Other Function uPs,uCs & Peripheral ICs

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
SLG7NT4129V	Renesas Electronics	SoC
SLS32AIA010MKUSON10XTMA2	Infineon Technologies	CRYPTOGRAPHIC AUTHENTICATOR	OTHER	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	5.5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC10,.12,20	1.62 V	85 Cel	-25 Cel		DUAL	.6 mm	3 mm						3 mm	CMOS	3.3 V		.5 mm	S-PDSO-N10
STM32HSM-V2AE	STMicroelectronics	CRYPTOGRAPHIC AUTHENTICATOR
STSPIN32F0601	STMicroelectronics	MICROPROCESSOR CIRCUIT																						NOT SPECIFIED	NOT SPECIFIED
STSPIN32F0BTR	STMicroelectronics	MICROPROCESSOR CIRCUIT																						NOT SPECIFIED	NOT SPECIFIED
T31X	Lumissil Microsystems	SoC
TCI6630K2LSCMSA	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.997 V		GRID ARRAY		.902 V			TIN SILVER COPPER	BOTTOM						30	245		CMOS	.95 V			S-PBGA-B900	4		e1
TCI6630K2LSCMSA2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.997 V		GRID ARRAY		.902 V			TIN SILVER COPPER	BOTTOM						30	245		CMOS	.95 V			S-PBGA-B900	4		e1
TW8816-LB3-GRS	Renesas Electronics	MICROPROCESSOR CIRCUIT															MATTE TIN															3		e3
TW8823-LC2-CE	Renesas Electronics																MATTE TIN							30	260							3		e3
XC7Z030-L2FBG484I	Xilinx	SYSTEM ON CHIP		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA484,22X22,40	.95 V	100 Cel	-40 Cel		BOTTOM	2.54 mm	23 mm						23 mm	CMOS	1 V		1 mm	S-PBGA-B484
XCVC1902-2HSIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.906 V		GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.854 V	110 Cel	-40 Cel		BOTTOM	4 mm	40 mm						40 mm	CMOS	.88 V		.92 mm	S-PBGA-B1760
XCVC1902-2LLIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.676 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm						45 mm	CMOS	.7 V		.92 mm	S-PBGA-B2197			e1
XCZU17EG-2FFVD1760E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.71 mm	42.5 mm				30	245	42.5 mm	CMOS	.85 V		1 mm	R-PBGA-B1760	4		e1
XCZU1EG-2SBVA484E	Xilinx	MICROPROCESSOR CIRCUIT															Tin/Silver/Copper (Sn/Ag/Cu)							30	250							4		e1
XCZU27DR-2FFVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM						30	245		CMOS	.85 V			R-PBGA-B1156	4		e1
XCZU2CG-L1SBVA484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V		GRID ARRAY		.698 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	250		CMOS	.72 V			R-PBGA-B484	4		e1
XCZU2CG-L1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V		GRID ARRAY		.698 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	250		CMOS	.72 V			R-PBGA-B625	4		e1
XCZU2EG-1SBVA484E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM									CMOS	.85 V			R-PBGA-B484	4		e1
XCZU5EG-1SFVC784E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY	BGA784,28X28,32	.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm				30	250	23 mm	CMOS	.85 V		.8 mm	R-PBGA-B784	4		e1
XCZU7CG-1FFVF1517I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM						30	245		CMOS	.85 V			R-PBGA-B1517	4		e1
XCZU7EV-1FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM						30	245		CMOS	.85 V			R-PBGA-B900	4		e1
XCZU9EG-L2FFVC900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V		GRID ARRAY		.698 V	110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	245		CMOS	.72 V			R-PBGA-B900	4		e1
XUF216-512-TQ128-I20A	Xmos	MICROPROCESSOR CIRCUIT		GULL WING	128	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1.05 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP128,.63SQ,16	.95 V	85 Cel	-40 Cel		QUAD	1.2 mm	14 mm						14 mm	CMOS	1 V		.4 mm	S-PQFP-G128
10AS048H4F34E3SG	Intel	SoC		BALL	1152	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		GRID ARRAY	BGA1152,34X34,40	.87 V	100 Cel	0 Cel		BOTTOM	3.35 mm	35 mm						35 mm	TSMC	.9 V		1 mm	S-PBGA-B1152
10AS066H2F34I1HG	Intel	SoC		BALL	1152	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY	BGA1152,34X34,40		100 Cel	-40 Cel		BOTTOM	3.35 mm	35 mm						35 mm	TSMC			1 mm	S-PBGA-B1152
162PC01D	Honeywell Sensing And Control
5CSEBA4U23I7SN	Intel	SoC
5CSEBA5U19A7N	Intel	SoC
5CSEBA5U23C7SN	Intel	SoC
5CSEMA6F31I7N	Intel	SoC
66AK2G12ABYA60	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	625	LFBGA	SQUARE	PLASTIC/EPOXY	YES	.945 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA625,25X25,32	.855 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.56 mm	21 mm				30	260	21 mm	CMOS	.9 V		.8 mm	S-PBGA-B625	3		e1
A2F200M3F-1FG484I	Microchip Technology	SoC FPGA		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1.575 V		GRID ARRAY		1.425 V	100 Cel	-40 Cel	TIN LEAD	BOTTOM									CMOS	1.5 V			S-PBGA-B484	3
A2F200M3F-FG256I	Microchip Technology	SoC FPGA															TIN LEAD															3
A7101CHTK2/T0BC2BJ	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR	OTHER	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1.98 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.16,32	1.62 V	85 Cel	-25 Cel		DUAL	1 mm	4 mm	ALSO AVAILABLE WITH 3.3V NOM SUPPLY				260	4 mm	CMOS	1.8 V		.8 mm	S-PDSO-N8	1
ADSP-SC583CBCZ-3A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	95 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm	19 mm			500 MHz	30	260	19 mm	CMOS	1.1 V	SPI; UART	.8 mm	S-PBGA-B349	3		e1
AM4378BZDN80	Texas Instruments	SYSTEM ON CHIP	OTHER	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.326 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.21 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	17 mm				30	260	17 mm	CMOS	1.26 V		.65 mm	S-PBGA-B491	3		e1
AM6232ATGGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM	.89 mm	13 mm						13 mm	CMOS	.75 V		.5 mm	S-PBGA-B425
AM6234ASGGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM	.89 mm	13 mm						13 mm	CMOS	.75 V		.5 mm	S-PBGA-B425
AM6251ASGGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM	.89 mm	13 mm						13 mm	CMOS	.75 V		.5 mm	S-PBGA-B425
AR1100T-I/SO	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.465 V	TS 16949	SMALL OUTLINE	SOP20,.4	3.135 V	85 Cel	-40 Cel	MATTE TIN	DUAL	2.65 mm	7.5 mm	ALSO OPERATES AT 5V SUPPLY					12.8 mm	CMOS	3.3 V		1.27 mm	R-PDSO-G20		Not Qualified	e3
ATECC108A-MAHDA-T	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	.6 mm	2 mm				40	260	3 mm	CMOS			.5 mm	R-PDSO-N8	1		e4
ATECC508A-RBHCZ-T	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	3	LGA	RECTANGULAR	UNSPECIFIED	YES	5.5 V	TS 16949	GRID ARRAY		2 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	.55 mm	2.5 mm						6.5 mm	CMOS			2 mm	R-XLGA-N3
ATECC608B-TNGTLSS-G	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		SMALL OUTLINE	SOP8,.23	2 V	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	1.75 mm	3.9 mm		0	1 MHz			4.9 mm	CMOS			1.27 mm	R-PDSO-G8			e4
ATMXT641TD-ATR081	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		GULL WING	100	TFQFP	SQUARE	PLASTIC/EPOXY	YES	3.47 V	AEC-Q100; TS 16949	FLATPACK, THIN PROFILE, FINE PITCH	TQFP100,.63SQ	3.14 V	85 Cel	-40 Cel		QUAD	1.2 mm	14 mm						14 mm	CMOS	3.3 V		.5 mm	S-PQFP-G100
ATMXT641TD-ATRVA1	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		GULL WING	100	TFQFP	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100; TS 16949	FLATPACK, THIN PROFILE, FINE PITCH	TQFP100,.63SQ		85 Cel	-40 Cel		QUAD	1.2 mm	14 mm						14 mm	CMOS	3.3 V		.5 mm	S-PQFP-G100
ATWILC1000B-UU-T	Microchip Technology	SoC		BALL	55	VFBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA55,8X8,14		85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	.589 mm	3.24 mm						3.24 mm	CMOS	1.1 V		.35 mm	S-PBGA-B55
ATWINC3400-MR210CA143	Microchip Technology	MICROPROCESSOR CIRCUIT

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.