Other Function uPs,uCs & Peripheral ICs

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	ADC Channels	Ultraviolet Erasable	Terminal Position	Maximum Seated Height	ROM Words	Width	Additional Features	External Data Bus Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	ROM Programmability	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code
EFR32MG1V132F256GM32-C0R	Silicon Labs	SoC		NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.85 V	85 Cel		-40 Cel				QUAD	.9 mm		5 mm					5 mm		CMOS		3.3 V				.5 mm	S-XQCC-N32
EFR32MG1V132F256GM48-C0	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	1.85 V	85 Cel		-40 Cel				QUAD	.9 mm		7 mm					7 mm		CMOS		3.3 V				.5 mm	S-XQCC-N48
GE209HISJ23HM	Advanced Micro Devices	MICROPROCESSOR CIRCUIT		BALL		BGA	SQUARE	PLASTIC/EPOXY	YES					GRID ARRAY									BOTTOM										CMOS							S-PBGA-B
GE210JIHJ23HM	Advanced Micro Devices	MICROPROCESSOR CIRCUIT		BALL		BGA	SQUARE	PLASTIC/EPOXY	YES					GRID ARRAY									BOTTOM										CMOS							S-PBGA-B
GE224PIXJ23JB	Advanced Micro Devices	MICROPROCESSOR CIRCUIT					UNSPECIFIED	UNSPECIFIED																									CMOS
GE412HIYJ44JB	Advanced Micro Devices	MICROPROCESSOR CIRCUIT					UNSPECIFIED	UNSPECIFIED																									CMOS
GE415GIBJ44HM	Advanced Micro Devices	MICROPROCESSOR CIRCUIT		BALL		BGA	SQUARE	PLASTIC/EPOXY	YES					GRID ARRAY									BOTTOM										CMOS							S-PBGA-B
GE420CIAJ44HM	Advanced Micro Devices	MICROPROCESSOR CIRCUIT		BALL		BGA	SQUARE	PLASTIC/EPOXY	YES					GRID ARRAY									BOTTOM										CMOS							S-PBGA-B
HSA2-040SCA/A2320A	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	28		RECTANGULAR	PLASTIC/EPOXY	YES	3.465 V						3.135 V	85 Cel		-40 Cel	MATTE TIN			DUAL							250			CMOS		3.3 V					R-PDSO-G28	1			e3
HSA2-040SCA/A2324TR	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.465 V				SMALL OUTLINE		3.135 V	85 Cel		-40 Cel	Matte Tin (Sn)			DUAL							250			CMOS		3.3 V					R-PDSO-G28	1			e3
LH7A404N0F000B3	NXP Semiconductors		INDUSTRIAL	BALL	324	FBGA	SQUARE	CERAMIC	YES				1.8,3.3	GRID ARRAY, FINE PITCH	BGA324,20X20,32		85 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM						30	260						Other uPs/uCs/Peripheral ICs			.8 mm	S-XBGA-B324	3	Not Qualified		e1
M1A3PE3000L-FGG896	Microchip Technology	SoC																		TIN SILVER COPPER									30	245											3
M82710-14	Mindspeed Technologies	MICROPROCESSOR CIRCUIT	OTHER	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES					GRID ARRAY			110 Cel		-25 Cel				BOTTOM										CMOS							R-PBGA-B484
MC68302CAG16VC	NXP Semiconductors		INDUSTRIAL	GULL WING	144	QFP	SQUARE	CERAMIC	YES				5	FLATPACK	QFP144,.87SQ,20		85 Cel		-40 Cel	TIN			QUAD						40	260			CMOS		5 V	Other uPs/uCs/Peripheral ICs			.5 mm	S-XQFP-G144	3	Not Qualified		e3
MCIMX257DJM4A	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.52 V			1.2/1.5,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.38 V	70 Cel		-20 Cel	TIN SILVER COPPER			BOTTOM	1.6 mm		17 mm	ALSO REQUIRES 3.3 V I/O SUPPLY		40	260	17 mm		CMOS		1.45 V	Microprocessors			.8 mm	S-PBGA-B400	3	Not Qualified		e1
MCIMX258CJM4A	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.52 V			1.2/1.5,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.38 V	85 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM	1.6 mm		17 mm	ALSO REQUIRES 3.3 V I/O SUPPLY		40	260	17 mm		CMOS		1.45 V	Microprocessors			.8 mm	S-PBGA-B400	3	Not Qualified		e1
MCIMX283CVM4CR2	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	85 Cel		-40 Cel				BOTTOM	1.37 mm		14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V		40	260	14 mm		CMOS		1.45 V				.8 mm	S-PBGA-B289	3
MCIMX285AVM4B	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V	AEC-Q100		1.4,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	85 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM	1.37 mm		14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V		40	260	14 mm		CMOS		1.45 V	Microprocessors			.8 mm	S-PBGA-B289	3	Not Qualified		e1
MCIMX503CVM8B	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.275 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.175 V	70 Cel		0 Cel	TIN SILVER COPPER			BOTTOM	1.6 mm		17 mm	ALSO OPERATES AT 0.9 V MINIMUM SUPPLY 24 MHZ		40	260	17 mm		CMOS		1.225 V				.8 mm	S-PBGA-B400	3	Not Qualified		e1
MCIMX508CVK8B	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	416	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.275 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA416,24X24,20	1.175 V	70 Cel		0 Cel	TIN SILVER COPPER			BOTTOM	1.52 mm		13 mm	ALSO OPERATES AT 0.9 V MINIMUM SUPPLY 24 MHZ		40	260	13 mm		CMOS		1.225 V				.5 mm	S-PBGA-B416	3	Not Qualified		e1
MCIMX512CJM6C	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V			1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	.95 V	85 Cel		-20 Cel	TIN SILVER COPPER			BOTTOM	1.6 mm		19 mm			40	260	19 mm		CMOS		1 V	Graphics Processors			.8 mm	S-PBGA-B529	3	Not Qualified		e1
MCIMX512DJM8C	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel		-20 Cel	TIN SILVER COPPER			BOTTOM	1.6 mm		19 mm			40	260	19 mm		CMOS		1.1 V	Graphics Processors			.8 mm	S-PBGA-B529	3	Not Qualified		e1
MCIMX6D5EYM10AC	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.35 V	105 Cel		-20 Cel	TIN SILVER COPPER			BOTTOM	1.6 mm		21 mm	24MHZ NOMINAL FREQ AVAILABLE		40	260	21 mm		CMOS						.8 mm	S-PBGA-B624	3			e1
MCIMX6D6AVT10AD	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, FINE PITCH		1.35 V	125 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM	2.16 mm		21 mm	24MHZ NOMINAL EXTERNAL FREQUENCY AVAILABLE		40	260	21 mm		CMOS						.8 mm	S-PBGA-B624	3			e1
MCIMX6D6AVT10AER	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM	2.16 mm		21 mm			40	260	21 mm		CMOS		1.4 V				.8 mm	S-PBGA-B624	3			e1
MCIMX6D7CZK08AD	NXP Semiconductors	SoC	INDUSTRIAL	BALL	569	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA569,29X29,16	1.275 V	105 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM	1.25 mm		12 mm			40	260	12 mm		CMOS		1.4 V				.4 mm	S-PBGA-B569	3			e1
MCIMX6Q4AVT10AE	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel		-40 Cel				BOTTOM	2.16 mm		21 mm			40	260	21 mm		CMOS						.8 mm	S-PBGA-B624	3
MCIMX6Q7CZK08AD	NXP Semiconductors	SoC	INDUSTRIAL	BALL	569	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA569,29X29,16	1.275 V	105 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM	1.25 mm		12 mm			40	260	12 mm		CMOS		1.4 V				.4 mm	S-PBGA-B569	3			e1
MCIMX6S5EVM10AD	NXP Semiconductors	SoC	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	105 Cel		-20 Cel	TIN SILVER COPPER			BOTTOM	1.6 mm		21 mm			40	260	21 mm		CMOS						.8 mm	S-PBGA-B624	3			e1
MEC1418-I/SZ	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	144	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2 V	85 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM	.8 mm		9 mm					9 mm		CMOS		3 V				.65 mm	S-PBGA-B144				e1
MEC1705Q-C2-I/SZ	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	144	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.89 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.71 V	85 Cel		-40 Cel				BOTTOM	.8 mm		9 mm	ALSO OPERATES AT 3.3V NOMINAL SUPPLY VOLTAGE				9 mm		CMOS		1.8 V				.65 mm	S-PBGA-B144
NJM3770AFM2-TE3	New Japan Radio
RF430F5978IRGCR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		32	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	2 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD			QUAD	1 mm	32768	9 mm		0	30	260	9 mm	4096	CMOS	5.1 mA	3 V	Microcontrollers	FLASH	I2C; SPI; UART	.5 mm	S-PQCC-N64	3	Not Qualified	20 rpm	e4
RTL8309SB-LF	Realtek Semiconductor
SC1100UFH-266	National Semiconductor			BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES				1.9,3.3	GRID ARRAY	BGA388,26X26,50					TIN LEAD			BOTTOM						30	220						Other Microprocessor ICs			1.27 mm	S-PBGA-B388	3	Not Qualified		e0
SCH3106-NU	Microchip Technology	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	128	TFQFP	SQUARE	PLASTIC/EPOXY	YES	3.63 V				FLATPACK, THIN PROFILE, FINE PITCH		2.97 V	70 Cel		0 Cel	MATTE TIN			QUAD	1.2 mm		14 mm					14 mm		CMOS		3.3 V				.4 mm	S-PQFP-G128				e3
SFR4310E1MAE40	NXP Semiconductors		AUTOMOTIVE	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES				2.5,3.3	FLATPACK	QFP64,.47SQ,20		125 Cel		-40 Cel	TIN			QUAD						40	260			CMOS			Other uPs/uCs/Peripheral ICs			.5 mm	S-PQFP-G64	3	Not Qualified		e3
SG51KC	Seiko Epson
SN74LS783N	Motorola	MICROPROCESSOR CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.25 V			5	IN-LINE	DIP40,.6	4.75 V	75 Cel		0 Cel	TIN LEAD			DUAL	5.08 mm		15.24 mm					52.07 mm		BIPOLAR	230 mA	5 V	Memory Controllers			2.54 mm	R-PDIP-T40		Not Qualified		e0
T1014ME3PQA	Teledyne E2v (Uk)	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V				GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	125 Cel		-55 Cel				BOTTOM	2.07 mm		23 mm					23 mm		CMOS		1 V				.8 mm	S-PBGA-B780
T1024NXE7PQA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V				GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM	2.07 mm		23 mm			30	250	23 mm		CMOS		1 V				.8 mm	S-PBGA-B780	3			e1
UCD3138ARJAR	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3 V	125 Cel		-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	YES		QUAD	1 mm		6 mm			30	260	6 mm		CMOS		3.3 V				.5 mm	S-PQCC-N40	2			e4
XA7Z010-1CLG225Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100		1,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32		125 Cel		-40 Cel	TIN SILVER COPPER		N	BOTTOM	1.5 mm		13 mm					13 mm		CMOS			Other uPs/uCs/Peripheral ICs			.8 mm	S-PBGA-B225	3	Not Qualified		e1
XCZU15EG-1FFVB1156E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)			BOTTOM						30	245			CMOS		.85 V					R-PBGA-B1156	4			e1
XCZU3EG-1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)			BOTTOM						30	250			CMOS		.85 V					R-PBGA-B625	4			e1
XCZU6CG-1FFVC900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)			BOTTOM						30	245			CMOS		.85 V					R-PBGA-B900	4			e1
XCZU9EG-1FFVC900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)			BOTTOM						30	245			CMOS		.85 V					R-PBGA-B900	4			e1
XQ7Z100-1RF900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES					GRID ARRAY			100 Cel		-40 Cel				BOTTOM	3.44 mm		31 mm			NOT SPECIFIED	NOT SPECIFIED	31 mm		CMOS						1 mm	S-PBGA-B900

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.