Matte Tin (Sn) - annealed		DUAL	2.65 mm			7.5 mm					30	260	17.9 mm		CMOS	215 mA	3.3 V	Other Microprocessor ICs			1.27 mm	R-PDSO-G28	1	Not Qualified		e3
DS8023-RRX+T&R	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	6 V				SMALL OUTLINE		2.7 V	85 Cel		-40 Cel	Matte Tin (Sn) - annealed		DUAL	2.65 mm			7.5 mm	ALSO AVAILABLE IN 5V				30	260	17.9 mm		CMOS		3.3 V				1.27 mm	R-PDSO-G28	1			e3
EFR32BG24B210F1024IM48-BR	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	125 Cel		-40 Cel			QUAD	.9 mm			6 mm							6 mm		CMOS		3 V				.4 mm	S-XQCC-N48
EFR32MG12P433F1024GL125-C	Silicon Labs	SYSTEM ON CHIP
EFR32MG12P433F1024GM48-C	Silicon Labs	SYSTEM ON CHIP
FH82CM246SR40E	Intel	MICROPROCESSOR CIRCUIT					RECTANGULAR	UNSPECIFIED																											CMOS
LTC4263IDE-1#TRPBF	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		4.5 V	85 Cel		-40 Cel	MATTE TIN		DUAL	.8 mm			3 mm					30	260	4 mm		CMOS		5 V				.5 mm	R-PDSO-N14	1	Not Qualified		e3
LTC4263IS#TRPBF	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V				SMALL OUTLINE		4.5 V	85 Cel		-40 Cel	MATTE TIN		DUAL	1.752 mm			3.899 mm					30	260	8.649 mm		CMOS		5 V				1.27 mm	R-PDSO-G14	1	Not Qualified		e3
MCIMX27LMOP4A	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	473	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.52 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.38 V	85 Cel		-40 Cel			BOTTOM	1.54 mm			19 mm	ALSO OPERATES WITH 1.3VNOM @266MHZ				40	260	19 mm		CMOS		1.45 V				.8 mm	S-PBGA-B473	3	Not Qualified
MCIMX6D6AVT10AC	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, FINE PITCH		1.35 V	125 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	2.16 mm			21 mm	24MHZ NOMINAL EXTERNAL FREQUENCY AVAILABLE				40	260	21 mm		CMOS						.8 mm	S-PBGA-B624	3			e1
MCIMX6U5EVM10AB	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	105 Cel		-20 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm			21 mm					40	260	21 mm		CMOS						.8 mm	S-PBGA-B624	3			e1
MCIMX6Y7DVK05AA	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	272	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA272,17X17,20	1.275 V	95 Cel		0 Cel			BOTTOM	1.23 mm			9 mm					40	260	9 mm		CMOS						.5 mm	S-PBGA-B272	3
MKW41Z512CAT4R	NXP Semiconductors	MICROPROCESSOR CIRCUIT																													40	260											1
MPFS095TLS-FCVG484I	Microchip Technology	PROGRAMMABLE SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V				GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel		-40 Cel			BOTTOM	2.92 mm			19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY						19 mm		CMOS		1 V				.8 mm	S-PBGA-B484
MSP430F67491IPZ	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		16	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	1.6 mm	524288	32	14 mm			0		30	260	14 mm	32768	CMOS	11.75 mA	3.3 V	Microcontrollers	FLASH	I2C; SPI; UART	.5 mm	S-PQFP-G100	3	Not Qualified	25 rpm	e4
MSP430F67791IPEU	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		16	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63X.87,20	1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	1.6 mm	524288	32	14 mm			0		30	260	20 mm	32768	CMOS	11.75 mA	3.3 V	Microcontrollers	FLASH	I2C; SPI; UART	.5 mm	R-PQFP-G128	3	Not Qualified	25 rpm	e4

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.