Other Function uPs,uCs & Peripheral ICs

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Ultraviolet Erasable	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
CY8C4146AZI-S433	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL															PURE TIN														3
CY8C4745AZI-S413	Infineon Technologies	PSoC																PURE TIN														3
CY8C6245AZI-S3D72	Infineon Technologies	SoC		GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V			FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.7 V	85 Cel	-40 Cel	PURE TIN		QUAD	1.6 mm	14 mm				14 mm	CMOS	1.8 V		.5 mm	S-PQFP-G100	3
CY8CTMA340-48LQI-09	Infineon Technologies	MICROPROCESSOR CIRCUIT
CYAT81688-100AA77	Infineon Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY	YES	1.95 V			FLATPACK		1.71 V	85 Cel	-40 Cel			QUAD			IT ALSO OPERATES IN 3V TO 5.5V ANALOG SUPPLY				CMOS				S-PQFP-G100
CYPD3123-40LQXI	Infineon Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2.7 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD		QUAD	.6 mm	6 mm				6 mm	CMOS	3.3 V		.5 mm	S-XQCC-N40	3		e4
CYTMA445-44LQI33ABA	Cypress Semiconductor	MICROPROCESSOR CIRCUIT		NO LEAD	44	QCCN	SQUARE	UNSPECIFIED	YES				CHIP CARRIER							QUAD							CMOS				S-XQCC-N44
E705204	Elo Touch Solutions	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES				FLATPACK			70 Cel	0 Cel			QUAD			IT ALSO OPERATES AT 5V SUPPLY VOLTAGE	NOT SPECIFIED	NOT SPECIFIED		CMOS	3.3 V			S-PQFP-G64
EFR32FG12P231F1024GM68-CR	Silicon Labs	SYSTEM ON CHIP		NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.62 V	85 Cel	-40 Cel			QUAD	.9 mm	8 mm				8 mm	CMOS	1.8 V		.4 mm	S-XQCC-N68
EFR32FG12P433F1024GM48-CR	Silicon Labs	SYSTEM ON CHIP		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	1.62 V	85 Cel	-40 Cel			QUAD	.9 mm	7 mm				7 mm	CMOS	1.8 V		.5 mm	S-XQCC-N48
EFR32FG13P231F512GM48-D	Silicon Labs	SoC																MATTE TIN						40	260							2
EFR32FG13P233F512GM48-D	Silicon Labs	SoC																MATTE TIN						40	260							2
EFR32FG1P131F256GM32-C0R	Silicon Labs	SoC		NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.85 V	85 Cel	-40 Cel			QUAD	.9 mm	5 mm				5 mm	CMOS	3.3 V		.5 mm	S-XQCC-N32
EFR32FG23A010F512GM48-C	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	85 Cel	-40 Cel			QUAD	.9 mm	6 mm				6 mm	CMOS	3.3 V		.4 mm	S-XQCC-N48
EFR32MG12P432F1024GM48-B	Silicon Labs	SYSTEM ON CHIP
EFR32MG12P432F1024GM68-C	Silicon Labs	SYSTEM ON CHIP
EFR32MG1B132F256GM32-C0	Silicon Labs	SoC		NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.85 V	85 Cel	-40 Cel			QUAD	.9 mm	5 mm				5 mm	CMOS	3.3 V		.5 mm	S-XQCC-N32
EFR32MG1B132F256GM48-C0R	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	1.85 V	85 Cel	-40 Cel			QUAD	.9 mm	7 mm				7 mm	CMOS	3.3 V		.5 mm	S-XQCC-N48
EFR32MG24A010F1024IM48-B	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	125 Cel	-40 Cel			QUAD	.9 mm	6 mm				6 mm	CMOS	3 V		.4 mm	S-XQCC-N48
EFR32MG24A410F1536IM40-B	Silicon Labs	SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	1.71 V	125 Cel	-40 Cel			QUAD	.9 mm	5 mm				5 mm	CMOS	3 V		.4 mm	S-XQCC-N40
EFR32MG24B010F1536IM48-B	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	125 Cel	-40 Cel			QUAD	.9 mm	6 mm				6 mm	CMOS	3 V		.4 mm	S-XQCC-N48
EFR32MG24B020F1024IM48-B	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	125 Cel	-40 Cel			QUAD	.9 mm	6 mm				6 mm	CMOS	3 V		.4 mm	S-XQCC-N48
EFR32MG24B020F1536IM48-B	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	125 Cel	-40 Cel			QUAD	.9 mm	6 mm				6 mm	CMOS	3 V		.4 mm	S-XQCC-N48
FH82RM590ESRKLR	Intel	MICROPROCESSOR CIRCUIT		UNSPECIFIED			RECTANGULAR	UNSPECIFIED	NO											UNSPECIFIED							CMOS				R-XXXS-X
GLH110SR2CA	Intel	MICROPROCESSOR CIRCUIT
MCIMX6DP7CVT8AB	NXP Semiconductors	SoC	INDUSTRIAL	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, HEAT SINK/SLUG	BGA624,25X25,32	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	2.16 mm	21 mm		40	260	21 mm	CMOS	1.4 V		.8 mm	S-PBGA-B624	3		e1
MTFC8GLCDM-1MWT	Micron Technology	MICROPROCESSOR CIRCUIT	OTHER	BALL	153	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.95 V			GRID ARRAY, THIN PROFILE, FINE PITCH		1.65 V	85 Cel	-25 Cel			BOTTOM	1.2 mm	11.5 mm	IT ALSO REQUIRES 2.7V TO 3.6V FOR NAND FLASH POWER SUPPLY	30	260	13 mm	CMOS	1.8 V		.5 mm	R-PBGA-B153
MV64360-B1-BAY1C133	Marvell Technology	MICROPROCESSOR CIRCUIT																									CMOS
P8279-5	Rochester Electronics	MICROPROCESSOR CIRCUIT	COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.5 V			IN-LINE		4.5 V	70 Cel	0 Cel			DUAL	5.08 mm	15.24 mm		NOT SPECIFIED	NOT SPECIFIED	52.26 mm	CMOS	5 V		2.54 mm	R-PDIP-T40
RES3TV360	Intel	MICROPROCESSOR CIRCUIT
SC2200UCL-266	National Semiconductor			BALL	432	BGA	SQUARE	PLASTIC/EPOXY	YES			1.8,3.3	GRID ARRAY	BGA432,31X31,50				TIN LEAD		BOTTOM				30	220		CMOS		Other Microprocessor ICs	1.27 mm	S-PBGA-B432	3	Not Qualified	e0
SSDSC2CT180A4K5	Intel
XA7Z010-1CLG400Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100	1,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32		125 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	N	BOTTOM	1.6 mm	17 mm		30	260	17 mm	CMOS		Other uPs/uCs/Peripheral ICs	.8 mm	S-PBGA-B400	3	Not Qualified	e1
XAZU5EV-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY, FINE PITCH			100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	3.32 mm	23 mm		30	250	23 mm	CMOS	.72 V		.8 mm	S-PBGA-B784	4		e1
XC7Z045-3FFG900E	Xilinx	SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel	0 Cel			BOTTOM	3.24 mm	27 mm				27 mm	CMOS	1 V		1 mm	S-PBGA-B900
XCVC1902-2MSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	4 mm	45 mm				45 mm	CMOS	.8 V		.92 mm	S-PBGA-B2197			e1
XCVP1502-1GSIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1502-3HSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.906 V			GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.854 V	100 Cel	0 Cel			BOTTOM	4.48 mm	50 mm				50 mm	CMOS	.88 V		.92 mm	S-PBGA-B2785
XCZU19EG-1FFVD1760E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM				30	245		CMOS	.85 V			R-PBGA-B1760	4		e1
XCZU27DR-1FFVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM				30	245		CMOS	.85 V			R-PBGA-B1517	4		e1
XCZU27DR-2FFVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER		BOTTOM				30	245		CMOS	.85 V			R-PBGA-B1517	4		e1
XCZU2EG-1SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY			100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM				30	250		CMOS	.85 V			S-PBGA-B784	4		e1
XCZU2EG-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY		.698 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	30	250		CMOS	.72 V			R-PBGA-B784	4		e1
XCZU3EG-2SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM				30	250		CMOS	.85 V			R-PBGA-B784	4		e1
XCZU42DR-1FSVE1156I	Xilinx	PROGRAMMABLE SoC
XCZU47DR-2FFVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM				30	245		CMOS	.85 V			R-PBGA-B1156	4		e1
XCZU48DR-2FFVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM				30	245		CMOS	.85 V			R-PBGA-B1517	4		e1
XCZU65DR-L2FFVE1156I	Xilinx	PROGRAMMABLE SoC

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.