Other Function uPs,uCs & Peripheral ICs

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	JESD-609 Code
XCZU1CG-2SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT															Tin/Silver/Copper (Sn/Ag/Cu)							30	250							4	e1
XCZU1CG-L1SBVA484I	Xilinx	MICROPROCESSOR CIRCUIT															Tin/Silver/Copper (Sn/Ag/Cu)							30	250							4	e1
XCZU1EG-1UBVA494E	Xilinx	MICROPROCESSOR CIRCUIT															TIN SILVER BISMUTH COPPER NICKEL							30	245							4
XCZU1EG-2SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT															Tin/Silver/Copper (Sn/Ag/Cu)							30	250							4	e1
XCZU1EG-2SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT															Tin/Silver/Copper (Sn/Ag/Cu)							30	250							4	e1
XCZU3CG-2SBVA484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM						30	250		CMOS	.85 V			R-PBGA-B484	4	e1
XCZU3CG-L1SBVA484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V		GRID ARRAY		.698 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	250		CMOS	.72 V			R-PBGA-B484	4	e1
XCZU4CG-L1FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V		GRID ARRAY		.698 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	245		CMOS	.72 V			R-PBGA-B900	4	e1
XCZU4EG-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V		GRID ARRAY		.698 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	250		CMOS	.72 V			R-PBGA-B784	4	e1
XCZU4EV-L2FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V		GRID ARRAY		.698 V	110 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	245		CMOS	.72 V			R-PBGA-B900	4	e1
XCZU5CG-1FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM						30	245		CMOS	.85 V			R-PBGA-B900	4	e1
XCZU5CG-1SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY			100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM						30	250		CMOS	.85 V			S-PBGA-B784	4	e1
XCZU5CG-2SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, FINE PITCH			100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	3.32 mm	23 mm				30	250	23 mm	CMOS	.85 V		.8 mm	S-PBGA-B784	4	e1
XCZU5CG-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY			100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM			IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)			30	250		CMOS	.72 V			S-PBGA-B784	4	e1
XCZU5EG-1FBVB900I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY	BGA900,30X30,40	.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.88 mm	31 mm				30	245	31 mm	CMOS	.85 V		1 mm	R-PBGA-B900	4	e1
XCZU5EG-3SFVC784E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.927 V		GRID ARRAY	BGA784,28X28,32	.873 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm				30	250	23 mm	CMOS	.9 V		.8 mm	S-PBGA-B784	4	e1
XCZU5EG-L1SFVC784I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V		GRID ARRAY	BGA784,28X28,32	.698 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm	ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	250	23 mm	CMOS	.72 V		.8 mm	R-PBGA-B784	4	e1
XCZU5EG-L2SFVC784E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V		GRID ARRAY	BGA784,28X28,32	.698 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm	ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	250	23 mm	CMOS	.72 V		.8 mm	R-PBGA-B784	4	e1
XCZU5EV-1SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM						30	250		CMOS	.85 V			R-PBGA-B784	4	e1
XCZU7EV-L1FFVF1517I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V		GRID ARRAY		.698 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	245		CMOS	.72 V			R-PBGA-B1517	4	e1
ZGM230SA27HGN2	Silicon Labs	MICROPROCESSOR CIRCUIT
10AS016C4U19I3LG	Intel	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		GRID ARRAY, FINE PITCH	BGA484,22X22,32	.87 V	100 Cel	-40 Cel		BOTTOM	3.25 mm	19 mm						19 mm	TSMC	.9 V		.8 mm	S-PBGA-B484
10AS032H3F35E2SG	Intel	SoC		BALL	1152	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		GRID ARRAY	BGA1152,34X34,40	.87 V	100 Cel	0 Cel		BOTTOM	3.35 mm	35 mm	ALSO OPERATES AT 0.95V NOMINAL SUPPLY					35 mm	TSMC	.9 V		1 mm	S-PBGA-B1152
163PC01D75	Honeywell Sensing And Control
164PC01D76	Honeywell Sensing And Control
5CSEBA2U23C6N	Intel	SoC
5CSEBA2U23C7SN	Intel	SoC
5CSEBA2U23C8SN	Intel	SoC
5CSEBA4U19C8SN	Intel	SoC
5CSEBA4U19I7N	Intel	SoC
5CSEBA5U19I7LN	Intel	SoC
5CSEBA5U23I7SN	Intel	SoC
5CSEMA6F31A7N	Intel	SoC
66AK2G12ABY100	Texas Instruments	SYSTEM ON CHIP	COMMERCIAL	BALL	625	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA625,25X25,32	.95 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.56 mm	21 mm				30	260	21 mm	CMOS	1 V		.8 mm	S-PBGA-B625	3	e1
A2F200M3F-1FGG256I	Microchip Technology	SoC FPGA															TIN SILVER COPPER							30	250							3
A2F200M3F-CS288I	Microchip Technology	SoC FPGA															TIN LEAD SILVER
AM6234ATGGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM	.89 mm	13 mm						13 mm	CMOS	.75 V		.5 mm	S-PBGA-B425
AM6254ATCGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM	.89 mm	13 mm					250	13 mm	CMOS	.75 V		.5 mm	S-PBGA-B425	3
AM6412BKCGHAALV	Texas Instruments	SYSTEM ON CHIP		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.652 mm	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY					17.2 mm	CMOS	.75 V		.8 mm	S-PBGA-B441
AS5311ASSU	Ams Ag
AT32UC3A4256HHB-C1UR	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	100	VFBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA100,10X10,25		85 Cel	-40 Cel		BOTTOM	1 mm	7 mm						7 mm	CMOS	3.3 V		.65 mm	S-PBGA-B100
ATAES132A-SHEQ-B	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949	SMALL OUTLINE	SOP8,.25	2.5 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	1.75 mm	3.9 mm						4.9 mm	CMOS	3.3 V		1.27 mm	R-PDSO-G8	3
ATAES132A-SHEQ-T	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949	SMALL OUTLINE	SOP8,.25	2.5 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	1.75 mm	3.9 mm						4.9 mm	CMOS	3.3 V		1.27 mm	R-PDSO-G8
ATAES132A-SHER-T	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949	SMALL OUTLINE	SOP8,.25	2.5 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	1.75 mm	3.9 mm					260	4.9 mm	CMOS	3.3 V		1.27 mm	R-PDSO-G8	1
ATECC108A-SSHDA-T	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		SMALL OUTLINE	SOP8,.23	2 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	1.75 mm	3.9 mm				40	260	4.9 mm	CMOS			1.27 mm	R-PDSO-G8	3	e4
ATECC608A-TFLXTLSS	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		SMALL OUTLINE	SOP8,.23	2 V	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	1.75 mm	3.9 mm						4.9 mm	CMOS			1.27 mm	R-PDSO-G8		e4
ATECC608B-MAVDA-S	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2 V	100 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	.6 mm	2 mm				30	260	3 mm	CMOS		I2C	.5 mm	R-PDSO-N8	1	e4
ATECC608B-TFLXTLSS-PROTO	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		SMALL OUTLINE	SOP8,.23	2 V	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	1.75 mm	3.9 mm		0	1 MHz			4.9 mm	CMOS			1.27 mm	R-PDSO-G8		e4

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.