Other Function uPs,uCs & Peripheral ICs

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Information Access Method	Maximum Supply Voltage	Screening Level	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Interrupt Capability	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	ADC Channels	Ultraviolet Erasable	Terminal Position	Maximum Seated Height	ROM Words	RAM Words	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	ROM Bits Size	RAM Bytes	Technology	Maximum Supply Current	Minimum Time	Nominal Supply Voltage	Sub-Category	ROM Programmability	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Volatile	JESD-609 Code	No. of I/O Lines
CC1310F64RGZ	Texas Instruments	MICROPROCESSOR CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES		3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			1.8 V							QUAD	1 mm			7 mm						7 mm			CMOS							.5 mm	S-PQCC-N48
CC430F6147IRGCT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES		3.6 V		16	2/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20		2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD SILVER	YES		QUAD	1 mm	32768	4	9 mm	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY	0	20 MHz	30	260	9 mm		4096	CMOS			3.3 V	Microcontrollers	FLASH	I2C; SPI; UART; USB	.5 mm	S-PQCC-N64	3	Not Qualified	20 rpm		e4
CY8C21323-24LFXI	Cypress Semiconductor	PROGRAMMABLE SoC	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES		5.25 V			2.5/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		4.75 V	85 Cel		-40 Cel	Matte Tin (Sn)			QUAD	1 mm			4 mm	ALSO OPERATES AT 2.7V AND 3.3V SUPPLY			20	260	4 mm			CMOS			5 V	Microcontrollers			.5 mm	S-XQCC-N24	3	Not Qualified			e3
CY8C3244LTI-123	Infineon Technologies	PSoC	INDUSTRIAL											1.8/5								NICKEL PALLADIUM GOLD		N									20	260		131072 Bits						Other uPs/uCs/Peripheral ICs					3	Not Qualified			e4
CY8C4045LQI-S411T	Infineon Technologies	PSoC		NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES		1.89 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		1.71 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD			QUAD	.6 mm			4 mm				30	260	4 mm			CMOS			1.8 V				.5 mm	S-XQCC-N24	3				e4
CY8C4045LQI-S412	Infineon Technologies	PSoC	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES		1.89 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		1.71 V	85 Cel		-40 Cel	PURE TIN			QUAD	.6 mm			5 mm						5 mm			CMOS			1.8 V				.5 mm	S-XQCC-N32	3
CY8C4045LQI-S413	Infineon Technologies	PSoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES		1.89 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20		1.71 V	85 Cel		-40 Cel	PURE TIN			QUAD	.6 mm			6 mm						6 mm			CMOS			1.8 V				.5 mm	S-XQCC-N40	3
CY8C6144AZI-S4F92	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	HLFQFP	SQUARE	PLASTIC/EPOXY	YES		3.6 V				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	HQFP64,.47SQ,20		1.7 V	85 Cel		-40 Cel				QUAD	1.6 mm			10 mm						10 mm			CMOS			1.8 V				.5 mm	S-PQFP-G64	3
CY8C6244LQI-S4D92	Infineon Technologies	SoC		NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES		3.6 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16		1.7 V	85 Cel		-40 Cel				QUAD	1 mm			8 mm						8 mm			CMOS			1.8 V				.4 mm	S-XQCC-N68	3
CYPD3125-40LQXIT	Infineon Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES		21.5 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			2.7 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD			QUAD	.6 mm			6 mm						6 mm			CMOS			3.3 V				.5 mm	S-XQCC-N40	3				e4
DA14580-01UNA	Renesas Electronics	SoC																																													1
DA14583-01F01AT1	Renesas Electronics	SoC
DA14586-00F02AT2	Renesas Electronics	SoC																																													3
DLPC900ZPC	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES		1.2 V				GRID ARRAY	BGA516,26X26,40		1.1 V	55 Cel		0 Cel				BOTTOM	2.42 mm			27 mm		16	20 MHz			27 mm			CMOS			1.15 V			I2C; SPI; UART; USB	1 mm	S-PBGA-B516						9
DM8203EP	Davicom Semiconductor
DS2465P+T	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	C BEND	6	SOC	RECTANGULAR	PLASTIC/EPOXY	YES		3.63 V				SMALL OUTLINE			2.97 V	85 Cel		-40 Cel	Matte Tin (Sn) - annealed			DUAL	1.5 mm			3.76 mm				30	260	3.94 mm			CMOS			3.3 V				1.27 mm	R-PDSO-C6	1				e3
ECE1200-I/LD	Microchip Technology	MICROPROCESSOR CIRCUIT		NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES		1.89 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16		1.71 V	85 Cel		-40 Cel				QUAD	.9 mm			5 mm						5 mm			CMOS			1.8 V				.4 mm	S-PQCC-N40
EFR32BG24A010F1024IM48-BR	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES		3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16		1.71 V	125 Cel		-40 Cel				QUAD	.9 mm			6 mm						6 mm			CMOS			3 V				.4 mm	S-XQCC-N48
EFR32BG24A020F1024IM40-B	Silicon Labs	SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES		3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16		1.71 V	125 Cel		-40 Cel				QUAD	.9 mm			5 mm						5 mm			CMOS			3 V				.4 mm	S-XQCC-N40
EFR32BG24A020F1024IM40-BR	Silicon Labs	SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES		3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16		1.71 V	125 Cel		-40 Cel				QUAD	.9 mm			5 mm						5 mm			CMOS			3 V				.4 mm	S-XQCC-N40
EFR32BG24B110F1536IM48-B	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES		3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16		1.71 V	125 Cel		-40 Cel				QUAD	.9 mm			6 mm						6 mm			CMOS			3 V				.4 mm	S-XQCC-N48
FCM8531RQY	Onsemi	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES		5.5 V				FLATPACK, LOW PROFILE	QFP32,.35SQ,32		4.5 V	85 Cel		-40 Cel				QUAD	1.6 mm			7 mm				NOT SPECIFIED	NOT SPECIFIED	7 mm			CMOS			5 V			I2C; SPI; UART	.8 mm	S-PQFP-G32
FM31256-G	Infineon Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	SERIAL, FIXED PROTOCOL	5.5 V			3/5	SMALL OUTLINE	SOP14,.25	N	2.7 V	85 Cel		-40 Cel	PURE TIN			DUAL	1.75 mm			3.9 mm				30	260	8.64 mm			CMOS		SECONDS	3 V	Timer or RTC			1.27 mm	R-PDSO-G14	3	Not Qualified		NO
FSC-BT802	Shenzhen Feasycom	SoC		NO LEAD	36	QMA	RECTANGULAR	UNSPECIFIED	YES		3.6 V				MICROELECTRONIC ASSEMBLY			3 V	85 Cel		-40 Cel				QUAD				9.7 mm	BOX PACKAGE METHOD IS AVAILABLE WITH 2000PCS OF PACKAGE QUANTITY					11.5 mm			CMOS			3.3 V				1 mm	R-XQMA-N36
FT201XQ-U	FTDI	MICROPROCESSOR CIRCUIT																																				CMOS
HCTL-2021	Broadcom	MICROPROCESSOR CIRCUIT	INDUSTRIAL	PIN/PEG	20		RECTANGULAR	UNSPECIFIED	NO		5.5 V				MICROELECTRONIC ASSEMBLY			4.5 V	85 Cel		-40 Cel	MATTE TIN			DUAL									260				CMOS			5 V					R-XDMA-P20		Not Qualified			e3
HT82K628A(40DIP)	Holtek Semiconductor	MICROPROCESSOR CIRCUIT	OTHER	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO					5	IN-LINE	DIP40,.6			70 Cel		-25 Cel				DUAL													CMOS	5 mA		5 V	Other Microprocessor ICs			2.54 mm	R-PDIP-T40		Not Qualified
HT82K628A(40DIP-A)	Holtek Semiconductor
KW45B41Z82AFPBT	NXP Semiconductors	SoC
LS1021ASE7HNB	NXP Semiconductors	MICROPROCESSOR CIRCUIT		BALL	525	HBGA	SQUARE	PLASTIC/EPOXY	YES		1.03 V				GRID ARRAY, HEAT SINK/SLUG			.97 V				TIN SILVER COPPER			BOTTOM	2.07 mm			19 mm				40	260	19 mm			CMOS			1 V				.8 mm	S-PBGA-B525	3				e1
LTC4263CDE#TRPBF	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES		5.5 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			4.5 V	70 Cel		0 Cel	MATTE TIN			DUAL	.8 mm			3 mm				30	260	4 mm			CMOS			5 V				.5 mm	R-PDSO-N14	1	Not Qualified			e3
M1A3P1000L-1FG256I	Microchip Technology	SoC
MAXQ1061EUD+T	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14		RECTANGULAR	PLASTIC/EPOXY	YES										109 Cel		-40 Cel	Matte Tin (Sn) - annealed			DUAL								30	260				CMOS								R-PDSO-G14	1				e3
MCIMX27VOP4AR2	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	404	LFBGA	SQUARE	PLASTIC/EPOXY	YES		1.52 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA404,24X24,25		1.38 V	85 Cel		-20 Cel	TIN SILVER COPPER			BOTTOM	1.4 mm			17 mm	ALSO OPERATES 1.3V AT 266MHZ			40	260	17 mm			CMOS			1.45 V				.65 mm	S-PBGA-B404	3				e1
MCIMX280CVM4B	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES		1.55 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32		1.35 V	85 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM	1.37 mm			14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V			40	260	14 mm			CMOS			1.45 V				.8 mm	S-PBGA-B289	3	Not Qualified			e1
MCIMX286CVM4C	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES		1.55 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32		1.35 V	85 Cel		-40 Cel				BOTTOM	1.37 mm			14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V			40	260	14 mm			CMOS			1.45 V				.8 mm	S-PBGA-B289	3
MCIMX353CVM5B	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES		1.47 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32		1.33 V	85 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM	1.6 mm			17 mm	IT ALSO OPERATES AT 1.22 TO 1.47 V			40	260	17 mm			CMOS			1.8 V				.8 mm	S-PBGA-B400	3	Not Qualified			e1
MCIMX353DVM5B	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES		1.47 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32		1.33 V	70 Cel		-20 Cel	TIN SILVER COPPER			BOTTOM	1.6 mm			17 mm	IT ALSO OPERATES AT 1.22 TO 1.47 V			40	260	17 mm			CMOS			1.8 V				.8 mm	S-PBGA-B400	3	Not Qualified			e1
MCIMX357CVM5B	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES		1.47 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32		1.33 V	85 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM	1.6 mm			17 mm	IT ALSO OPERATES AT 1.22 TO 1.47 V			40	260	17 mm			CMOS			1.8 V				.8 mm	S-PBGA-B400	3	Not Qualified			e1
MCIMX357DVM5B	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES		1.47 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32		1.33 V	70 Cel		-20 Cel	TIN SILVER COPPER			BOTTOM	1.6 mm			17 mm	IT ALSO OPERATES AT 1.22 TO 1.47 V			40	260	17 mm			CMOS			1.8 V				.8 mm	S-PBGA-B400	3	Not Qualified			e1
MCIMX534AVV8CR2	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES		1.15 V	AEC-Q100			GRID ARRAY, FINE PITCH	BGA529,23X23,32		1.05 V	125 Cel		-40 Cel	TIN SILVER			BOTTOM	1.85 mm			19 mm				40	260	19 mm			CMOS			1.1 V				.8 mm	S-PBGA-B529	3				e2
MCIMX6D6AVT08AER	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES		1.5 V				GRID ARRAY, FINE PITCH	BGA624,25X25,32		1.35 V	125 Cel		-40 Cel				BOTTOM	2.16 mm			21 mm				40	260	21 mm			CMOS			1.4 V				.8 mm	S-PBGA-B624	3
MCIMX6D7CVT08AE	NXP Semiconductors	SoC	INDUSTRIAL	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES		1.5 V				GRID ARRAY, FINE PITCH	BGA624,25X25,32		1.275 V	105 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM	2.16 mm			21 mm	EACH GPIO MODULE SUPPORTS 32 BITS OF I/O			40	260	21 mm			CMOS			1.4 V				.8 mm	S-PBGA-B624	3				e1
MCIMX6X1CVO08AB	NXP Semiconductors	SoC	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES		1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32		1.275 V	105 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM	1.53 mm			17 mm				40	260	17 mm			CMOS							.8 mm	S-PBGA-B400	3				e1
MCIMX6X1EVO10AB	NXP Semiconductors	SoC	COMMERCIAL EXTENDED	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES		1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32		1.35 V	105 Cel		-20 Cel	TIN SILVER COPPER			BOTTOM	1.53 mm			17 mm				40	260	17 mm			CMOS							.8 mm	S-PBGA-B400	3				e1
MCIMX6X3EVK10AB	NXP Semiconductors	SoC	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES		1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,25		1.35 V	105 Cel		-20 Cel	TIN SILVER COPPER			BOTTOM	1.3 mm			14 mm				40	260	14 mm			CMOS							.65 mm	S-PBGA-B400	3				e1
MCIMX6Y1DVM05AA	NXP Semiconductors	SoC	OTHER	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES		1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32		1.275 V	95 Cel		0 Cel				BOTTOM	1.32 mm			14 mm				40	260	14 mm			CMOS							.8 mm	S-PBGA-B289	3
MEC1521H-B0-I/SZ	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	144	VFBGA	SQUARE	PLASTIC/EPOXY	YES		1.89 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA144,13X13,25		1.71 V	85 Cel		-40 Cel				BOTTOM	.8 mm			9 mm	ALSO OPERATES AT 3.3V NOMINAL VOLATGE	0	.032768 MHz			9 mm			CMOS			1.8 V			I2C, ESPI, UART	.65 mm	S-PBGA-B144

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.