Other Function uPs,uCs & Peripheral ICs

Reset All
Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

EFR32MG24A021F1024IM40-BR

Silicon Labs

SoC

NO LEAD

40

HVQCCN

SQUARE

UNSPECIFIED

YES

3.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.2SQ,16

1.71 V

125 Cel

-40 Cel

QUAD

.9 mm

5 mm

5 mm

CMOS

3 V

.4 mm

S-XQCC-N40

FT245BM

FTDI

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

32

LQFP

SQUARE

PLASTIC/EPOXY

YES

5.25 V

FLATPACK, LOW PROFILE

4.35 V

70 Cel

0 Cel

TIN LEAD

QUAD

1.6 mm

7 mm

250

7 mm

CMOS

5 V

.8 mm

S-PQFP-G32

3

Not Qualified

e0

IP2022/PQ80-120U

Qualcomm

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

80

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

2.7 V

FLATPACK

2.3 V

85 Cel

-40 Cel

QUAD

3.4 mm

14 mm

NOT SPECIFIED

NOT SPECIFIED

20 mm

CMOS

2.5 V

.8 mm

R-PQFP-G80

JN5169-001-M06-2Z

NXP Semiconductors

MICROPROCESSOR CIRCUIT

240

3

LM8330TME/NOPB

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1.98 V

128

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA25,5X5,16

1.62 V

85 Cel

-30 Cel

TIN SILVER COPPER

BOTTOM

20

.675 mm

2.01 mm

30

260

2.01 mm

CMOS

.03 mA

1.8 V

.4 mm

S-PBGA-B25

1

e1

20

LM8330TMX/NOPB

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1.98 V

128

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA25,5X5,16

1.62 V

85 Cel

-30 Cel

TIN SILVER COPPER

BOTTOM

20

.675 mm

2.01 mm

30

260

2.01 mm

CMOS

.03 mA

1.8 V

.4 mm

S-PBGA-B25

1

e1

20

LTC4263IDE

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

14

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE, VERY THIN PROFILE

4.5 V

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

DUAL

.8 mm

3 mm

4 mm

CMOS

5 V

.5 mm

R-PDSO-N14

1

Not Qualified

e0

LTC4263IS

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE

4.5 V

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

DUAL

1.752 mm

3.9 mm

8.649 mm

CMOS

5 V

1.27 mm

R-PDSO-G14

1

Not Qualified

e0

LTC4263IS#TR

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE

4.5 V

85 Cel

-40 Cel

TIN LEAD

DUAL

1.752 mm

3.9 mm

8.649 mm

CMOS

5 V

1.27 mm

R-PDSO-G14

1

Not Qualified

e0

M1A3P1000L-1FGG256

Microchip Technology

SoC

TIN SILVER COPPER

30

250

3

M1A3P600L-1FG144I

Microchip Technology

SoC

M1A3P600L-FG484I

Microchip Technology

SoC

M1A3PE3000L-PQG208

Microchip Technology

SoC

MATTE TIN

30

245

3

MCIMX257DJM4A,557

NXP Semiconductors

SYSTEM ON CHIP

OTHER

BALL

400

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.52 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.38 V

70 Cel

-20 Cel

BOTTOM

1.6 mm

17 mm

ALSO REQUIRES 3.3 V I/O SUPPLY

17 mm

CMOS

1.45 V

.8 mm

S-PBGA-B400

MCIMX286DVM4C

NXP Semiconductors

SYSTEM ON CHIP

COMMERCIAL

BALL

289

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.55 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA289,17X17,32

1.35 V

70 Cel

-20 Cel

BOTTOM

1.37 mm

14 mm

IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V

40

260

14 mm

CMOS

1.45 V

.8 mm

S-PBGA-B289

3

MCIMX6D5EYM10AD

NXP Semiconductors

SYSTEM ON CHIP

OTHER

BALL

624

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.5 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.35 V

105 Cel

-20 Cel

TIN SILVER COPPER

BOTTOM

1.6 mm

21 mm

24MHZ NOMINAL FREQ AVAILABLE

40

260

21 mm

CMOS

.8 mm

S-PBGA-B624

3

e1

MCIMX6D6AVT08AE

NXP Semiconductors

SoC

BALL

624

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.5 V

GRID ARRAY, FINE PITCH

BGA624,25X25,32

1.35 V

125 Cel

-40 Cel

BOTTOM

2.16 mm

21 mm

40

260

21 mm

CMOS

.8 mm

S-PBGA-B624

3

MCIMX6U5DVM10ADR

NXP Semiconductors

SoC

BALL

624

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.5 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA624,25X25,32

1.35 V

95 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.6 mm

21 mm

40

260

21 mm

CMOS

1.4 V

.8 mm

S-PBGA-B624

3

e1

MCIMX6X2EVN10AB

NXP Semiconductors

SoC

COMMERCIAL EXTENDED

BALL

400

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.5 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA400,20X20,32

1.35 V

105 Cel

-20 Cel

TIN SILVER COPPER

BOTTOM

1.53 mm

17 mm

40

260

17 mm

CMOS

.8 mm

S-PBGA-B400

3

e1

MCIMX6X4AVM08AC

NXP Semiconductors

SoC

BALL

529

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.5 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA529,23X23,32

1.275 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.52 mm

19 mm

40

260

19 mm

CMOS

.8 mm

S-PBGA-B529

3

e1

MCIMX6Y2CVM05AAR

NXP Semiconductors

SoC

INDUSTRIAL

BALL

289

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.5 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA289,17X17,32

1.275 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.32 mm

14 mm

40

260

14 mm

CMOS

.8 mm

S-PBGA-B289

3

e1

MCP25025-I/SL

Microchip Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

TS 16949

8

3/5

SMALL OUTLINE

SOP14,.24

2.7 V

85 Cel

-40 Cel

Matte Tin (Sn)

DUAL

1.75 mm

3.9 mm

8.65 mm

CMOS

5 V

Parallel IO Port

1.27 mm

R-PDSO-G14

1

Not Qualified

e3

MCP25025T-I/SL

Microchip Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

TS 16949

8

3/5

SMALL OUTLINE

SOP14,.24

2.7 V

85 Cel

-40 Cel

Matte Tin (Sn)

DUAL

1.75 mm

3.9 mm

8.65 mm

CMOS

5 V

Parallel IO Port

1.27 mm

R-PDSO-G14

1

Not Qualified

e3

MIMX8MN3DVPIZAA

NXP Semiconductors

SoC

OTHER

BALL

306

TFBGA

SQUARE

PLASTIC/EPOXY

YES

1 V

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA306,21X21,20

.9 V

95 Cel

0 Cel

BOTTOM

1.01 mm

11 mm

40

260

11 mm

CMOS

.95 V

.5 mm

S-PBGA-B306

3

MIMX8QX2AVLFZAC

NXP Semiconductors

SYSTEM ON CHIP

AUTOMOTIVE

BALL

609

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

GRID ARRAY, FINE PITCH

BGA609,35X35,32

1.05 V

125 Cel

-40 Cel

BOTTOM

2.52 mm

21 mm

40

260

21 mm

CMOS

1.1 V

.8 mm

S-PBGA-B609

3

MIMXRT106ACVL5B

NXP Semiconductors

SoC

BALL

196

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA196,14X14,25

1.15 V

105 Cel

-40 Cel

BOTTOM

1.43 mm

10 mm

40

260

10 mm

CMOS

.65 mm

S-PBGA-B196

3

MPFS095TL-FCSG536E

Microchip Technology

PROGRAMMABLE SoC

BALL

536

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.03 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA536,30X30,20

.97 V

100 Cel

0 Cel

BOTTOM

1.4 mm

16 mm

ALSO OPERATES AT 1.05V NOMINAL SUPPLY

16 mm

CMOS

1 V

.5 mm

S-PBGA-B536

MPFS095TS-FCSG536I

Microchip Technology

PROGRAMMABLE SoC

BALL

536

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.03 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA536,30X30,20

.97 V

100 Cel

-40 Cel

BOTTOM

1.4 mm

16 mm

ALSO OPERATES AT 1.05V NOMINAL SUPPLY

16 mm

CMOS

1 V

.5 mm

S-PBGA-B536

MPFS250TL-FCG1152I

Microchip Technology

SoC FPGA

BALL

1152

RECTANGULAR

PLASTIC/EPOXY

YES

100 Cel

-40 Cel

BOTTOM

CMOS

R-PBGA-B1152

MPFS250TLS-FCG1152I

Microchip Technology

PROGRAMMABLE SoC

BALL

1152

BGA

SQUARE

PLASTIC/EPOXY

YES

1.03 V

GRID ARRAY

BGA1152,34X34,40

.97 V

100 Cel

-40 Cel

BOTTOM

2.99 mm

35 mm

ALSO OPERATES AT 1.05V NOMINAL SUPPLY

35 mm

CMOS

1 V

1 mm

S-PBGA-B1152

MSP430F6747AIPZ

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

0

NO

16

FLATPACK, LOW PROFILE, FINE PITCH

2.4 V

85 Cel

MSP430

-40 Cel

NICKEL PALLADIUM GOLD

YES

QUAD

YES

1.6 mm

262144

32

14 mm

0

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

0

.032768 MHz

30

260

14 mm

32768

CMOS

6-Ch 10-Bit

3.3 V

YES

I2C(2), IRDA(4), SPI(6), UART(4)

FLASH

I2C; SPI; UART

.5 mm

S-PQFP-G100

3

25 rpm

e4

8

62

MSP430F6767IPZ

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

16

2/3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP100,.63SQ,20

1.8 V

85 Cel

MSP430

-40 Cel

NICKEL PALLADIUM GOLD

YES

QUAD

1.6 mm

262144

32

14 mm

0

25 MHz

30

260

14 mm

32768

CMOS

11.75 mA

3.3 V

Microcontrollers

FLASH

I2C; SPI; UART

.5 mm

S-PQFP-G100

3

Not Qualified

25 rpm

e4

MSP430F67791IPEUR

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

128

LFQFP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

16

2/3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP128,.63X.87,20

1.8 V

85 Cel

MSP430

-40 Cel

NICKEL PALLADIUM GOLD

YES

QUAD

1.6 mm

524288

32

14 mm

0

30

260

20 mm

32768

CMOS

11.75 mA

3.3 V

Microcontrollers

FLASH

I2C; SPI; UART

.5 mm

R-PQFP-G128

3

Not Qualified

25 rpm

e4

MTCH6102-I/SS

Microchip Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

28

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

TS 16949

SMALL OUTLINE, SHRINK PITCH

SSOP28,.3

1.8 V

85 Cel

-40 Cel

MATTE TIN

DUAL

2 mm

5.3 mm

40

260

10.2 mm

CMOS

3 V

.65 mm

R-PDSO-G28

2

e3

MTFC64GJDDN-4MIT

Micron Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

169

LFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1.95 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.65 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

14 mm

IT ALSO OPERATES AT 3.3 VOLTS

18 mm

CMOS

1.8 V

.5 mm

R-PBGA-B169

e1

MTFC8GLDDQ-4MIT

Micron Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

100

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

GRID ARRAY, LOW PROFILE

2.7 V

85 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

1.4 mm

14 mm

30

260

18 mm

CMOS

3.3 V

1 mm

R-PBGA-B100

e1

OMAPL138BZWTRB

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.35 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.25 V

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

16 mm

IT ASLO OPERATES IN 0.95V MINIMUM SUPPLY

30

260

16 mm

CMOS

1.3 V

.8 mm

S-PBGA-B361

3

e1

OMAPL138CZWTA3RW

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.32 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.14 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

16 mm

30

260

16 mm

CMOS

1.2 V

.8 mm

S-PBGA-B361

3

e1

R3910-CFAB-E1T

Onsemi

MICROPROCESSOR CIRCUIT

COMMERCIAL

NO LEAD

25

RECTANGULAR

UNSPECIFIED

YES

MICROELECTRONIC ASSEMBLY

40 Cel

0 Cel

UNSPECIFIED

1.525 mm

3.81 mm

SEATED HGT-NOM

30

260

5.59 mm

CMOS

1.25 V

R-XXMA-N25

3

S32G233AABK0VUCR

NXP Semiconductors

SoC

INDUSTRIAL

40

260

3

SE051A2HQ1/Z01XEZ

NXP Semiconductors

CRYPTOGRAPHIC AUTHENTICATOR

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC20,.12SQ,16

1.62 V

105 Cel

-40 Cel

QUAD

.33 mm

3 mm

260

3 mm

CMOS

1.8 V

.4 mm

S-XQCC-N20

1

SI1002-E-GM2

Silicon Labs

MICROCONTROLLER

INDUSTRIAL

BUTT

42

HLGA

RECTANGULAR

UNSPECIFIED

YES

3.6 V

GRID ARRAY, HEAT SINK/SLUG

1.8 V

85 Cel

-40 Cel

BOTTOM

.95 mm

5 mm

ALSO WORKING TWO CELL MODE AT 2.4V NOM. SUPPLY.

NOT SPECIFIED

NOT SPECIFIED

7 mm

CMOS

1.9 V

.5 mm

R-XBGA-B42

ST33GTPMA020FAE6

STMicroelectronics

CRYPTOGRAPHIC AUTHENTICATOR

INDUSTRIAL

GULL WING

20

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

AEC-Q100

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP20,.25

105 Cel

-40 Cel

DUAL

1.2 mm

4.4 mm

also operates with 3.3v and 5v nominal

6.5 mm

CMOS

1.8 V

.65 mm

R-PDSO-G20

1

ST33GTPMII2C

STMicroelectronics

MICROPROCESSOR CIRCUIT

TB6560HQ

Marktech Optoelectronics

TDA8035HN/C1,157

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

5.5 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

2.7 V

85 Cel

-25 Cel

QUAD

1 mm

5 mm

260

5 mm

CMOS

220 mA

3.3 V

Other Microprocessor ICs

.5 mm

S-PQCC-N32

1

Not Qualified

TMS320DM355DZCE216

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

337

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA337,19X19,25

1.235 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

8192

13 mm

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

32

30

260

13 mm

CMOS

1.3 V

Digital Signal Processors

I2C; SPI; UART; USB

.65 mm

FIXED POINT

S-PBGA-B337

3

Not Qualified

e1

TMS320DM369ZCEDF

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

338

LFBGA

SQUARE

PLASTIC/EPOXY

YES

32

1.35,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA338,19X19,25

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

32768

13 mm

32

30

260

13 mm

CMOS

Digital Signal Processors

ETHERNET; I2C; SPI; UART; USB

.65 mm

FIXED POINT

S-PBGA-B338

3

Not Qualified

e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.