Other Function uPs,uCs & Peripheral ICs

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	No. of Bits	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code
MTFC16GJDDQ-4MIT	Micron Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	100	LBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V				GRID ARRAY, LOW PROFILE		2.7 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	14 mm				30	260	18 mm	CMOS	3.3 V			1 mm	R-PBGA-B100				e1
OMAPL138EZCE4	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	13 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY	32	50 MHz	30	260	13 mm	CMOS	1.3 V		I2C; SPI; UART; USB	.65 mm	S-PBGA-B361	3		456 rpm	e1
QCA7000-AL3B-R	Qualcomm	MICROPROCESSOR CIRCUIT
XCZU19EG-2FFVC1760I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM						30	245		CMOS	.85 V				R-PBGA-B1760	4			e1
XCZU1CG-L1UBVA494I	Xilinx	MICROPROCESSOR CIRCUIT																	TIN SILVER BISMUTH COPPER NICKEL							30	245								4
XCZU27DR-1FSVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM						30	240		CMOS	.85 V				R-PBGA-B1517	4			e1
XCZU27DR-L2FFVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V				GRID ARRAY		.698 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM						30	245		CMOS	.72 V				R-PBGA-B1517	4			e1
XCZU27DR-L2FSVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V				GRID ARRAY		.698 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM						30	240		CMOS	.72 V				R-PBGA-B1156	4			e1
XCZU4EG-1FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM						30	245		CMOS	.85 V				R-PBGA-B900	4			e1
XCZU7CG-1FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM						30	245		CMOS	.85 V				R-PBGA-B900	4			e1
XCZU7CG-1FFVC1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM						30	245		CMOS	.85 V				R-PBGA-B1156	4			e1
XCZU7CG-1FFVF1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM						30	245		CMOS	.85 V				R-PBGA-B1517	4			e1
XCZU7CG-2FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	2.97 mm	31 mm				30	245	31 mm	CMOS	.85 V			1 mm	R-PBGA-B900	4			e1
XQ7Z100-2RF900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES					GRID ARRAY			100 Cel	-40 Cel		BOTTOM	3.44 mm	31 mm				NOT SPECIFIED	NOT SPECIFIED	31 mm	CMOS				1 mm	S-PBGA-B900
107E	Cts
1SX085HN3F43E1VG	Intel	MICROPROCESSOR CIRCUIT
1SX250HN1F43I2VG	Intel	SoC FPGA
1SX280HN1F43E1VG	Intel	SoC FPGA
1SX280HN3F43I3VG	Intel	SoC FPGA
453-00068C	Laird Technologies	SoC
5CSEBA2U19C6N	Intel	SoC
5CSEBA2U19C7SN	Intel	SoC
5CSEMA5F31C6N	Intel	SoC
5CSEMA6U23C6N	Intel	SoC
80312	Intel	MICROPROCESSOR CIRCUIT		BALL	540	BGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V				GRID ARRAY		3 V				BOTTOM	4.1 mm	42.5 mm						42.5 mm	CMOS	3.3 V			1.27 mm	S-PBGA-B540		Not Qualified
A2F200M3F-FG484	Microchip Technology	SoC FPGA		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1.575 V				GRID ARRAY		1.425 V	85 Cel	0 Cel	TIN LEAD	BOTTOM									CMOS	1.5 V				S-PBGA-B484	3
AGIB027R31B1E1VAA	Intel	SoC FPGA
ATSAMHA1E14A-MBT-BVAO	Microchip Technology	SoC	INDUSTRIAL
ATWINC1500-MR210UB	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	4.2 V				MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel	MATTE TIN	UNSPECIFIED	2.113 mm	14.73 mm	SEATED HGT-NOM					21.72 mm	CMOS	3.6 V				R-XXMA-N28				e3
AX88760LF	Asix Electronics
AX88772BLF	Asix Electronics
CY8C4045LQA-S411	Infineon Technologies	PSoC																	NICKEL PALLADIUM GOLD																3			e4
CY8C4147AZE-S475	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100			FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	125 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm						10 mm	CMOS	3.3 V			.5 mm	S-PQFP-G64	3
EFR32FG12P431F1024GM68-CR	Silicon Labs	SYSTEM ON CHIP		NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.62 V	85 Cel	-40 Cel		QUAD	.9 mm	8 mm				30	260	8 mm	CMOS	1.8 V			.4 mm	S-XQCC-N68	3
M1A3P600L-1FGG484	Microchip Technology	SoC																	TIN SILVER COPPER							30	250								3
M1A3PE3000L-1PQG208	Microchip Technology	SoC																	MATTE TIN							30	245								3
MCIMX233DJM4C	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	169	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA169,13X13,32	1 V	70 Cel	-10 Cel	TIN SILVER COPPER	BOTTOM	1.43 mm	11 mm				40	260	11 mm	CMOS	1.35 V			.8 mm	S-PBGA-B169	3			e1
MCIMX286DVM4BR	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	70 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.37 mm	14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V			40	260	14 mm	CMOS	1.45 V			.8 mm	S-PBGA-B289	3			e1
MCIMX6S5DVM10ABR	NXP Semiconductors	SoC	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			1.05/1.5	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm				40	260	21 mm	CMOS		Graphics Processors		.8 mm	S-PBGA-B624	3	Not Qualified		e1
MCIMX6X4EVM10AB	NXP Semiconductors	SoC	OTHER	BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.52 mm	19 mm				40	260	19 mm	CMOS				.8 mm	S-PBGA-B529	3			e1
MCIMX6Y2CVK08AB	NXP Semiconductors	SoC		BALL	272	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA272,17X17,20	1.325 V	105 Cel	-40 Cel		BOTTOM	1.23 mm	9 mm				40	260	9 mm	CMOS				.5 mm	S-PBGA-B272	3
MCP25055-I/P	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.5 V	TS 16949	8	3/5	IN-LINE	DIP14,.3	2.7 V	85 Cel	-40 Cel	MATTE TIN	DUAL	4.318 mm	7.62 mm						19.05 mm	CMOS	5 V	Parallel IO Port		2.54 mm	R-PDIP-T14		Not Qualified		e3
MCP25055-I/SL	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949	8	3/5	SMALL OUTLINE	SOP14,.24	2.7 V	85 Cel	-40 Cel	Matte Tin (Sn)	DUAL	1.75 mm	3.9 mm						8.65 mm	CMOS	5 V	Parallel IO Port		1.27 mm	R-PDSO-G14	1	Not Qualified		e3
MCP25055T-I/SL	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949	8	3/5	SMALL OUTLINE	SOP14,.24	2.7 V	85 Cel	-40 Cel	Matte Tin (Sn)	DUAL	1.75 mm	3.9 mm						8.65 mm	CMOS	5 V	Parallel IO Port		1.27 mm	R-PDSO-G14	1	Not Qualified		e3
MKW21Z512VHT4	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	QCCN	SQUARE	UNSPECIFIED	YES	3.6 V				CHIP CARRIER		1.71 V	105 Cel	-40 Cel	NICKEL GOLD	QUAD						40	260		CMOS	3.3 V				S-XQCC-N48	3			e4
MPFS095T-1FCVG784I	Microchip Technology	PROGRAMMABLE SoC		BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V				GRID ARRAY, FINE PITCH	BGA784,28X28,32	.97 V	100 Cel	-40 Cel		BOTTOM	2.92 mm	23 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY					23 mm	CMOS	1 V			.8 mm	S-PBGA-B784
RF430FRL154HCRGER	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	24	VQCCN	SQUARE	PLASTIC/EPOXY	YES					CHIP CARRIER, VERY THIN PROFILE			70 Cel	0 Cel	NICKEL PALLADIUM GOLD	QUAD	1 mm	4 mm	IT REQUIRES 1.45V TO 1.65V LOW SUPPLY VOLTAGE	0		30	260	4 mm	CMOS			I2C; SPI	.5 mm	S-PQCC-N24	2			e4
SLE952500000XTSA1	Infineon Technologies	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	6	BCC	RECTANGULAR	PLASTIC/EPOXY	YES	1.6 V				GRID ARRAY	SOLCC6,.04,20	1.35 V	85 Cel	-40 Cel		BOTTOM	.4 mm	1.1 mm	ALSO OPERATES WITH 3.8V NOM SUPPLY					1.5 mm	CMOS	1.45 V			.5 mm	R-PBCC-N6	1

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.