National Semiconductor - SC1100UFH-266

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SC1100UFH-266 by National Semiconductor

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Manufacturer National Semiconductor
Manufacturer's Part Number SC1100UFH-266
Description Other uPs/uCs/Peripheral ICs; Terminal Form: BALL; No. of Terminals: 388; Package Code: BGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;
Datasheet SC1100UFH-266 Datasheet
In Stock103
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Time At Peak Reflow Temperature (s): 30
Sub-Category: Other Microprocessor ICs
Surface Mount: YES
Terminal Finish: TIN LEAD
JESD-609 Code: e0
No. of Terminals: 388
Qualification: Not Qualified
Package Equivalence Code: BGA388,26X26,50
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
JESD-30 Code: S-PBGA-B388
Package Shape: SQUARE
Terminal Form: BALL
Peak Reflow Temperature (C): 220
Package Code: BGA
Terminal Pitch: 1.27 mm
Power Supplies (V): 1.9,3.3
Moisture Sensitivity Level (MSL): 3
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