Other Function uPs,uCs & Peripheral ICs

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Ultraviolet Erasable	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
XCZU6EG-1FFVC900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM				30	245		CMOS		.85 V			R-PBGA-B900	4		e1
XCZU9CG-2FFVB1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM				30	245		CMOS		.85 V			R-PBGA-B1156	4		e1
XCZU9EG-1FFVB1156E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM				30	245		CMOS		.85 V			R-PBGA-B1156	4		e1
XCZU9EG-1FFVC900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM				30	245		CMOS		.85 V			R-PBGA-B900	4		e1
XQ7Z020-1CL484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES		1,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32		100 Cel	-40 Cel	TIN LEAD	N	BOTTOM	1.6 mm	19 mm		30	225	19 mm	CMOS			Other uPs/uCs/Peripheral ICs	.8 mm	S-PBGA-B484	3	Not Qualified	e0
XQ7Z020-1CL484Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES		1,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32		125 Cel	-40 Cel	TIN LEAD	N	BOTTOM	1.6 mm	19 mm		30	225	19 mm	CMOS			Other uPs/uCs/Peripheral ICs	.8 mm	S-PBGA-B484	3	Not Qualified	e0
XQZU3EG-1SFRA484M	Xilinx	PROGRAMMABLE SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.892 V		GRID ARRAY, FINE PITCH	BGA484,22X22,32	.808 V	125 Cel	-55 Cel	Tin/Lead (Sn/Pb)		BOTTOM	3.35 mm	19 mm		40	245	19 mm	CMOS		.85 V		.8 mm	S-PBGA-B484	4		e0
10AS016E4F27E3LG	Intel	SoC		BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		GRID ARRAY	BGA672,26X26,40	.87 V	100 Cel	0 Cel			BOTTOM	3.35 mm	27 mm				27 mm	TSMC		.9 V		1 mm	S-PBGA-B672
10AS027H2F34E2LG	Intel	SoC		BALL	1152	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		GRID ARRAY	BGA1152,34X34,40	.87 V	100 Cel	0 Cel			BOTTOM	3.35 mm	35 mm	ALSO OPERATES AT 0.95V NOMINAL SUPPLY			35 mm	TSMC		.9 V		1 mm	S-PBGA-B1152
10AS032E4F29E3SG	Intel	SoC		BALL	780	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		GRID ARRAY	BGA780,28X28,40	.87 V	100 Cel	0 Cel			BOTTOM	3.35 mm	29 mm				29 mm	TSMC		.9 V		1 mm	S-PBGA-B780
10AS057K2F40E1HG	Intel	SoC		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY	BGA1517,39X39,40		100 Cel	0 Cel			BOTTOM	3.5 mm	40 mm				40 mm	TSMC				1 mm	S-PBGA-B1517
10AS066H4F34E3SG	Intel	SoC		BALL	1152	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		GRID ARRAY	BGA1152,34X34,40	.87 V	100 Cel	0 Cel			BOTTOM	3.35 mm	35 mm				35 mm	TSMC		.9 V		1 mm	S-PBGA-B1152
164PC01D37	Honeywell Sensing And Control
1SX165HN2F43E2VG	Intel	SoC FPGA
1SX250LN3F43I2VG	Intel	SoC FPGA
1SX280HN1F43I1VGAS	Intel	MICROPROCESSOR CIRCUIT
1SX280LN3F43E2VGS2	Intel	MICROPROCESSOR CIRCUIT
5CSEBA2U19A7N	Intel	SoC
5CSEBA2U19C8N	Intel	SoC
5CSEBA4U23A7N	Intel	SoC
5CSEBA4U23C7N	Intel	SoC
5CSEBA4U23C8N	Intel	SoC
5CSEBA5U19I7SN	Intel	SoC
5CSEBA5U23A7N	Intel	SoC
5CSEMA5U23C6N	Intel	SoC
5CSEMA5U23I7N	Intel	SoC
5CSTFD5D5F31I7N	Intel	SoC
5CSXFC4C6U23C7N	Intel	SoC
5CSXFC5C6U23I7N	Intel	SoC
5CSXFC5D6F31C8N	Intel	SoC
5CSXFC5D6F31I7N	Intel	SoC
5CSXFC6D6F31A7N	Intel	SoC
88AP270MA2-BGO2C624	Marvell Technology	SoC		BALL			SQUARE	PLASTIC/EPOXY	YES	3.3 V	1.8/3.3			1.8 V	85 Cel	-25 Cel	TIN SILVER COPPER		BOTTOM							CMOS			Graphics Processors				Not Qualified	e8
88AP270MA2-BHE1E416	Marvell Technology	SoC	INDUSTRIAL	BALL			SQUARE	PLASTIC/EPOXY	YES	3.3 V	1.8/3.3			1.8 V			TIN SILVER COPPER		BOTTOM							CMOS			Graphics Processors				Not Qualified	e1
88AP310-B1-BGK2C806-TN02	Marvell Technology	SoC		BALL			SQUARE	PLASTIC/EPOXY	YES	3.3 V				1.8 V	85 Cel	-25 Cel			BOTTOM							CMOS
88AP320-C0-BGR2C624-TN20	Marvell Technology	SoC	INDUSTRIAL	BALL			SQUARE	PLASTIC/EPOXY	YES	3.3 V				1.8 V	85 Cel	-25 Cel			BOTTOM							CMOS
88AP320-C0-BGR2C624-TN21	Marvell Technology	SoC	INDUSTRIAL	BALL			SQUARE	PLASTIC/EPOXY	YES	3.3 V				1.8 V	85 Cel	-25 Cel	TIN SILVER COPPER		BOTTOM							CMOS								e1
88AP320-C0-BGR2C806-TN21	Marvell Technology	SoC	INDUSTRIAL	BALL			SQUARE	PLASTIC/EPOXY	YES	3.3 V				1.8 V	85 Cel	-25 Cel	TIN SILVER COPPER		BOTTOM							CMOS								e1
88AP320-C0-BGR2C806-TN31	Marvell Technology	SoC	INDUSTRIAL	BALL			SQUARE	PLASTIC/EPOXY	YES	3.3 V				1.8 V	85 Cel	-25 Cel			BOTTOM							CMOS
88SE9128B1-NAA2C000	Marvell Technology
910.80	Elmos Semiconductor Ag
AC5520/SLH3P	Intel			BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES		1.1,1.5,1.8	GRID ARRAY	BGA1295,36X36,40						BOTTOM										Other Microprocessor ICs	1 mm	S-PBGA-B1295		Not Qualified
AF82801IEM/SLB8P	Intel			BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES		1.05,1.5,3.3,5	GRID ARRAY	BGA676,29X29,40						BOTTOM								308 mA		Other Microprocessor ICs	1 mm	S-PBGA-B676		Not Qualified
AF82801JD/SLG8T	Intel			BALL	676	BGA	SQUARE	PLASTIC	YES		1.1,1.5,3.3,5	GRID ARRAY	BGA676,30X30,40						BOTTOM							CMOS			Other uPs/uCs/Peripheral ICs	1 mm	S-PBGA-B676		Not Qualified
AGFB014R24B2E2V	Intel	SoC FPGA
AT5654H	Aimtron Technology
BCM5328MA1KQM	Broadcom
BD82HM55SLGZS	Intel	MICROPROCESSOR CIRCUIT		UNSPECIFIED	1071	BGA	RECTANGULAR	UNSPECIFIED	YES		1.05,1.5,1.8,3.3,5	GRID ARRAY	BGA1071(UNSPEC)						UNSPECIFIED							CMOS			Bus Controllers				Not Qualified

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.