Other Function uPs,uCs & Peripheral ICs

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Ultraviolet Erasable	Terminal Position	Maximum Seated Height	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	ROM Bits Size	RAM Bytes	Technology	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
ATECC608B-TFLXTLSU	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2 V	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		DUAL	.6 mm	2 mm		0	1 MHz			3 mm			CMOS				.5 mm	R-PDSO-N8			e4
ATMXT640UD-CCU001	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		BALL	88	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.47 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA88,10X10,20	3.14 V	85 Cel	-40 Cel			BOTTOM	.6 mm	6 mm						6 mm			CMOS	3.3 V			.5 mm	S-PBGA-B88
ATSAM4C16CB-AUTR	Microchip Technology	SYSTEM ON CHIP		GULL WING	100	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1.32 V			FLATPACK, THIN PROFILE, FINE PITCH	TQFP100,.63SQ	1.08 V	85 Cel	-40 Cel			QUAD	1.2 mm	14 mm						14 mm			CMOS	1.2 V			.5 mm	S-PQFP-G100
ATTPM20P-H6MA1-10	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES		TS 16949		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20		85 Cel	-40 Cel			DUAL	.6 mm	2 mm						3 mm			CMOS	3.3 V		SPI	.5 mm	R-PDSO-N8
ATTPM20P-H6MA1-10-B	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES		TS 16949		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20		85 Cel	-40 Cel			DUAL	.6 mm	2 mm						3 mm			CMOS	3.3 V		SPI	.5 mm	R-PDSO-N8
ATWINC1500-MR210UB1976	Microchip Technology	MICROPROCESSOR CIRCUIT		NO LEAD	28	XMA	RECTANGULAR	UNSPECIFIED	YES	4.2 V			MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel			UNSPECIFIED	2.113 mm	14.73 mm						21.72 mm			CMOS	3.3 V				R-XXMA-N28
ATWINC1510-MR210PB1944	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	3.6 V			MICROELECTRONIC ASSEMBLY		2.7 V	85 Cel	-40 Cel			UNSPECIFIED	2.113 mm	14.73 mm						21.72 mm			CMOS	3.3 V				R-XXMA-N28
ATWINC1510-MR210PB1954	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	3.6 V			MICROELECTRONIC ASSEMBLY		2.7 V	85 Cel	-40 Cel			UNSPECIFIED	2.113 mm	14.73 mm						21.72 mm			CMOS	3.3 V				R-XXMA-N28
ATWINC1510-MR210PB1963	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	4.2 V			MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel			UNSPECIFIED	2.113 mm	14.73 mm	SEATED HGT-NOM					21.72 mm			CMOS	3.6 V				R-XXMA-N28
ATWINC1510-MR210PB1963-T	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	3.6 V	TS 16949		MICROELECTRONIC ASSEMBLY		2.7 V	85 Cel	-40 Cel			UNSPECIFIED											CMOS	3.3 V		I2C, SPI		R-XXMA-N28
ATWINC1510-MR210PB1976	Microchip Technology	MICROPROCESSOR CIRCUIT		NO LEAD	28	XMA	RECTANGULAR	UNSPECIFIED	YES	4.2 V			MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel			UNSPECIFIED	2.113 mm	14.73 mm						21.72 mm			CMOS	3.3 V				R-XXMA-N28
ATWINC1510B-MU-Y	Microchip Technology	NETWORK CONTROLLER	INDUSTRIAL	NO LEAD	40	HQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	2.7 V	85 Cel	-40 Cel	MATTE TIN		QUAD	1 mm	5 mm			48 MHz			5 mm			CMOS	3.3 V			.4 mm	S-PQCC-N40			e3
ATWINC3400-MR210UA122	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	36		RECTANGULAR	UNSPECIFIED	YES	4.2 V			MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel			UNSPECIFIED	2.087 mm	14.732 mm	SEATED HGT-CALCULATED			NOT SPECIFIED	NOT SPECIFIED	22.428 mm			CMOS	3.6 V			1.204 mm	R-XXMA-N36
AWR1642ABIGABLQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	161	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V	AEC-Q100		GRID ARRAY, THIN PROFILE, FINE PITCH		1.14 V	125 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.17 mm	10.4 mm				30	260	10.4 mm		1572864	CMOS	1.2 V			.65 mm	S-PBGA-B161	3		e1
BGM13P32F512GE-V2	Silicon Labs	SoC
BGM13P32F512GE-V2R	Silicon Labs	SoC
C8051F061-GQ	Silicon Labs	SoC	INDUSTRIAL															MATTE TIN								40	260										3	Not Qualified	e3
CP2130-F01-GM	Silicon Labs	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3 V	85 Cel	-40 Cel			QUAD	.8 mm	4 mm				NOT SPECIFIED	NOT SPECIFIED	4 mm			CMOS	3.3 V			.5 mm	S-XQCC-N24
CY8C3246AXI-131	Infineon Technologies	PSoC	INDUSTRIAL									1.8/5						NICKEL PALLADIUM GOLD	N							40	260		524288 Bits				Other uPs/uCs/Peripheral ICs				3	Not Qualified	e4
CY8C3246AXI-138	Infineon Technologies	PSoC	INDUSTRIAL									1.8/5						NICKEL PALLADIUM GOLD	N							40	260		524288 Bits				Other uPs/uCs/Peripheral ICs				3	Not Qualified	e4
CY8C4124LQI-S432	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL															PURE TIN																			3
CY8C4124LQI-S432T	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL															PURE TIN																			3
CY8C4146AZI-S423	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL															PURE TIN																			3
CY8C5266FNI-LP205T	Infineon Technologies	PSoC	INDUSTRIAL															NICKEL PALLADIUM GOLD																			1		e4
CY8C6136BZI-F14	Infineon Technologies	PROGRAMMABLE SoC		BALL	124	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA124,13X13,25	1.7 V	85 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1 mm	9 mm						9 mm			CMOS	1.8 V			.65 mm	S-PBGA-B124	3		e1
CY8C6144AZI-S4F93	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V			FLATPACK, LOW PROFILE, FINE PITCH	QFP80,.55SQ,20	1.7 V	85 Cel	-40 Cel			QUAD	1.6 mm	12 mm						12 mm			CMOS	1.8 V			.5 mm	S-PQFP-G80	3
CY8C6144LQI-S4F62	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.7 V	85 Cel	-40 Cel			QUAD	1 mm	8 mm						8 mm			CMOS	1.8 V			.4 mm	S-XQCC-N68	3
CY8C6244AZI-S4D62	Infineon Technologies	SoC		GULL WING	64	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	HQFP64,.47SQ,20	1.7 V	85 Cel	-40 Cel			QUAD	1.6 mm	10 mm						10 mm			CMOS	1.8 V			.5 mm	S-PQFP-G64	3
CY8C6244AZI-S4D82	Infineon Technologies	SoC		GULL WING	64	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	HQFP64,.47SQ,20	1.7 V	85 Cel	-40 Cel			QUAD	1.6 mm	10 mm						10 mm			CMOS	1.8 V			.5 mm	S-PQFP-G64	3
CY8C624AAZI-S2D14	Infineon Technologies	PROGRAMMABLE SoC																PURE TIN																			3
CY8C6336BZI-BLF03	Infineon Technologies	PROGRAMMABLE SoC																TIN SILVER COPPER																			3		e1
CYB06445LQI-S3D42	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.7 V	85 Cel	-40 Cel	PURE TIN		QUAD	1 mm	8 mm						8 mm			CMOS	1.8 V			.4 mm	S-XQCC-N68	3
CYPD3125-40LQXI	Infineon Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2.7 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD		QUAD	.6 mm	6 mm						6 mm			CMOS	3.3 V			.5 mm	S-XQCC-N40	3		e4
CYUSB3017-BZXC	Infineon Technologies	MICROPROCESSOR CIRCUIT																TIN SILVER COPPER																			3		e1
CYW20721B2KUMLG	Infineon Technologies	SYSTEM ON CHIP		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	3.63 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	1.76 V	85 Cel	-30 Cel			QUAD	.6 mm	5 mm						5 mm			CMOS	3 V			.4 mm	S-XQCC-N40
D2-74083-LR	Renesas Electronics	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.9 V			FLATPACK, LOW PROFILE, FINE PITCH		1.7 V	85 Cel	-10 Cel	MATTE TIN		QUAD	1.6 mm	14 mm				30	260	14 mm			CMOS	1.8 V			.4 mm	S-PQFP-G128	3		e3
DA14531-01000OG2	Renesas Electronics	SoC
DM6446ANB6C2127VC	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm	16 mm				30	260	16 mm			CMOS	1.2 V			.8 mm	S-PBGA-B361	3		e1
DM6446AZWTKEDACOM	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm	16 mm				30	260	16 mm			CMOS	1.2 V			.8 mm	S-PBGA-B361	3		e1
DM6446GB6C0121MV	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm	16 mm				30	260	16 mm			CMOS	1.2 V			.8 mm	S-PBGA-B361	3		e1
DM8603EP	Davicom Semiconductor
DS2465P+	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	C BEND	6	SOC	RECTANGULAR	PLASTIC/EPOXY	YES	3.63 V			SMALL OUTLINE		2.97 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed		DUAL	1.5 mm	3.76 mm				30	260	3.94 mm			CMOS	3.3 V			1.27 mm	R-PDSO-C6	1		e3
DS28C40G/V+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	10	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	3.63 V	AEC-Q100		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC10,.16,20	2.97 V	125 Cel	-40 Cel	Matte Tin (Sn) - annealed		DUAL	.8 mm	3 mm				30	260	4 mm			CMOS	3.3 V			.5 mm	R-PDSO-N10	1		e3
EFR32MG12P433F1024GM48-CR	Silicon Labs	SYSTEM ON CHIP
EFR32MG13P632F512GM32-D	Silicon Labs	SYSTEM ON CHIP		NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.8 V	85 Cel	-40 Cel			QUAD	.9 mm	5 mm						5 mm			CMOS	3.3 V			.5 mm	S-XQCC-N32
EFR32MG13P632F512GM48-DR	Silicon Labs	SYSTEM ON CHIP		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	1.8 V	85 Cel	-40 Cel			QUAD	.9 mm	7 mm						7 mm			CMOS	3.3 V			.5 mm	S-XQCC-N48
EFR32MG14P733F256IM48-BR	Silicon Labs	SYSTEM ON CHIP
EFR32MG21B020F1024IM32-B	Silicon Labs	SYSTEM ON CHIP	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.16SQ,16	1.71 V	125 Cel	-40 Cel			QUAD	.9 mm	4 mm						4 mm			CMOS	3 V			.4 mm	S-XQCC-N32

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.