Other Function uPs,uCs & Peripheral ICs

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	Ultraviolet Erasable	Terminal Position	Maximum Seated Height	ROM Words	RAM Words	Width	Additional Features	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	ROM Bits Size	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	ROM Programmability	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code	No. of I/O Lines
ATECC508A-SSHCZ-T	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949			SMALL OUTLINE	SOP8,.25	2 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		DUAL	1.75 mm			3.9 mm					40	260	4.9 mm			CMOS						1.27 mm	R-PDSO-G8	3
ATMXT1189TD-ABI2CVAO	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.47 V	AEC-Q100			FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	3.14 V	105 Cel		-40 Cel			QUAD	1.6 mm			20 mm							20 mm			CMOS		3.3 V				.5 mm	S-PQFP-G144
ATMXT1189TD-ABSPIVAO	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.47 V	AEC-Q100			FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	3.14 V	105 Cel		-40 Cel			QUAD	1.6 mm			20 mm							20 mm			CMOS		3.3 V				.5 mm	S-PQFP-G144
ATMXT1189TD-ATI2CVAO	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.47 V	AEC-Q100			FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	3.14 V	85 Cel		-40 Cel			QUAD	1.6 mm			20 mm							20 mm			CMOS		3.3 V				.5 mm	S-PQFP-G144
ATMXT1189TD-ATRSPIVAO	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.47 V	AEC-Q100			FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	3.14 V	85 Cel		-40 Cel			QUAD	1.6 mm			20 mm							20 mm			CMOS		3.3 V				.5 mm	S-PQFP-G144
ATMXT1189TD-ATSPIVAO	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.47 V	AEC-Q100			FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	3.14 V	85 Cel		-40 Cel			QUAD	1.6 mm			20 mm							20 mm			CMOS		3.3 V				.5 mm	S-PQFP-G144
ATSAM4C16CB-AUT	Microchip Technology	SYSTEM ON CHIP		GULL WING	100	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1.32 V				FLATPACK, THIN PROFILE, FINE PITCH	TQFP100,.63SQ	1.08 V	85 Cel		-40 Cel			QUAD	1.2 mm			14 mm							14 mm			CMOS		1.2 V				.5 mm	S-PQFP-G100
AX-SIP-SFEU-1-01-TX30	Onsemi	MICROPROCESSOR CIRCUIT	OTHER	BUTT	44	HVBCC	RECTANGULAR	UNSPECIFIED	YES	3.6 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2 V	85 Cel		-30 Cel	NICKEL GOLD PALLADIUM		BOTTOM	.996 mm			7 mm					30	260	9 mm			CMOS		3 V					R-XBCC-B44	3
CC2540TF256RHAT	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2 V	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1 mm		8	6 mm					30	260	6 mm		8192	CMOS		3 V			SPI; USART; USB	.5 mm	S-PQCC-N40	3			e4	21
CY8C20237-24LKXI	Infineon Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	16	VQCCN	SQUARE	UNSPECIFIED	YES	5.5 V		8	1.8/5	CHIP CARRIER, VERY THIN PROFILE	LCC16,.12SQ,20	1.71 V	85 Cel	M8C	-40 Cel	NICKEL PALLADIUM GOLD		QUAD	.6 mm	8192		3 mm					30	260	3 mm		1024	CMOS	4 mA	3.3 V	Microcontrollers	FLASH		.5 mm	S-XQCC-N16	3	Not Qualified	25.2 rpm	e4
CY8C3245AXI-158	Infineon Technologies	PSoC	INDUSTRIAL										1.8/5							NICKEL PALLADIUM GOLD	N										40	260		262144 Bits					Other uPs/uCs/Peripheral ICs					3	Not Qualified		e4
CY8C3246LTI-149	Infineon Technologies	PSoC	INDUSTRIAL										1.8/5							NICKEL PALLADIUM GOLD	N										30	260		524288 Bits					Other uPs/uCs/Peripheral ICs					3	Not Qualified		e4
CY8C4247LQI-BL473	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL																	PURE TIN											30	260												3
DLPC900AZPC	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V				GRID ARRAY	BGA516,26X26,40	1.1 V	55 Cel		0 Cel			BOTTOM	2.42 mm			27 mm			16	20 MHz			27 mm			CMOS		1.15 V			I2C; SPI; UART; USB	1 mm	S-PBGA-B516					9
DS3655B+	Analog Devices	MICROPROCESSOR CIRCUIT		BALL	16	BGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V				GRID ARRAY		3 V	85 Cel		-40 Cel			BOTTOM														CMOS		3.3 V					S-PBGA-B16	3
DS3655B+TRL	Analog Devices	MICROPROCESSOR CIRCUIT		BALL	16	BGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V				GRID ARRAY		3 V	85 Cel		-40 Cel			BOTTOM														CMOS		3.3 V					S-PBGA-B16	3
EFR32BG12P432F1024GM48-CR	Silicon Labs	SYSTEM ON CHIP		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	1.62 V	85 Cel		-40 Cel			QUAD	.9 mm			7 mm							7 mm			CMOS		1.8 V				.5 mm	S-XQCC-N48
EFR32MG12P432F1024GM48-BR	Silicon Labs	SYSTEM ON CHIP
EFR32MG12P433F1024IM48-C	Silicon Labs	SYSTEM ON CHIP
HPA01216RHAR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1 mm			6 mm		TIMER(4)			30	260	6 mm		8192	CMOS		3 V				.5 mm	S-PQCC-N40	3			e4	23
HT82K629A(40DIP-A)	Holtek Semiconductor
MAXQ1065GTC+T	Analog Devices	MICROPROCESSOR CIRCUIT																		Matte Tin (Sn) - annealed											30	260												1			e3
MC13211	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BUTT	71	VFLGA	SQUARE	PLASTIC/EPOXY	YES	3.4 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2 V	85 Cel		-40 Cel	NICKEL GOLD		BOTTOM	1 mm			9 mm					30	250	9 mm			CMOS		2.7 V				.5 mm	S-PBGA-B71	3	Not Qualified		e4
MC68302EH16CB1	NXP Semiconductors		COMMERCIAL	GULL WING	132	BQFP	SQUARE	PLASTIC/EPOXY	YES					FLATPACK	SPQFP132,1.1SQ		70 Cel		0 Cel	TIN		QUAD									40	260				CMOS			Other uPs/uCs/Peripheral ICs			.635 mm	S-PQFP-G132	3	Not Qualified		e3
MCIMX286DVM4CR	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	70 Cel		-20 Cel			BOTTOM	1.37 mm			14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V				40	260	14 mm			CMOS		1.45 V				.8 mm	S-PBGA-B289	3
MCIMX512CJM6CR2	NXP Semiconductors	SYSTEM ON CHIP		BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V			1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	.95 V	85 Cel		-20 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm			19 mm					40	260	19 mm			CMOS		1 V	Graphics Processors			.8 mm	S-PBGA-B529	3	Not Qualified		e1
MGM210PB22JIA2	Silicon Labs	SYSTEM ON CHIP
MGM210PB22JIA2R	Silicon Labs	SYSTEM ON CHIP
MIMX8MQ5DVAJZAA	NXP Semiconductors	SoC																														260												3
MPC8247CVRTIEA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	1.575 V			1.5,3.3	GRID ARRAY	BGA516,26X26,40	1.425 V	105 Cel		-40 Cel	TIN SILVER		BOTTOM	2.55 mm			27 mm					30	245	27 mm			CMOS		1.5 V	Other uPs/uCs/Peripheral ICs			1 mm	S-PBGA-B516	3	Not Qualified		e2
MPFS250T-FCSG536E	Microchip Technology	PROGRAMMABLE SoC		BALL	536	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA536,30X30,20	.97 V	100 Cel		0 Cel			BOTTOM	1.4 mm			16 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY						16 mm			CMOS		1 V				.5 mm	S-PBGA-B536
MXD1210EWE-T	Maxim Integrated	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V				SMALL OUTLINE		4.5 V	85 Cel		-40 Cel	TIN LEAD		DUAL	1.75 mm			3.9 mm							9.9 mm			CMOS	.5 mA	5 V				1.27 mm	R-PDSO-G16	1	Not Qualified		e0
MXD1210EWE+T	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V				SMALL OUTLINE		4.5 V	85 Cel		-40 Cel	Matte Tin (Sn) - annealed		DUAL	1.75 mm			3.9 mm							9.9 mm			CMOS	.5 mA	5 V				1.27 mm	R-PDSO-G16	1	Not Qualified		e3
NT3H1101W0FHKH	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	8	QCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V				CHIP CARRIER		1.7 V	95 Cel		-40 Cel			QUAD	.5 mm			1.6 mm						260	1.6 mm			CMOS							S-PQCC-N8	1
NT3H1101W0FTTJ	NXP Semiconductors	MICROPROCESSOR CIRCUIT																													NOT SPECIFIED	260												1
NT3H2211W0FTT	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	3.6 V				SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		1.67 V	105 Cel		-40 Cel			DUAL	1.1 mm			3 mm							3 mm			CMOS		1.8 V				.65 mm	S-PDSO-G8
SDSDQM-016G-B35	Western Digital	MICROPROCESSOR CIRCUIT		NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES					UNCASED CHIP								UPPER					AVAILABLE IN EUROPE, MIDDLE EAST, AFRICA, ASIA-PACIFIC AND LATIN AMERICA				NOT SPECIFIED	NOT SPECIFIED				CMOS							X-XUUC-N
SDSDQM-016G-B35A	Western Digital	MICROPROCESSOR CIRCUIT		NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES					UNCASED CHIP								UPPER					AVAILABLE IN EUROPE, MIDDLE EAST, AFRICA, ASIA-PACIFIC AND LATIN AMERICA				NOT SPECIFIED	NOT SPECIFIED				CMOS							X-XUUC-N
SLB9665VQ20FW563XUMA3	Infineon Technologies	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	3 V	85 Cel		-20 Cel	NICKEL GOLD PALLADIUM SILVER		QUAD	.9 mm			5 mm							5 mm			CMOS		3.3 V				.5 mm	S-PQCC-N32	3
T1024NXN7PQA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V				GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	2.07 mm			23 mm					30	250	23 mm			CMOS		1 V				.8 mm	S-PBGA-B780	3			e1
TEA1791T/N1/G,118	NXP Semiconductors			GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES				20	SMALL OUTLINE	SOP8,.25							DUAL																20 V	Other Microprocessor ICs			1.27 mm	R-PDSO-G8		Not Qualified
TMS320DM365ZCEZ	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	85 Cel		0 Cel	TIN SILVER COPPER		BOTTOM	1.3 mm			13 mm			32		30	260	13 mm			CMOS		1.35 V			I2C; SPI; UART; USB	.65 mm	S-PBGA-B338	3			e1
WP32C2W6NFEI-400B2	Microchip Technology	MICROPROCESSOR CIRCUIT		BALL	896	BGA	SQUARE	PLASTIC/EPOXY	YES					GRID ARRAY	BGA896(UNSPEC)					TIN SILVER COPPER		BOTTOM														CMOS							S-PBGA-B896				e1
XC7Z030-1SB485I	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	485	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA485,22X22,32	.95 V	100 Cel		-40 Cel			BOTTOM	2.44 mm			19 mm							19 mm			CMOS		1 V				.8 mm	S-PBGA-B485
XC7Z030-L2SBG485I	Xilinx	SYSTEM ON CHIP		BALL	485	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA485,22X22,32	.95 V	100 Cel		-40 Cel			BOTTOM	2.44 mm			19 mm							19 mm			CMOS		1 V				.8 mm	S-PBGA-B485
XCVC1902-1MSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V				GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	4 mm			45 mm							45 mm			CMOS		.8 V				.92 mm	S-PBGA-B2197				e1
XCZU11EG-2FFVC1760E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	3.71 mm			42.5 mm					30	245	42.5 mm			CMOS		.85 V				1 mm	R-PBGA-B1760	4			e1
XCZU11EG-3FFVB1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.927 V				GRID ARRAY		.873 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM									30	245				CMOS		.9 V					R-PBGA-B1517	4			e1

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.