Other Function uPs,uCs & Peripheral ICs

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Screening Level	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	ROM Words	Width	Additional Features	Boundary Scan	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	ROM Programmability	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code
MCIMX6U7CVM08AD	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE			40	260	21 mm		CMOS						.8 mm		S-PBGA-B624	3			e1
XCVM1402-1MSEVFVC1596	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1596	BGA	SQUARE	PLASTIC/EPOXY		YES	.825 V				GRID ARRAY	BGA1596,40X40,36	.775 V	100 Cel		0 Cel		BOTTOM	3.75 mm		37.5 mm						37.5 mm		CMOS		.8 V				.92 mm		S-PBGA-B1596
XQZU11EG-1FFRC1156M	Xilinx	PROGRAMMABLE SoC		BALL	1156	BGA	SQUARE	PLASTIC/EPOXY		YES	.892 V				GRID ARRAY	BGA1156,34X34,40	.808 V	125 Cel		-55 Cel	Tin/Lead (Sn/Pb)	BOTTOM	3.71 mm		35 mm				40	245	35 mm		CMOS		.85 V				1 mm		S-PBGA-B1156	4			e0
5CSEBA2U19C8SN	Intel	SoC
CY8C6347BZI-BLD43	Infineon Technologies	PROGRAMMABLE SoC																			TIN SILVER COPPER																					3			e1
CYB0644ABZI-S2D44	Infineon Technologies	PROGRAMMABLE SoC		BALL	124	VFBGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA124,13X13,25	1.7 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1 mm		9 mm						9 mm		CMOS		1.8 V				.65 mm		S-PBGA-B124	3			e1
DS28E10R+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		GULL WING	3		RECTANGULAR	PLASTIC/EPOXY		YES	3.6 V						2.8 V	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL							30	260			CMOS		3.3 V						R-PDSO-G3	1			e3
MCIMX6D6AVT10AE	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V				GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm		21 mm				40	260	21 mm		CMOS						.8 mm		S-PBGA-B624	3			e1
SA8155P	Qualcomm	SoC		BALL	989	BGA	SQUARE	PLASTIC/EPOXY		YES		AEC-Q100			GRID ARRAY			105 Cel		-40 Cel		BOTTOM											CMOS								S-PBGA-B989
XCZU28DR-L2FFVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.742 V				GRID ARRAY		.698 V	100 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM							30	245			CMOS		.72 V						R-PBGA-B1517	4			e1
XCZU29DR-1FFVF1760I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V				GRID ARRAY		.825 V	100 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM							30	245			CMOS		.85 V						R-PBGA-B1760	4			e1
10AS016E4F27E3SG	Intel	SoC		BALL	672	BGA	SQUARE	PLASTIC/EPOXY		YES	.93 V				GRID ARRAY	BGA672,26X26,40	.87 V	100 Cel		0 Cel		BOTTOM	3.35 mm		27 mm						27 mm		TSMC		.9 V				1 mm		S-PBGA-B672
1SX250LN2F43I2VG	Intel	SoC FPGA
CY8C20667S-24LQXI	Infineon Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V		8	1.8/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	85 Cel	M8C	-40 Cel	PURE TIN	QUAD	.6 mm	32768	6 mm				30	260	6 mm	2048	CMOS	4 mA	3.3 V	Microcontrollers	FLASH		.4 mm		S-XQCC-N48	3	Not Qualified	25.2 rpm
CY8C5568LTI-114T	Cypress Semiconductor
D2-71583-LR	Renesas Electronics	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.9 V				FLATPACK, LOW PROFILE, FINE PITCH		1.7 V	85 Cel		-10 Cel	MATTE TIN	QUAD	1.6 mm		14 mm				30	260	14 mm		CMOS		1.8 V				.4 mm		S-PQFP-G128	3			e3
DH82QM87SR17C	Intel	MICROPROCESSOR CIRCUIT		UNSPECIFIED			SQUARE	UNSPECIFIED														UNSPECIFIED											CMOS
DS28E50Q+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	6	HVSON	SQUARE	PLASTIC/EPOXY		YES	3.63 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.12,37	2.97 V	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	.8 mm		3 mm				30	260	3 mm		CMOS		3.3 V				.95 mm		S-PDSO-N6	1			e3
EFR32FG12P232F1024GM48-CR	Silicon Labs	SYSTEM ON CHIP		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED		YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	1.62 V	85 Cel		-40 Cel		QUAD	.9 mm		7 mm						7 mm		CMOS		1.8 V				.5 mm		S-XQCC-N48
EFR32FG12P431F1024GM68-C	Silicon Labs	SYSTEM ON CHIP		NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED		YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.62 V	85 Cel		-40 Cel		QUAD	.9 mm		8 mm						8 mm		CMOS		1.8 V				.4 mm		S-XQCC-N68
MIMX8MN4CVTIZAA	NXP Semiconductors	SYSTEM ON CHIP																			TIN SILVER								40	260												3			e2
R3920-CFAB-E1T	Onsemi	MICROPROCESSOR CIRCUIT	COMMERCIAL	BUTT	25	BCC	RECTANGULAR	PLASTIC/EPOXY	NO	YES					CHIP CARRIER	LGA25,3X8,27		40 Cel		0 Cel		BOTTOM	1.781 mm		3.18 mm		NO	4.218 MHz	NOT SPECIFIED	NOT SPECIFIED	5.59 mm		CMOS		1.25 V				.686 mm	FIXED POINT	R-PBCC-B25
THGBM5G6A2JBAIR	Toshiba	MICROPROCESSOR CIRCUIT	OTHER	BALL	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	3.6 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.7 V	85 Cel		-25 Cel		BOTTOM	1 mm		11.5 mm						13 mm		CMOS		3.3 V				.5 mm		R-PBGA-B153
XCVP1802-1HSELSVC4072	Xilinx	MICROPROCESSOR CIRCUIT
XCZU15EG-3FFVB1156E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.927 V				GRID ARRAY		.873 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM							30	245			CMOS		.9 V						R-PBGA-B1156	4			e1
XCZU3CG-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	SQUARE	PLASTIC/EPOXY		YES					GRID ARRAY			100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM				IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)			30	250			CMOS		.72 V						S-PBGA-B784	4			e1
XCZU48DR-1FFVE1156E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V				GRID ARRAY		.825 V	100 Cel		0 Cel	TIN SILVER COPPER	BOTTOM							30	245			CMOS		.85 V						R-PBGA-B1156	4			e1
XCZU49DR-1FFVF1760I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V				GRID ARRAY		.825 V	100 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM											CMOS		.85 V						R-PBGA-B1760	4			e1
XCZU6CG-1FFVB1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V				GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM							30	245			CMOS		.85 V						R-PBGA-B1156	4			e1
10AS016E3F27E2SG	Intel	SoC		BALL	672	BGA	SQUARE	PLASTIC/EPOXY		YES	.93 V				GRID ARRAY	BGA672,26X26,40	.87 V	100 Cel		0 Cel		BOTTOM	3.35 mm		27 mm	ALSO OPERATES AT 0.95V NOMINAL SUPPLY					27 mm		TSMC		.9 V				1 mm		S-PBGA-B672
ADSP-SC589KBCZ-4B	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.15 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel		0 Cel		BOTTOM	1.5 mm		19 mm			500 MHz	30	260	19 mm		CMOS		1.1 V			SPI; UART	.8 mm		S-PBGA-B349	3
CY8C21534-24PVXIT	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.25 V				SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	4.75 V	85 Cel		-40 Cel	MATTE TIN	DUAL	2 mm		5.3 mm	ALSO OPERATES AT 2.7V AND 3.3V SUPPLY			20	260	10.2 mm		CMOS		5 V				.65 mm		R-PDSO-G28	3			e3
CY8C24994-24LTXI	Infineon Technologies	PROGRAMMABLE SoC																																								3
CY8C6347BZI-BLD54	Infineon Technologies	PROGRAMMABLE SoC
CYB06447BZI-D54	Infineon Technologies	SoC																			TIN SILVER COPPER																					3			e1
CYPM1211-40LQXI	Infineon Technologies	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	2.7 V	105 Cel		-40 Cel		QUAD	.6 mm		6 mm						6 mm		CMOS		3.3 V				.5 mm		S-XQCC-N40	3
EM341-RTR	Silicon Labs	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	1.9 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.18 V	85 Cel		-40 Cel	MATTE TIN	QUAD	.9 mm		7 mm				40	260	7 mm		CMOS		1.25 V				.5 mm		S-PQCC-N48	2			e3
EY82C621ASRH58	Intel	MICROPROCESSOR CIRCUIT		BALL	1310		RECTANGULAR	PLASTIC/EPOXY		YES												BOTTOM											CMOS								R-PBGA-B1310
MGM220PC22HNA2	Silicon Labs	SoC		NO LEAD	31	XMA	RECTANGULAR	UNSPECIFIED		YES	3.8 V				MICROELECTRONIC ASSEMBLY		1.8 V	105 Cel		-40 Cel		UNSPECIFIED	2.4 mm		12.9 mm	ALSO OPERATES WITH 2.2VMIN SUPPLY IN REGULATION MODE					15 mm		CMOS		3 V				1.2 mm		R-XXMA-N31	3
SI1000-E-GM2	Silicon Labs	MICROCONTROLLER	INDUSTRIAL	BUTT	42	HLGA	RECTANGULAR	UNSPECIFIED		YES	3.6 V				GRID ARRAY, HEAT SINK/SLUG		1.8 V	85 Cel		-40 Cel		BOTTOM	.95 mm		5 mm	ALSO WORKING TWO CELL MODE AT 2.4V NOM. SUPPLY.			40	260	7 mm		CMOS		1.9 V				.5 mm		R-XBGA-B42	2
XCVP1202-2MSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY		YES	.825 V				GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.775 V	110 Cel		0 Cel		BOTTOM	4.48 mm		50 mm						50 mm		CMOS		.8 V				.92 mm		S-PBGA-B2785
XCZU17EG-2FFVC1760E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V				GRID ARRAY		.825 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.71 mm		42.5 mm				30	245	42.5 mm		CMOS		.85 V				1 mm		R-PBGA-B1760	4			e1
XCZU3EG-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.742 V				GRID ARRAY		.698 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM				ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	250			CMOS		.72 V						R-PBGA-B784	4			e1
XCZU47DR-1FFVE1156E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V				GRID ARRAY		.825 V	100 Cel		0 Cel	TIN SILVER COPPER	BOTTOM							30	245			CMOS		.85 V						R-PBGA-B1156	4			e1
XCZU48DR-1FFVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V				GRID ARRAY		.825 V	100 Cel		0 Cel	TIN SILVER COPPER	BOTTOM							30	245			CMOS		.85 V						R-PBGA-B1517	4			e1
XCZU9EG-2FFVC900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V				GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM							30	245			CMOS		.85 V						R-PBGA-B900	4			e1
XQZU28DR-1FFRE1156M	Xilinx	MICROPROCESSOR CIRCUIT	MILITARY	BALL	1156	BGA	SQUARE	PLASTIC/EPOXY		YES	.892 V	MIL-PRF-38535			GRID ARRAY		.808 V	125 Cel		-55 Cel	Tin/Lead (Sn/Pb)	BOTTOM							40	245			CMOS		.85 V						S-PBGA-B1156	4			e0
10AS027E2F27E2LG	Intel	SoC		BALL	672	BGA	SQUARE	PLASTIC/EPOXY		YES	.93 V				GRID ARRAY	BGA672,26X26,40	.87 V	100 Cel		0 Cel		BOTTOM	3.35 mm		27 mm	ALSO OPERATES AT 0.95V NOMINAL SUPPLY					27 mm		TSMC		.9 V				1 mm		S-PBGA-B672

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.